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PK478 Datasheets Context Search
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Contextual Info: 100% Material Declaration Data Sheet FF1923 PK478 v1.1 September 28, 2012 Average Weight: 28.3394 g Component Silicon Die (FPGA) Substance Description Doped silicon CAS Number or Description 7440-21-3 Percentage of Component 100.00 Solder Bump Use in Product |
Original |
FF1923 PK478 |