PLATING Search Results

Contextual Info: CO NOTES: 1 .MATERIAL: HOUSiNG : THERMOPLASTIC CONTACT : COPPER ALLOY. SHELL : COPPER ALLOY. CD O O + ü 15.2 0 1 4.50 2 .FINISH: CONTACT: GOLD PLATING SEE TABLE ON CONTACT AREA TIN-LEAD ON SOLDER TAILS. NICKEL UNDERPLATED OVER ALL SHELL: NICKEL PLATING OVER COPPER.

Contextual Info: 7 T H IS DRAW ING COPYRIGHT IS U N P U B L IS H E D . - R E LEA S E D BY TYCO ELECTRONICS CORPORATION. ALL FOR 6 5 PU B LIC ATIO N RIG HTS R E S ER V ED . D SEE TABLE C 100 0 ,006(s) -e .040 + .003 DIA TYP RECOMMENDED HOLE SIZE BEEORE PLATING 0.O452 + .OO1O TYP

ka band high power fet amplifier schematic

Contextual Info: 0.25-µm mmW pHEMT 2MI Process Data Sheet 4.6 µm PLATING CAP TOP PLATE 2000 Å NITRIDE 0.75 µm FIRST METAL TaN RESISTOR T-GATE ACTIVE REGION OHMIC METAL EXCEPT VIA SEMI-INSULATING GaAs SUBSTRATE VIA UNDER CAP 0.25-µm 2MI Process Cross Section General Description

Contextual Info: CSD19535KCS www.ti.com SLPS484 – JANUARY 2014 CSD19535KCS, 100 V N-Channel NexFET Power MOSFET Check for Samples: CSD19535KCS FEATURES 1 • • • • • • • 2 Ultra-Low Qg and Qgd Low Thermal Resistance Avalanche Rated Pb-Free Terminal Plating

PR 302

Abstract: D3601-1 A384
Contextual Info: Pomona Model 3601 Die Cast Aluminum Box Painted, Size “D” MATERIALS: Screws: 4 each #4-40 x 6.35 1/4” Phillips pan head pr MS 35206-213 with blue zinc plating. Cover: 1.60 (.063) thick aluminum Alloy 1100-H14 Finish: Clear anodized per MIL-A-8625,

M0139-01

Abstract: M0137-02 P0093-01
Contextual Info: CSD16410Q5A www.ti.com SLPS205A – AUGUST 2009 – REVISED MAY 2010 N-Channel NexFET Power MOSFETs Check for Samples: CSD16410Q5A FEATURES 1 • • • • • • • 2 Ultra Low Qg and Qgd Low Thermal Resistance Avalanche Rated Pb Free Terminal Plating

Contextual Info: Product Number: 855-22-006-30-001101 Description: Interconnect Header Spring-Loaded Header Vertical Mount Double Row Surface Mount Plating Code: 22 Shell Plating: 20 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins Mill-Max Part Number

smd diode marking 271

Abstract: SIPMOS N-channel Small-Signal-Transistor
Contextual Info: BSP89 Rev. 2.1 SIPMOS Ò Small-Signal-Transistor Feature Product Summary • N-Channel VDS RDS on · Enhancement mode ID · Logic Level 240 V 6 W 0.35 A PG-SOT223 · dv/dt rated • Pb-free lead plating; RoHS compliant 4.5V rated lead plating; RoHS compliant

MIL-C-15328

Abstract: D2401
Contextual Info: Pomona Model 2401 Size A Aluminum Box With Cover BNC TEE F-F-M MATERIALS: Connector: BNC M and BNC (F) Body: Tarnish Resistant Plating, Center Contact: Female - Gold Plated Beryllium Copper, Male – Gold Plated Brass Solder Turret Terminal Screws: Steel

Contextual Info: 30 Amp Ultrafast Rectifier UFRG30120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry

marking code 8A

Abstract: marking WM EN6100-4
Contextual Info: LESHAN RADIO COMPANY, LTD. LGSMF05CT1G Thyristor Surge Protective Devices MECHANICAL CHARACTERISTICS Features z z z z z z z Molded JEDEC SOT-563 Package Weight 3 milligrams Availble in Lead-Free Nickel-Paladium-Gold Plating Solder Reflow Temperature: Nicker-Paladium-Gold

Contextual Info: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 6 5 4 3 2 RELEASED FOR PUBLICATION LOC 1 REVISIONS DIST ALL RIGHTS RESERVED. P L SIGNAL CONTACT TYP REF 10.80 LTR DESCRIPTION DATE DWN APVD 10 TYP D D 2.5 TYP 1.25 TYP M CONTACT AREA TYP REF GOLD PLATING THIS SIDE ONLY

