PGX 1 Search Results

siemens g52

Abstract: LT5554
Contextual Info: LT5554 Broadband Ultra Low Distortion 7-Bit Digitally Controlled VGA DESCRIPTION FEATURES n n n n n n n n n n n 1GHz Bandwidth at all Gains 48dBm OIP3 at 200MHz, 2VP-P into 50Ω, ROUT = 100Ω –88dBc IMD3 at 200MHz, 2VP-P into 50Ω, ROUT = 100Ω 1.4nV/√Hz Input-Referred-Noise RTI

TPS2456A

Contextual Info: TPS2456A www.ti.com SLVSBI8 – JULY 2012 Dual 12 V Protection and Blocking Controller Check for Samples: TPS2456A FEATURES DESCRIPTION • The TPS2456A is a dual, 12 V, channel protection hotswap and blocking (ORing) controller that provides inrush control, current limiting, overload

Contextual Info: TPS2456 www.ti.com SLVSA78B – MARCH 2010 – REVISED DECEMBER 2010 Dual 12 V Protection / Blocking Controller Check for Samples: TPS2456 FEATURES DESCRIPTION • • • • • • The TPS2456 is a dual, 12 V, channel protection hotswap and blocking (ORing) controller that

3021 optocoupler

Abstract: summit application note 22 300nF CAPACITOR MMBD1401 NC7S14 SMH4804 Summit Microelectronics Optocoupler 3021
Contextual Info: SUMMIT Application Note 21 MICROELECTRONICS, Inc. SMH4804 Power Down Sequencing Preliminary INTRODUCTION APPLICATION CIRCUIT 1 It is often necessary to sequence the power down of DCto-DC converters in a distributed power environment. Since the ON/OFF enable control for the DC-to-DC converters is found on the primary –48V power side of the

RG2B

Abstract: RG2A G30-88 JESD51-7 QFN36 TPS2456 TPS2354 QSD16403Q5A rg2x TPS2456EVM
Contextual Info: TPS2456 www.ti.com SLVSA78A – MARCH 2010 – REVISED MARCH 2010 Dual 12 V Protection / Blocking Controller Check for Samples: TPS2456 FEATURES 1 • • • • • • • DESCRIPTION Dual 12 V Protection and Blocking Control Independent Current Limit and Fast Trip

Contextual Info: TPS54294 SLVSB00 – OCTOBER 2011 www.ti.com 2A Dual Channel Synchronous Step-Down Switcher with Integrated FET SWIFT Check for Samples: TPS54294 FEATURES APPLICATIONS • • 1 2 • • • • • • • • • • • • • • • D-CAP2™ Control Mode

Contextual Info: TPS54394 www.ti.com SLVSBE6 – JUNE 2012 3A Dual Channel Synchronous Step-Down Switcher with Integrated FET Check for Samples: TPS54394 FEATURES APPLICATIONS • • 1 2 • • • • • • • • • • • • • • • • • D-CAP2 Control Mode

GCTJ-08-8-3012-8-BK-PX-XX-PGX

Abstract: 7 pos phone jack
Contextual Info: 1 2 3 4 5 6 7 8 9 SPECIFICATIONS Contact material: Phosphor bronze 0.35mm Contact plating: Gold over nickel in contact area Tin over nickel on solder tails Shield material: Brass Shield plating: Nickel Housing material: Engineering thermoplastic, UL94V-0 A

SGCTJ-08-8-3022-8-BK-PX-S-PG6

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B SPECIFICATIONS Contact material: Contact plating: Shield material: Shield plating: Housing material: C Phosphor bronze 0.35mm Selective gold Stainless case 0.20mm Tin plated ground pin Glass filled polyester, UL94V-0 C D D E E F Series

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Insertion loss: Return loss: D Crosstalk: Com. mode reject.: HIPOT test: OCL: Operating temp.: E Series CTJ Modular Jack F Positions 8 8 Positions Contacts 08 8 Contacts Description Date Approved G Drawing Name

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Turn Ration: Insertion Loss: Return Loss: D Cross Talk: Common Mode Rejection: HI-Pot Test: OCL: Operating Temperature: Transmit=1CT:1CT Receive=1CT:1CT -1.0dB MAX. -18dB 1-30MHZ ,-16dB(40MHz) -12dB(50MHz),-10dB(60-80MHz)

CTJ-8-08-F1360LXX-BK-PX-FS-PG6

Abstract: PBT-4830
Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Housing Material: Insert Material: Plating Material: Contact Material: Shielding Material: Insertion loss: Return loss: Crosstalk: HIPOT test: OCL: Operating temp.: D E Series CTJ Modular Jack F Positions 8 8 Positions

CTJ-8-08-H-XX-BK-PX-FS-PGX

Contextual Info: 1 2 3 4 5 6 7 8 9 Panel grounding options Grounding feet options A A B B C C SPECIFICATIONS Contact material: Contact plating: Housing material: Shield material: Shield plating: D Pos. Con. 6 2,4,6 PC Board Layout 8 4,6,8 10 10 Series Positions Contacts Body

