PHILIPS PACKAGE INFORMATION Search Results

8048-based 8-bit microcontrollers

Abstract: 8048 MSA263 8-Bit Microcontrollers 8048 BASED 8048 pin details "8-Bit Microcontrollers" SO24L VSO40 "8048"
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package information 8048-based 8-bit Microcontrollers June 1994 Philips Semiconductors Philips Semiconductors 8048-based 8-bit Microcontrollers Package information PACKAGE OUTLINES 15.80 15.24 seating plane 36.0 35.0 handbook, full pagewidth

74HC9046

Abstract: 74HCT4050 74hct7014 74HCT4049 74HC7541 74hct133 74HC9046A 74HC90 74HCT4059 74HC5555
Contextual Info: INTEGRATED CIRCUITS Package information Supersedes data of 2001 Nov 02 File under Integrated Circuits, IC06 Philips Semiconductors 2002 Aug 08 Philips Semiconductors Package information PACKAGE INFORMATION PART NUMBER DIL N SO (D) SSOP (DB) TSSOP (PW) PIN COUNT

Contextual Info: Philips Semiconductors Military Products Military and Special Products Data Handbook Packaging Information PHILIPS SEMICONDUCTORS STANDARD PACKAGE DESCRIPTIONS All Military package case outlines and physical dimen­ sions conform with the current revision MIL STD-1835,

PLCC28 package

Abstract: SO16 package SOT27-1 DIP14 PLCC20 package SSOP20 DIP20 PLCC20 SO20 SO24 SSOP24
Contextual Info: Philips Semiconductors Section 4 Package Information FAST TTL Logic Series CONTENTS Package Information Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contextual Info: IN TEG R A TED CIR C U ITS Preliminary specification 1996 Aug 15 IC20 Data Handbook Philips Semiconductors PHILIPS PHILIPS Philips Semiconductors Preliminary specification CMOS single-chip 8-bit microcontrollers 83C576/87C576 FEATURES • OTP package available

car ignition

Abstract: diode Cathode indicated by blue band automotive ignition car Stability Cathode indicated by blue band BYX134GPS SF6 gas sod118
Contextual Info: DISCRETE SEMICONDUCTORS Philips Sem iconductors PHILIPS Philips Semiconductors Product specification High-voltage car ignition diode BYX134GPS FEATURES DESCRIPTION • G lass passivated Rugged glass package, using a high tem perature alloyed construction.

iz c220 zener diode

Abstract: iz c220 philips zener diode c24 "Voltage Regulator Diodes" diode SMA marking code 14 BZG01 C100 C110 C120 C130
Contextual Info: DISCRETE SEMICONDUCTORS Philips Semiconductors PHILIPS Philips Semiconductors Product specification SMA voltage regulator diodes BZG01 series FEATURES DESCRIPTION • Glass passivated DO-214AC surface mountable package with glass passivated chip. • High maximum operating temperature

MF0 IC U1X

Abstract: philips 22c Specification FCP2 Flip Chip Package SOT732CA2 12NC ordering code philips MF0ICU10
Contextual Info: INTEGRATED CIRCUITS ADDENDUM MF0 FCP2 U1 Flip Chip Package Specification Product Specification Revision 3.0 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.0 October 2004 Flip Chip Package Specification MF0 FCP2 U1

diode S1J

Abstract: S1m diode SMA MARKING S1J MARKING S1J S1J Diode diode s1m sma DIODE S1M DO-214AC SMA MARKING S1G SMA MARKING S1d diode S1B DO214AC
Contextual Info: DISCRETE SEMICONDUCTORS Philips Semiconductors PHILIPS Philips Semiconductors Product specification SMA controlled avalanche rectifiers S1 series FEATURES DESCRIPTION • Glass passivated DO-214AC surface mountable package with glass passivated chip. • High maximum operating temperature

Philips MF1 IC S50

Abstract: Philips Mifare 1 S50 mf1 s50 Mifare MF1 S50 Specification FCP2 Flip Chip Package FCP2 Philips Mifare 1 S50 specifications MF1 IC S50 mifare s50 mifare s50 MIFARE
Contextual Info: INTEGRATED CIRCUITS ADDENDUM MF1 FCP2 S50 Flip Chip Package Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.1 October 2004 Flip Chip Package Specification MF1 FCP2 S50

