PHILIPS PACKAGE INFORMATION Search Results

8048-based 8-bit microcontrollers

Abstract: 8048 MSA263 8-Bit Microcontrollers 8048 BASED 8048 pin details "8-Bit Microcontrollers" SO24L VSO40 "8048"
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package information 8048-based 8-bit Microcontrollers June 1994 Philips Semiconductors Philips Semiconductors 8048-based 8-bit Microcontrollers Package information PACKAGE OUTLINES 15.80 15.24 seating plane 36.0 35.0 handbook, full pagewidth

74HC9046

Abstract: 74HCT4050 74hct7014 74HCT4049 74HC7541 74hct133 74HC9046A 74HC90 74HCT4059 74HC5555
Contextual Info: INTEGRATED CIRCUITS Package information Supersedes data of 2001 Nov 02 File under Integrated Circuits, IC06 Philips Semiconductors 2002 Aug 08 Philips Semiconductors Package information PACKAGE INFORMATION PART NUMBER DIL N SO (D) SSOP (DB) TSSOP (PW) PIN COUNT

PLCC28 package

Abstract: SO16 package SOT27-1 DIP14 PLCC20 package SSOP20 DIP20 PLCC20 SO20 SO24 SSOP24
Contextual Info: Philips Semiconductors Section 4 Package Information FAST TTL Logic Series CONTENTS Package Information Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contextual Info: IN TEG R A TED CIR C U ITS Preliminary specification 1996 Aug 15 IC20 Data Handbook Philips Semiconductors PHILIPS PHILIPS Philips Semiconductors Preliminary specification CMOS single-chip 8-bit microcontrollers 83C576/87C576 FEATURES • OTP package available

MF0 IC U1X

Abstract: philips 22c Specification FCP2 Flip Chip Package SOT732CA2 12NC ordering code philips MF0ICU10
Contextual Info: INTEGRATED CIRCUITS ADDENDUM MF0 FCP2 U1 Flip Chip Package Specification Product Specification Revision 3.0 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.0 October 2004 Flip Chip Package Specification MF0 FCP2 U1

AN212

Abstract: 74F240 74F374 F374 D3318
Contextual Info: INTEGRATED CIRCUITS AN212 Package lead inductance considerations in high-speed applications 1987 Jun Philips Semiconductors Philips Semiconductors Application note Package lead inductance considerations in high-speed applications AN212 Authors: Stephen C. Hinkle, Jeffrey A. West

SOT353 footprint

Abstract: wave footprint so14 logic package Shortform IC and Component AN248 philips printed circuit board design SO14 Package philips Soldering guidelines wave footprint SMD 5PIN LOGIC GATE
Contextual Info: INTEGRATED CIRCUITS AN248 PicoGate Logic Package 1998 October Philips Semiconductors PicoGate Logic package AN248 Philips Semiconductors now offers the smallest single gate 5V logic family available, PicoGate Logic. Consisting of single gate functions packaged in a 5 pin SOT353 package, PicoGate Logic reduces

pmfp

Abstract: SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1
Contextual Info: PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

DIP40

Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
Contextual Info: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)

CDIP14

Abstract: cdip28 SSOP20 300 mil MS-012AB MS-012AC SO20 sot73-1 sot94 150AH CDIP-14
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package outlines Package information January 1995 File under Integrated Circuits, IC04 Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm

87C750

Abstract: 80C51 P83C750EBA P83C750EBP P83C750EFA P83C750EFP P87C750EBF P87C750EFF SU00300 8XC750
Contextual Info: Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers DESCRIPTION 83C750/87C750 PIN CONFIGURATIONS The Philips 8XC750 offers the advantages of the 80C51 architecture in a small package and at low cost. The 8XC750 Microcontroller is fabricated with Philips high-density

SP 31101

Abstract: 80C51 83C749 87C749 P83C749EBP P87C749EBF P87C749EFF sot216 sot216-3
Contextual Info: Philips Semiconductors Preliminary specification CMOS single-chip 8-bit microcontrollers DESCRIPTION 83C749/87C749 PIN CONFIGURATION The Philips 83C749/87C749 offers many of the advantages of the 80C51 architecture in a small package and at low cost. The 8XC749 Microcontroller is fabricated with Philips high-density

