PCN08 Search Results

PCN0808

Abstract: EPM3128ATC100-10 EPM240T100C5N EPM3064ATC100-10 EPM3064ATC100-10N EPM570T100C5 EPM570T100I5N EPM570T100C5N EPM3064ATC44-10 EPM3256ATC144-10
Contextual Info: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0808 WIRE-BOND DIAMETER REDUCTION FOR SELECTED TQFP PACKAGES Change Description Altera is implementing bond wire diameter reduction from 1.0 mil to 0.8 mil on product lines assembled in the TQFP package. This change will be implemented on selected MAX CPLD and

PCN0801

Abstract: hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4
Contextual Info: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0801 ALTERNATIVE MANUFACTURING SITE FOR EPCS FAMILY Change Description This is an update to PCN0801; please see the revision history table for information specific to this update. Altera introduced Amkor Philippines as an alternative assembly manufacturing site for the Altera

RV3029C2

Abstract: OT7602C1 RV-3029
Contextual Info: Tel: +44 1460 256 100 Fax: +44 1460 256 101 www.golledge.com Golledge Electronics Ltd Eaglewood Park, ILMINSTER Somerset, TA19 9DQ, UK END OF LIFE WARNING Document ref: Issued: Authorised: PCN080702A v3.0 14 Oct 08 JPG Product affected OT7602C1 Description

GXO-4301

Abstract: OV1564C2 OV7604C7
Contextual Info: Tel: +44 1460 256 100 Fax: +44 1460 256 101 www.golledge.com Golledge Electronics Ltd Eaglewood Park, ILMINSTER Somerset, TA19 9DQ, UK END OF LIFE WARNING Document ref: Issued: Authorised: PCN080702B v2.0 21 Jul 08 JPG Product affected OV1564C2 Description

FCI Connector

Abstract: colour change led Specialists numbers
Contextual Info: Product/Process Change Notification PCN08172 Product: Micropax Connectors Product Manager: Jorge Ramirez Distribution: GLOBAL Part Numbers Concerned: See list attached Issue Date: 19 Nov, 2008 Page s : 1/1 Subject: Micropax™ Connectors; Inner-colour Change Only

Contextual Info: Product/Process Change Notification PCN08114 Product: Mini and Maxi PV CTW Gold Products Product Manager: Missy Grubb Distribution: Part Numbers Concerned: See attached list Issue Date: August 26, 2008 Page s : 1/1 Global Subject: Plating change on the backside of the Gold plated Mini and Maxi PV® CTW products FOR

PCN0813

Abstract: EPM240T100C5N EP1C3T144C8N EPM240T100I5N EPM1270T144C5N EPM570T144C5N EPM240T100C5 EPM570T100C5N EPM2210F256A5N f324
Contextual Info: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0813 POLYIMIDE WAFER COAT REMOVAL FOR SELECTED ALTERA DEVICES Change Description Altera is implementing a change to the wafer coat on selected product lines fabricated at Taiwan Semiconductor Manufacturing Co. TSMC . This change includes the exclusion of the existing

PCN0802

Abstract: ALTERA PART MARKING EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 EP3C5 tsmc
Contextual Info: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0802 ADDITIONAL TSMC WAFER FABRICATION SITE FOR CYCLONE III FPGAs Change Description Altera will begin manufacturing and shipping Cyclone III FPGAs out of Taiwan Semiconductor Manufacturing Company TSMC wafer FAB 14, located in Tainan, Taiwan.

FCI Connector

Abstract: mobile phone PCN08139 latch headers
Contextual Info: Product/Process Change Notification PCN08139 Product: ClincherTM Latch Header Connectors Product Manager: Alejandro Aguirre Distribution: GLOBAL Part Numbers Concerned: See list attached Issue Date: Oct 3 08 Page s : 1/1 Subject: ClincherTM Latch Header Connectors color change only

PCN0803

Abstract: TI date code altera date code format marking ic 2008 EP1S60 stiffener ALTERA BGA packages PART MARKING date code marking stratix traceability FC1020
Contextual Info: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0803 PACKAGE-LID STIFFENER CHANGE FOR THE STRATIX FLIP-CHIP FAMILY Change Description Altera is introducing a dimension change to the package-lid stiffener for the Stratix FPGA flip-chip package. This effectively reduces the overall package height by approximately 0.2mm. This change

HI3186PST

Contextual Info: ARINC 429 Differential Line Driver Die Change for HI-3186PSx Product Change Notice PCN0812 v1.0 December 02, 2008 Overview This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3186PSx. Description The new design has been characterized against all requirements of the ARINC 429 specification and the Holt HI-3186PSx

Contextual Info: HI-6110 Die Revision and Data Sheet Change Product Change Notice PCN0801 v1.0 May 14, 2008 Overview The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.