AN212

Abstract: 74F240 74F374 F374 D3318
Contextual Info: INTEGRATED CIRCUITS AN212 Package lead inductance considerations in high-speed applications 1987 Jun Philips Semiconductors Philips Semiconductors Application note Package lead inductance considerations in high-speed applications AN212 Authors: Stephen C. Hinkle, Jeffrey A. West

SOT353 footprint

Abstract: wave footprint so14 logic package Shortform IC and Component AN248 philips printed circuit board design SO14 Package philips Soldering guidelines wave footprint SMD 5PIN LOGIC GATE
Contextual Info: INTEGRATED CIRCUITS AN248 PicoGate Logic Package 1998 October Philips Semiconductors PicoGate Logic package AN248 Philips Semiconductors now offers the smallest single gate 5V logic family available, PicoGate Logic. Consisting of single gate functions packaged in a 5 pin SOT353 package, PicoGate Logic reduces

LG ai 0068

Abstract: sot162ag jedec Package TO-39
Contextual Info: Philips Semiconductors Objective specification Package information Package outlines PACKAGES Packages in ascending order of packages outline version PACKAGE OUTLINE VERSION CODE RENAMED PACKAGE VERSION CODE (NON­ STANDARD) PACKAGE NAME DESCRIPTION PAGE

Contextual Info: DISCRETE SEMICONDUCTORS Philips Semiconductors PHILIPS Philips Semiconductors Preliminary specification Voltage regulator double diodes PZM-NA series FEATURES PINNING • Total power dissipation: max. 220 mW per diode PIN DESCRIPTION • Small plastic package suitable for surface mounted

Contextual Info: Philips Semiconductors SGCtlOM 3 Package Information Advanced Low-power Schottky Devices ALS CONTENTS S old erin g .

automotive ignition

Abstract: BYX135GL
Contextual Info: DISCRETE SEMICONDUCTORS Philips Semiconductors PHILIPS Philips Semiconductors Product specification BYX135GL High-voltage car ignition diode FEATURES DESCRIPTION • G lass passivated Rugged glass package, using a high tem perature alloyed construction. • High m axim um operating tem perature

automotive ignition

Abstract: BYX133GL SOD119AB
Contextual Info: DISCRETE SEMICONDUCTORS Product specification Supersedes data of 1998 Dec 04 Philips Semiconductors 2000 Jan 13 PHILIPS Philips Semiconductors Product specification High-voltage car ignition diode BYX133GL FEATURES DESCRIPTION • G lass passivated Rugged glass package, using a high tem perature alloyed

ZD 607

Abstract: sot101b sot158a 0020A2
Contextual Info: INTEGRATED CIRCUITS DATA SHEET PACKAGE INFORMATION Page Index - DIP LQFP SIL SO SSOP SQFP TAB VSO - Soldering - Package outlines Package information 1995 Sep 06 File under Integrated Circuits, IC12 Philips Semiconductors Package information

80c751

Abstract: 1N24 CXA 1240 S87C751 80C51 83C751 87C751 8XC751 S87C751-1F24 S87C751-2F24
Contextual Info: Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 83C751/87C751 DESCRIPTION The Philips 83C751/87C751 offers the advantages of the 80C51 architecture in a small package and at low cost. The 8XC751 Microcontroller is fabricated with Philips high-density

pmfp

Abstract: SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1
Contextual Info: PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

DIP40

Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
Contextual Info: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)

CDIP14

Abstract: cdip28 SSOP20 300 mil MS-012AB MS-012AC SO20 sot73-1 sot94 150AH CDIP-14
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package outlines Package information January 1995 File under Integrated Circuits, IC04 Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm

87C750

Abstract: 80C51 P83C750EBA P83C750EBP P83C750EFA P83C750EFP P87C750EBF P87C750EFF SU00300 8XC750
Contextual Info: Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers DESCRIPTION 83C750/87C750 PIN CONFIGURATIONS The Philips 8XC750 offers the advantages of the 80C51 architecture in a small package and at low cost. The 8XC750 Microcontroller is fabricated with Philips high-density

CERQUAD

Abstract: G3 Package ROMless 80C51
Contextual Info: Philips Semiconductors Ordering Information XA PRODUCTS Example: P51XA G3 7 K B A Philips 80C51 eXtended Architecture Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) BD = Thin Quad Flat Pack (TQFP) FA = Hermetic Cerdip (window)