SGCTJ-08-8-NLXX-8-BK-PX-S-PG6

Abstract: RJ45 jack detail drawing SGCT
Contextual Info: 1 2 3 4 5 6 7 SPECIFICATIONS Contact material: Contact plating: Shield material: Shield plating: Bottom housing: Top housing: A B 8 9 0.35mm phosphor bronze Selective gold 0.25mm copper alloy Tin Nylon 46, UL 94V-0 PBT with glass fiber, UL 94V-0 A Cavity conforms to FCC rules and regulations Part 68, Subpart F

GCTJ-08-2-H-A1-8-BK-PX-S

Abstract: 8p8c
Contextual Info: 1 2 3 4 5 6 7 8 9 PC Board Layout / Top View A A B B C C SPECIFICATIONS Contact material: Phosphor bronze 0.35mm Contact plating: Gold over nickel in contact area Tin over nickel in solder area Shield material: Brass Shield plating: Nickel Housing material: Engineering thermoplastic, UL94V-0

CTJ-8-08-F1362A-BK-P1-FS-PG6

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Insertion loss: Return loss: D E Series Positions CTJ 8 Modular Jack 8 Positions F Contacts 08 8 Contacts RoHS compliant Rev. A PNT Description Date 9/15/08 Approved Greg G Drawing Name Approved Howard Checked Lizzy

GCTJ-08-4-650LXX-8-BK-PX-S

Contextual Info: 1 2 3 4 5 6 7 8 9 A A SPECIFICATIONS Housing Material: Contact Material: Shield: PBT Polyester UL94V-0, Black 0.35mm Thick Phos-Bronze Plated. Gold Flash in solder area. 0.25mm Copper w/ Nickel Plating B B C C LED Color Codes Code LED G Green Y Yellow D Red/Green

top 267 pn

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C No. of Dimensions ports A B C D E 1 16.5 12.70 2.54 16.26 2 32.26 15.75 28.45 2.67 32.00 4 63.76 47.25 59.94 2.67 63.50 6 95.26 78.75 91.46 2.67 95.01 8 126.76 110.25 122.94 2.67 126.51 D E Series Positions Ports GCTJ XX X Mod jack, 06, 08

GCTJ-08-4-C1LXX-X-BK-PX-S-PG6

Contextual Info: 1 2 3 4 5 6 7 8 9 A A C (E) PCB Layout (Ref.) (A) B C C D (C) No. of Dimensions ports A B C 1 16.50 12.70 2 32.26 15.75 28.45 4 63.76 47.25 59.94 6 95.26 78.75 91.46 8 126.76 110.25 122.94 D E F B B Description Date Approved G Drawing Name Approved Howard

GCTJ-08-2-3046LXX-8-BK-PX-S-PG3

Contextual Info: 1 2 3 4 5 6 7 SPECIFICATIONS Contact Material: A Shield Material: Plastic Housing: 8 9 Phosphor Bronze Gold Plating over Nickel in Contact Area Tin Plating over Nickel in Solder Area Brass Platting Nickel Alloy Thermoplastic, UL94V-0 A B B C C No. of Dimensions

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B SPECIFICATIONS Turn ratio: Insertion loss: Return loss: Cross talk: Common mode reject.: OCL: Leakage induct.: C D Primary to secondary cap.: DCR: Hipot test: Tx 1:1; Rx 1:1 -0.1dB max. 0.1 to 100 MHz -16dB 1-30 MHz; -10dB 30-80MHz

GCTJ-08-2-C1LXX-X-BK-PX-S-PG6

Contextual Info: 1 2 3 4 5 6 7 8 9 A A A B B (B) (D) (C) SPECIFICATIONS Contact material: Contact plating: C Housing material: Shield material: Shield plating: No. of Dimensions ports A B C 1 16.50 12.70 2 32.26 15.75 28.45 4 63.76 47.25 59.94 6 95.26 78.75 91.46 8 126.76 110.25 122.94

CD40106

Abstract: zener smd diode 3.3v 500mw schematic diagram 48V telecom ups zener diode 3.3v 500mw, philips make philips 3.3V DC-DC converter step down transzorb 5v pq48033 pq48050 schematic diagram 48v dc convertor schematic diagram circuit 48V controller
Contextual Info: Application Note 23 SMH4804/SMT4004 Telecom Reference Design with SynQor DC/DC Converters INTRODUCTION The circuit design required to convert the –48V bus to the voltages required by network processors, ASICs, miscellaneous logic, etc., is presented in this Application

C2680

Abstract: C5210
Contextual Info: 1 2 3 4 5 6 7 8 9 SPECIFICATIONS A Contact Pin Material: Housing Material: Insert Material: B Plate Material: Shield Material: C Operating Life: Operating Temp: Wave Soldering Temp: Storage Temp: Inductance: HI-POT: Turn Ratio: Insertion Loss: Return Loss: