PIN FIN HEAT SINK Search Results

624-25AB

Abstract: IN625
Contextual Info: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for 21mm BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Adhesive Options

BGA 64 PACKAGE thermal resistance

Abstract: BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB
Contextual Info: Thermal Management Solutions for BGAs PENGUIN COOLERS: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight

Contextual Info: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 625 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs Base Dimensions in. Sq. 625-25AB .984 25 625-35AB .984 (25) 625-45AB .984 (25) 625-60AB .984 (25) Material: Aluminum, Black Anodized Fin Height

Contextual Info: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight lbs. (grams) 624-25AB 624-35AB 624-45AB 624-60AB .827 (21)

637-10ABEP

Abstract: 677-15ABEP 677-20ABEP 657-10ABEPN 657-10ABEP 657-20ABEPSC do-5 package MATERIAL 667-15ABESP weight TO66 66720
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Without Pin Plain Pin 634-10AB 634-10ABEP 634-15AB 634-15ABEP 634-20AB 634-20ABEP Material: Aluminum, Black Anodized.

680-125220

Abstract: 603K 637-10ABP 637-15ABP 680-5K 657-10ABPSC 627-15ABP 635-75B2
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin Without Pin 634-10ABP ̆ 634-10AB 634-15ABP 634-15AB 634-20ABP ̆ 634-20AB Material: Aluminum, Black Anodized.

thermal management

Abstract: MF251 SF4217 CPF2525
Contextual Info: How Air Velocity Affects The Thermal Performance of Heat Sinks: A Comparison of Straight Fin, Pin Fin and maxiFLOWTM Architectures Introduction A device’s temperature affects its op- Air, Ta erational performance and lifetime. To achieve a desired device temperature,

Contextual Info: Advanced Thermal Solutions, Inc. How Air Velocity Affects The Thermal Performance of Heat Sinks: A Comparison of Straight Fin, Pin Fin and maxiFLOWTM Architectures Introduction A device’s temperature affects its op- Air, Ta erational performance and lifetime. To

637-15ABP

Abstract: TO-220 footprint 637-20ABP 15AB 637-10ABP 634-15ABP 634-10AB
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin Without Pin 634-10AB 634-10ABP ̆ 634-15ABP 634-15AB 634-20ABP ̆ 634-20AB Material: Aluminum, Black Anodized.

Contextual Info: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin Without Pin 634-10ABEP 634-10AB 634-15ABEP 634-15AB 634-20ABEP 634-20AB Material: Aluminum, Black Anodized. Height Above PC Board

80486DX

Abstract: AMD 80486DX AM486TMdx4 helium gas sensor module 80486DX2 AM29030 AM486 heat sink Heat Sinks 80486DX intel
Contextual Info: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs 662 SERIES Pin Fin Heat Sink for Limited Height Applications for Intel 80486DX, AMD AM29030 17 x 17 PGA Standard P/N Base Dimensions in. mm Height in. (mm) Heat Sink

Contextual Info: 901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vette’s 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more! These heat sinks are designed for air flow applications. Enclosed pages

Contextual Info: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 628 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs Base Dimensions in. mm Dimensions “A” in. (mm) Typical Applications Heat Sink Finish Weight lbs. (grams) 628-20AB 1.750 (44.5) x 1.700 (43.2)

61995AB124D1

Contextual Info: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs Pin Fin Heat Sink/Clip Assembly for PowerPC™ 601, 604 304 C4QFP, 255 CBGA 609 SERIES Standard P/N 609-50AB 609-100AB 40mm C4QFP 21mm CBGA Base Dimensions in. (mm

3-040405U

Contextual Info: 0.40” X 0.40” U TYPE MODERATE PIN CONFIGURATION Moderately Configured Aluminum Pin Fin Heat Sinks • Designed for airspeed environments ranging from 0 to 800 LFM • Generate exceptional cooling power • Possess low pressure drop characteristics •

Contextual Info: 0.27” X 0.27” U TYPE MODERATE PIN CONFIGURATION Moderately Configured Aluminum Pin Fin Heat Sinks • Designed for airspeed environments ranging from 0 to 800 LFM • Generate exceptional cooling power • Possess low pressure drop characteristics •

D1065

Abstract: CX486slc D20850-40 Cyrix CX486slc 486DX2 DIMENSIONS pqfp 100 D10650 D10650-40 heat sink D1085
Contextual Info: Integrated Circuit Heat Sinks DELTEM COMPOSITE HEAT SINKS FOR PQFPs, CQFPs, AND BGAs Deltem™ D10650-40 Pin Fin Heat Sink for 100-Lead PQFPs, 169 BGA Standard P/N D10650-40 ̆ 84, 100 PQFP, 169 BGA Base Dimensions in. mm Height in. (mm) Weight lbs. (grams)

Contextual Info: S O L U T IO N S Datasheet Omnidirectional Pin Fin Heat Sink for BGAs 625 SERIES Standard P/N Fin Height “ A” in. mm Base Dimensions in . Sq. .984 .984 .984 .984 625-25AB 625-35AB 625-45AB 625-60AB (25) (25) (25) (25) 0.250 (6.4) 0.350 (8.9) 0.450 (11.4)

Contextual Info: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 658 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC Base Dimensions in. mm Dimension “A” in. (mm) 658-25AB 1.100 (27.9) sq 0.250 (6.4) 658-35AB 1.100 (27.9) sq 0.350 (8.9)

Contextual Info: HRW2502B-Silicon Schottky Barrier Diode for Rectifying Features Pin Arrangement • Low forward voltage drop and suitable for high effifiency rectifying. • Full molded fin enables easy insulation from heat sink. Ordering Information Type No. Laser Mark

3-101004M

Contextual Info: 1.00” X 1.00” M TYPE SPARSE PIN CONFIGURATION Sparsely Configured Aluminum Pin Fin Heat Sinks • Designed for airspeed environments ranging from 0 to 200 LFM • Generate exceptional cooling power • Possess low pressure drop characteristics • Forged from highly conductive pure aluminum

Contextual Info: 0.50” X 0.50” M TYPE SPARSE PIN CONFIGURATION Sparsely Configured Aluminum Pin Fin Heat Sinks • Designed for airspeed environments ranging from 0 to 200 LFM • Generate exceptional cooling power • Possess low pressure drop characteristics • Forged from highly conductive pure aluminum

W1002

Contextual Info: HRW1002B-Silicon Schottky Barrier Diode for Rectifying Features Pin Arrangement • Low forward voltage drop and suitable for high effifiency rectifying. • Full molded fin enables easy insulation from heat sink. 1 2 3 Ordering Information Type No.

1.3960

Abstract: 3-505025G
Contextual Info: 5.00” X 5.00” G TYPE FLARED PIN CONFIGURATION 6.5 MAX. Flared Aluminum Pin Fin Heat Sinks • • • • • • • • • 5.00 Designed for natural convection cooling Generate exceptional cooling power Forged from highly conductive aluminum Lapped to achieve exceptional base surface finish