HI-8588PST

Abstract: HI8588PSIf HI-8588PSI-10 HI-8588CRT-10
Contextual Info: Wafer Fab Process Transfer for HI-8382/8383 & HI-8588/8588-10 Series of ARINC 429 Products Product Change Notice PCN0811 v1.0 December 02, 2008 Overview The purpose of this notice is to announce the completed transfer of the Holt devices manufactured using the 100mm 4.0um

HI-1574CDI

Abstract: HI1573CDM hi-1573cdm HI-8382CM-21 HI-3282CD 6010CM-10 QR-8050 HI-1573CDI
Contextual Info: New Assembly Supplier: Criteria Labs Austin, Texas Product Change Notice PCN0810 v1.0 December 02, 2008 Overview The purpose of this notice is to announce the addition of Criteria Labs in Austin, Texas as a qualified assembly supplier for ceramic side-brazed DIP package for both ARINC 429 and MIL-STD 1553 family of devices.

Device Marking Convention

Abstract: Holt Integrated Circuits DS3587 PCN0802
Contextual Info: Marking and Data Sheet Change for HI-3585 Series of ARINC 429 SPI Interface Products Product Change Notice PCN0802 v1.0 May 14, 2008 Overview The purpose of this notification is to announce that Holt Integrated Circuits has standardized the naming and top side

SUMITOMO EME G600

Abstract: EME G600 Moisture Sensitivity Level Rating 8050P sumitomo lcd 1575P JESD46-C pc/SUMITOMO g600
Contextual Info: 32 & 64-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN0809 (v1.0) September 12, 2008 Overview This notice describes the changes to the 32-Lead & 64-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, Discrete to Digital and LCD Display Driver family of devices.

Alternative

Contextual Info: Product/Process Change Notification PCN08044 Product: PCIe Product Manager: Alan Lo Distribution: GLOBAL Part Numbers Concerned: See attached list Issue Date: March 28, 2008 Page s : 1/3 Subject Product Design Change Nature of Change: Since the global raw materials are rising up rapidly, FCI decided to implement product

FCI Connector

Abstract: card fci Transistor Equivalent list transistor marking code transistor marking codes date code marking diode marking code marking codes transistor mark code PCN-08
Contextual Info: Product/Process Change Notification PCN08156 Part Numbers Concerned: All Power Edge Card series. See attached list Issue Date: 8th Nov 2008 Page s : 1/2 Product: Power Edge Card Connector Product Manager: Sally Luo Distribution: Active and Contract Customers

PCN0805

Abstract: jedec jesd22-a108 epcs16n altera epcs16n altera marking EPCS16 EPCS128SI16N EPCS4SI8N EPCS16SI8N altera marking EPCS16si16n EPCS16
Contextual Info: Revision: 1.6.0 PROCESS CHANGE NOTIFICATION PCN0805 WAFER FABRICATION SITE CHANGE FOR SERIAL CONFIGURATION DEVICES Change Description This is an update to PCN0805; please see the revision history table for information specific to this update. Serial Configuration devices, currently manufactured in the Numonyx Catania Italy fabrication

HI-6110

Contextual Info: HI-6110 Die Revision and Data Sheet Change Product Change Notice PCN0807 v1.0 December 12, 2008 Overview The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.

CA92691

Abstract: QR-0813
Contextual Info: 44L TQFP Package Lead Formation Change Product Change Notice PCN0803 v1.0 May 28, 2008 Overview The purpose of this notification is to announce a change to the 44L TQFP (PTQS) package lead formation. Description Holt Integrated Circuits’ qualified subcontractor CEI, has retooled the lead formation for the 44L TQFP (PTQS) from the

DAP 08

Contextual Info: 44L PLCC Package & DAP Size Standardization Product Change Notice PCN0804 v1.0 June 30, 2008 Overview The purpose of this notification is to announce that Holt Integrated Circuits has standardized the Die Attach Pad (DAP) size configuration for all products which previously used the 300 mil x 300 mil DAP 44L PLCC Package.

die changes

Contextual Info: ARINC 429 Differential Line Driver Die Change for 3182PSx-N Product Change Notice PCN0808 v1.0 November 12, 2008 Overview This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the 3182PSx-N. Description The new design has been characterized against all requirements of the ARINC 429 specification and the Holt HI-3182PSx-N

HI-8010Q

Abstract: HI3584PQI-10 HI3584PQT HI-3584PQT HI-3584PQTF-10 HI-3584PQI-10 HI-6110PQT 8583P 8010Q Moisture Sensitivity Level Rating
Contextual Info: 52-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN0805 (v1.0) September 12, 2008 Overview This notice describes the changes to the 52-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.