87C751

Abstract: 8XC751 S87C751 80C51 83C751
Contextual Info: Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 83C751/87C751 • LED drive outputs DESCRIPTION The Philips 83C751/87C751 offers the advantages of the 80C51 architecture in a small package and at low cost. The 8XC751 Microcontroller is fabricated with Philips high-density

CLCC68

Abstract: CQFP80 CDIP40 package cdip28 PLCC68 package ANSI Y14.5 cqfp package outline PLCC28 package CDIP24 CDIP28 package
Contextual Info: INTEGRATED CIRCUITS DATA SHEET PACKAGE INFORMATION Page Index - CDIP CLCC CQFP DBS DIP HDIP PLCC QFP SIL SO SSOP - Soldering - Package outlines Package information 1995 Oct 25 File under Integrated Circuits, IC18 Philips Semiconductors

Contextual Info: Product specification Philips Semiconductors CMOS single-chip 8-bit microcontrollers 83C750/87C750 PIN CONFIGURATIONS DESCRIPTION The Philips 8XC750 offers the advantages of the 80C51 architecture in a small package and at low cost. Ml vcc P3.4/A4 [ T The 8XC750 Microcontroller is fabricated with Philips high-density

Contextual Info: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS - XA Example: Philips 80C51 extended Architecture P51XA G3 7 K B A J Derivative Nam e- - — J ; Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) BD = Thin Quad Rat Pack (TQFP)

P80C32

Abstract: P80C52 80C51 SC80C51 P51XA-G3
Contextual Info: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P8 X CX X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window) N = Plastic Dual In-Line

Contextual Info: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: 5 3 7 9 = = = = = P8 X C X X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window)

74lsxxx

Abstract: SN74HC logic family ti 74lvc family HC CMOS LOGIC 74HCXXX ttl family list 74HCXXX CMOS TTL Logic Family list sn74abt 74HCTXXX CD4000 cross REFERENCE
Contextual Info: Semiconductors Philips Logic Competitive Cross Reference Guide Family Package Philips TI Fairchild ON Semi Toshiba ST Micro 5V CMOS HEF4000B DIP HEF4xxxBPN CD4xxxBE CD4xxxBN MC14xxxBP TC4xxxBP HCF4xxxBEY SOIC HEF4xxxBTD CD4xxxBM CD4xxxBM/WM MC14xxxBD TC4xxxBFN

Contextual Info: Philips Semiconductors Power Diodes Package outlines MECHANICAL DATA August 1996 408 Philips Semiconductors Power Diodes Package outlines MECHANICAL DATA Dimensions in mm Net Mass: 2 g 4.4 max 2.9 max 7.9 7.5 J _ 0.55 max 1.3 top view Fig. 10. SOD100; The seating plane is electrically isolated from all terminals.

DIP18

Abstract: DIP20 DIP28 DIP40 LQFP100 LQFP128 LQFP32 LQFP64 ZE 004-1
Contextual Info: PACKAGE INFORMATION Page Index 1694 DIP LQFP QFP SDIP SO SSOP TSSOP VSO 1696 1706 1710 1712 1713 1721 1725 1726 Soldering 1728 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)

74HC9046

Abstract: 74hc128 74HCT4050 74HC1284 74hct133 74HCT4049 74HC7014 74hc164 74HC192 74HC93
Contextual Info: INTEGRATED CIRCUITS Package information Supersedes data of 1999 Jul 09 File under Integrated Circuits, IC06 1999 Sep 22 Philips Semiconductors Package information PACKAGE INFORMATION PART NO DIP N SO (D) SSOP (DB) TSSOP (PW) PIN COUNT 74HCU04 27-1 108-1

MCD288

Abstract: The Diode with Package Outlines 1993 SOT96A 1545A pulse to sinewave convertor DDSS431 TDA1545A TDA1545AT
Contextual Info: PHILIPS INTERNATIONAL bOE D • 7110fl2b D O S S ^ S 51b « P H I N 'T ' Philips Preliminary specification Stereo continuous calibration DAC TDA1545A FEATURES GENERAL DESCRIPTION • Space saving package S08 or DIL8

Contextual Info: Philips Semiconductors Preliminary specification CMOS single-chip 8-bit microcontroller DESCRIPTION FEATURES The Philips 83C748/87C748 offers the advantages of the 80C51 architecture in a small package and at low cost. • 80C51 based architecture 83C748/87C748