PGA 180 Search Results

Contextual Info: Radar Receive Path AFE: 6-Channel LNA/PGA/AAF with ADC AD8283 Data Sheet INA– INB+ INB– PGA AAF LNA PGA AAF LNA PGA AAF LNA PGA AAF RBIAS LNA VREF AAF DVDD33x PGA DVDD18x LNA MUXA AAF PDWN PGA REFERENCE DSYNC INC+ INC– MUX IND+ IND– INE+ INE– INF+

PGA144

Abstract: 144 PGA 144 pin pga 81F64842B Atmel DATE CODE PGA-120 PGA 84 PGA84 PGA120
Contextual Info: 68 pins PGA Ceramic Pin Grid Array PGA Package Outlines Code:8M Date: 15/12/95 Rev. B – 23/08/01 1 PGA 84 pins PGA Code 8R Date: 21/07/00 2 Rev. B – 23/08/01 100 pins PGA Code:GT Date: 14/06/00 3 PGA Rev. B – 23/08/01 PGA 120 pins PGA Code:GU Date: 25/06/99

Contextual Info: PIN GRID ARRAY PACKAGE 135 PIN CERAMIC PGA-135C-C02 135-pin ceramic PGA Lead pitch 100mil Pin matrix 14 Sealing method Cerdip PGA-135C-C02 135-pin ceramic PGA (PGA-135C-C02) 0.46 +– 0.18 0.05 DIA (.018 +– .007 .002 ) 1.27 (.050) DIA TYP 33.02 (1.300)

PGA-135C-A01

Abstract: PGA135-C-S14U-1
Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 135 PIN CERAMIC PGA-135C-A01 EIAJ code :∗PGA135-C-S14U-1 135-pin ceramic PGA Lead pitch 100 mil Pin matrix 14 Sealing method Metal seal PGA-135C-A01 135-pin ceramic PGA (PGA-135C-A01) 0.46 +– 0.18

fujitsu

Abstract: Fujitsu Transistor Array
Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 135 PIN CERAMIC PGA-135C-C02 135-pin ceramic PGA Lead pitch 100 mil Pin matrix 14 Sealing method Metal seal PGA-135C-C02 135-pin ceramic PGA (PGA-135C-C02) 0.46 +– 0.18 0.05 DIA (.018 +– .007 .002 )

diode c02

Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 135 PIN CERAMIC To Top / Package Lineup / Package Index PGA-135C-C02 135-pin ceramic PGA Lead pitch 100 mil Pin matrix 14 Sealing method Metal seal PGA-135C-C02 135-pin ceramic PGA (PGA-135C-C02) 0.46 +– 0.18

pga 180

Abstract: PGA-135C-A01 PGA135-C-S14U-1
Contextual Info: PIN GRID ARRAY PACKAGE 135 PIN CERAMIC PGA-135C-A01 EIAJ code : ∗PGA135-C-S14U-1 135-pin ceramic PGA Lead pitch 100mil Pin matrix 14 Sealing method Metal seal PGA-135C-A01 135-pin ceramic PGA (PGA-135C-A01) 0.18 0.46 +– 0.05 DIA .007 (.018 +– .002

CERAMIC PIN GRID ARRAY 120 pins

Abstract: MATRA MHS pga 180 gu -SH-112D 144 PGA 160-Pin PGA 8f diode CERAMIC PIN GRID ARRAY 144 pins code matra
Contextual Info: Packages Ceramic Pin Grid Array PGA package outlines 68 pins PGA Code : 8M Date : 15–12–95 84 pins PGA Code : 8R MATRA MHS Date : 21–12–95 1 Packages 100 pins PGA Code : GT Date : 15–12–95 120 pins PGA Code : GU 2 Date : 10–02–95 MATRA MHS

PGA-135C-A01

Abstract: PGA135-C-S14U-1 pga 180
Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 135 PIN CERAMIC To Top / Package Lineup / Package Index PGA-135C-A01 EIAJ code :∗PGA135-C-S14U-1 135-pin ceramic PGA Lead pitch 100 mil Pin matrix 14 Sealing method Metal seal PGA-135C-A01 135-pin ceramic PGA

Contextual Info: INA+ INA– INB+ INB– INC+ INC– IND+ IND– AAF LNA PGA AAF LNA PGA AAF VREF PGA RBIAS LNA DVDD33x AAF DVDD18x PGA MUXA AVDD33x LNA PDWN AVDD18x FUNCTIONAL BLOCK DIAGRAM REFERENCE DSYNC MUX 12-BIT ADC DRV D[0:11] INADC+ INADC– SPI NOTES 1. AVDD18x = AVDD18, AVDD18ADC.

Contextual Info: INA– INB+ INB– INC+ INC– IND+ IND– AAF LNA PGA AAF LNA PGA AAF VREF PGA RBIAS LNA DVDD33x AAF DVDD18x PGA MUXA LNA PDWN AVDD18x INA+ AVDD33x FUNCTIONAL BLOCK DIAGRAM REFERENCE DSYNC MUX 12-BIT ADC DRV D[0:11] INADC+ INADC– SPI NOTES 1. AVDD18x = AVDD18, AVDD18ADC.

Contextual Info: Interstitial Grid Design Your Own PGA Socket Design Your Own PGA Socket .100/ 2.54mm Pitch Staggered Contact Information Date: _ Company Name:

footprint pga 208

Contextual Info: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

95-132I25

Abstract: ASTM-B16-85 MIL-T-10727
Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Abstract: MIL-T-10727
Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

95-132I25

Abstract: ASTM-B16-85
Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-080M80 - QFP to PGA Adapter for EIAJ 80 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.