Contextual Info: Product Number: 801-43-006-10-012000 Description: Interconnect Socket .100 Grid; Straight Socket Low Profile Single Row Through Hole Accepts .025-.037 .025 sq post Leads Plating Code: 43 Shell Plating: 200 " Tin matte finish over 100 μ" Nickel Inner Contact Plating:

1-163082-0

Abstract: 1-163081-1 108-10042
Contextual Info: 4 RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. C 3 1 2011 LOC REVISIONS DIST B ALL RIGHTS RESERVED. - COPYRIGHT 2011 2 - P LTR DESCRIPTION AY DATE ECR-12-010700 DWN MJG 11/06/12 APVD JB 31.5 SPRING PIN BODY SEE TABLE D B 9 D A PLATING ZONES ZONE 3

W1206R

Abstract: PCF-W1206LF W0805LF PCF04 PCF0402 JIS-C-5202-5
Contextual Info: Precision Thin Film Nichrome Chip Resistor PCF Series IRC Advanced Film Division Solder or Matte tin Plating • TCR to ±5 ppm/°C • Tolerances to ±0.01% • Wide ohmic range 1 to 2.0M Glass • Available in seven industry standard sizes • Both RoHS compliant Pb-free terminations and Sn/Pb terminations

Contextual Info: SMD-FST Non resettable fuses www.schurter.com/pg01_2 Surface Mount Fuse, 5 x 20 mm, Time-Lag T, L, 250 VAC, Au plating IEC 60127-2 • 250 VAC · Time-Lag T Description - Directly solderable on printed circuit boards - L = Low Breaking Capacity - For rated current 1 A to 16 A, SMD-SPT is recommended

Contextual Info: Product Number: 917-43-104-41-005000 Description: Transistor Socket Solder Tail Through Hole Accepts .015-.025" Leads Plating Code: 43 Shell Plating: 200 " Tin matte finish over 100 μ" Nickel Inner Contact Plating: 30 μ" Gold over 50 μ" Nickel

Contextual Info: CSD18504Q5A www.ti.com SLPS366 – JUNE 2012 40V N-Channel NexFET Power MOSFETs Check for Samples: CSD18504Q5A FEATURES 1 • • • • • • • • 2 PRODUCT SUMMARY Ultra Low Qg and Qgd Low Thermal Resistance Avalanche Rated Logic Level Pb Free Terminal Plating

BHD-C1-XX-RA-XX

Contextual Info: 1 2 3 4 5 6 7 SPECIFICATIONS Contact Material: Insulator Material: Contact Plating: Contact Resistance: Insulator Resistance: Current Rating: Withstanding: Operating Temp: A B Poles 12 14 16 18 20 24 26 28 30 32 34 36 40 42 44 46 48 50 60 64 Brass NY6T UL94V-0

Contextual Info: RQ3E130MN Nch 30V 13A Power MOSFET Datasheet lOutline VDSS 30V RDS on at 10V (Max.) 8.1mW RDS(on) at 4.5V (Max.) 11.6mW ID 13A PD 2.0W lFeatures HSMT8 lInner circuit 1) Low on - resistance. 3) Pb-free lead plating ; RoHS compliant (1) Source (2) Source (3) Source

Contextual Info: THIS COPY IS PROVIDED ON A RESTRICTED BASIS AND IS NOT TO BE USED IN ANY WAY DETRIMENTAL TO THE INTERESTS OF PANDUIT CORP. d b NOTES: LCMB 25-10 25r/16f F CERTIFIED LISTED Wire Connector 1. Material: High conductivity seamless copper tube. 2. Plating: Parts are annealed and tin plated.

CFPC-050-AE3-XX-RB-XX

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B SPECIFICATIONS Operating Voltage: Current Rating: Contact Resistance: Insulation Resistance: Housing: Lock: Solder: Terminal: Plating: Withstanding: Operating Temp: C B 100V AC Max. 0.5Amp Max. 30mΩ Max. 500MΩ Min. PA66 UL94V-0

CTJ-8-08-H-BK-PX-XX

Contextual Info: 1 2 3 4 5 6 7 8 9 SPECIFICATIONS Housing material: PBT with glass fiber, UL94V-0 Contact material: Phosphor bronze 0.35mm Contact plating: Gold on contact area Tin on tails A A Conforms to FCC rules and regulations Part 68, Subpart F B B C C D D E E Series

CTJ-8-08-3030-BK-PX-FS

Contextual Info: 1 2 3 4 5 6 7 8 9 A A SPECIFICATIONS Plastic Housing: Contacts: Plating: B Shield: Thermoplastic UL94V-0 .35mm Phosphor Bronze Gold over Nickel in contact Tin over Nickel in solder Brass w/ Nickel Plating B C C D D E E Series CTJ Modular phone jack F Position