PLASTICS CARD MATERIAL Search Results

CAD-0601-262

Abstract: amphenol sim block
Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under

Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,gold flash at solder tail and 1.27-2.54 micronnickel under plated.

amphenol sim block

Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under

amphenol sim block

Abstract: SIM BLOCK
Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under

sim block

Abstract: amphenol sim block
Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under

Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Copper Alloy Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,gold flash at solder tail and 1.27-2.54 micronnickel under plated.

Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Copper Alloy Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,gold flash at solder tail and 1.27-2.54 micronnickel under plated.

CAD-0601-302

Abstract: CAD0601302 amphenol sim block
Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under

amphenol sim block

Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under

amphenol sim block

Abstract: SIM BLOCK
Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under

amphenol sim block

Abstract: SIM BLOCK
Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under

amphenol sim block

Abstract: sim block
Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under

SIM BLOCK amphenol

Abstract: amphenol sim block SIM BLOCK
Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under

Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.

CAD06W1292

Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.

Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.

CAD06W2272

Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.

Contextual Info: • E A ’ -y ?3 Ü 4 - - X < 7 X T - ’ -y ? C ase No. E-pack S tic k Packag e ^ - X No. Case No. E -j V E-pack type it f ê u - K Order code 4 10 1 rSA^hy/TR ubber end cap ■JXT'f 7 ? Ui *JpD = Dimensions D e vice Stick 6.0 3.0 0.6 "3 31 t i ft Material

Contextual Info: tam m m y — Standard Package for Automated Assembly Tape and Reeled Package E /\°'y 7,0 91^4 7. Case No. E-pack Device V R33 ¿250) / U - ; u R33 (¿330) Reel size ¿250(EIAJ R 33)/R eel size ¿330(EIAJ R33) ^ - X No. Case No. E '* 'y 7 E-pack type Ü 3 - K

corrugated carton

Abstract: corrugated SHEET carton box 0805-T
Contextual Info: Formosa MS Case No. 0805 Device Case No. 0805 Order code 0805-T 0.1 2 2 0.1 1.5 1.75 4.0 Index hole Taping 0.3 8 5.6 0.1 2.75 3.5 Dimensions 0.22 0.1 1.1 4.0 0.1 0.1 Material : Plastics Standard capacity : 3,000pcs / reel Quantity 13 o 0.5 12 0.5 Dimensions

shindengen m

Abstract: N39N ba41-01 shindengen 2f 45 2SB 407
Contextual Info: « m 15. 1— m ta m m m b f ^ •y Stan d ard Pa ck a g e fo r A u to m ated A sse m b ly Tape and Reeled Package A xial Taping Radial Taping 64 SHINDENGEN S tR R H M FS t ' r - Z i D T - ’s H X ' -;UR15 t 178) /') -;UR25( f 330) Reel size i 178{EIAJ R15) /Reel size i 330(E1AJ R25)

corrugated carton

Abstract: corrugated
Contextual Info: Formosa MS Case No. SMA Device SMA Case No. SMA-W SMA-T 0.1 1.5 2 2 0.1 4.0 1.75 Index hole 4.85 5.5 Dimensions 0.23 0.1 Taping 12 9.5 0.1 0.3 Order code 2.0 4.0 0.1 0.1 Material : Plastics Standard capacity : 5,000pcs / reel 13 o 0.5 12 0.5 75 2 Standard capacity : 2,000pcs / reel

JIS C 0806-1

Contextual Info: mmmm Standard Package for Automated Assembly 'J - l R33 ¿250) / ' J - J l r R33 (¿330) Case No. E-pack Device Reel size ¿250 (El A J R 3 3 )/R e e l size ¿330 (El A J R33) y - X No. C ase No. E '* 7 9 E-pack type ft« 3 - K O rd e r code 4 0 7 1 4 0 6 1

MELF

Abstract: MELF dimensions melf diode MELF Package plastics material datasheet PLASTICS CARD MATERIAL
Contextual Info: Formosa MS Case No. MELF Device Case No. MELF Order code MELF 0.1 2 2 0.1 1.5 1.75 4.0 Index hole Taping 12 9.5 0.1 0.3 4.85 5.5 Dimensions 0.2 0.1 2.7 4.0 0.1 0.1 Material : Plastics Quantity 12 13 o 2 0.5 Dimensions 330 80 2 0.5 Standard capacity : 5,000pcs / reel