PB AND PB-FREE REFLOW SOLDERING TEMPERATURE PROFILES Search Results

Pb and Pb-free Reflow Soldering Temperature Profiles

Abstract: TB493 JEP-140
Contextual Info: Technical Brief 493 Sn/Pb and Pb-free Reflow Soldering Temperature Profiles TABLE 1. REFLOW PROFILES PROFILE FEATURE SN-PB EUTECTIC ASSEMBLY PB-FREE ASSEMBLY Temperature Min TSMIN 100°C 150°C Temperature Max (TSMAX) 150°C 200°C Preheat/Soak Time (tS) from (TSMIN to TSMAX)

smd transistor w1a

Abstract: w2f smd transistor SMD W1A SMD W2A smd transistor marking w2a W1A smd code marking code W2F smd transistor w1a 95 DATASHEET SMD W2f smd code W2F
Contextual Info: This web update contains information on RoHS compliance legislative requirements, product family status and recommended soldering profiles RoHS/ELV Compliance by Product Family Rev 4: July ‘06 RoHS Compliance Requirements AVX compliance introduction to terms and Product Family Status:

7361

Abstract: JESD97 J-STD-020B
Contextual Info: nemco Low Profile Soldering . There are several important general soldering considerations • Recommended soldering profiles are designed to insure that the temperature of the internal construction of the capacitors does not exceed +220°C. • Positioning capacitors near components radiating heat such as power transistors should be avoided.

SEM 2006

Abstract: paste profile reflow profile 245 J-STD-020B 62Sn36Pb2Ag PQFN 8 leads
Contextual Info: Freescale Semiconductor, Inc. Freescale Semiconductor, Inc. Environmentally Preferred Products: Development of Lead Pb - Free and Bromine (Br)- Free Solutions Index Overview 1. Environmentally Preferred Products 1.4 Long Term Goals 1.5 Short Term Goals

smema specifications

Abstract: smema AN038 smema control EAN-102068
Contextual Info: DESIGN APPLICATI0N NOTE - AN038 Solder Reflow Recommendations Sn/Pb and Pb Free for Plastic RFICs Overview The stages used in a solder profile We are often asked what the solder reflow profile should be for SMDI devices mounted on PCB’s using high volume production equipment. The reflow profile is

XAPP427

Abstract: BFG95 Lead Free reflow soldering profile BGA FSG48 FGG256 FFG1152 FFG896 reflow profile 245 SOG20 BGA PROFILING
Contextual Info: Application Note: Packaging R Implementation and Solder Reflow Guidelines for Pb-Free Packages XAPP427 v2.2 January 30, 2006 Summary Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of

Lead Free reflow soldering profile BGA

Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160
Contextual Info: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of

JIS-C-6429

Abstract: MF-R110-2 USMD1210 MF-R110-2-99 MF-MSMD equivalent alternative ENIG PTC 965
Contextual Info: Bourns Lead Free ® Multifuse Polymer PTCs Circuit Protection Solutions 1 Table Of Contents Table Of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

alpha OM-338

Abstract: OM-338 JEP-140 IPC-SM-786 JEP140 OM338 alpha OM-338 application notes CLP0603
Contextual Info: VISHAY SEMICONDUCTORS www.vishay.com Protection Diodes Application Note CLP0603 Package for Diodes By Henry Karrer L e1 1. SCOPE b This application note applies to all products in Vishay’s CLP0603 package. Because of the package’s small size, it is important to follow the recommended guidelines in

Contextual Info: Varistor Products Surface Mount Varistors > SM7 Series RoHS SM7 Varistor Series Description The Littelfuse SM7 Series is a plastic-encapsulated surface-mount metal oxide varistor MOV transient voltage surge suppressor that is designed to be operated continuously across AC power lines.

AN-994

Abstract: MQFP64 PLCC-44 SOT 663 footprint
Contextual Info: Application Note AN-994 Maximizing the Effectiveness of Your SMD Assemblies by Gil Alivio, John Ambrus, Tim McDonald, Richard Dowling Table of Contents Page How We Measure Rth JA .2 Thermal Characterization of Surface Mount Packages .3

292D

Abstract: 292D3
Contextual Info: 292D Vishay Sprague Solid Tantalum Chip Capacitors, TANTAMOUNT Lead Frameless Molded FEATURES • 0805 Footprint Pb-free • Wraparound lead Pb -free terminations: P and R Cases Available RoHS* • 8 mm, 12 mm, 16 mm tape and reel packaging available per EIA-481-1 and reeling per IEC

Contextual Info: TR8 Vishay Sprague Solid Tantalum Chip Capacitors MICROTAN Low ESR, Leadframeless Molded FEATURES • 0603 and 0805 footprint • Lead Pb -free face-down terminations • 8 mm tape and reel packaging available per EIA-481-1 and reeling per IEC 286-3 7" [178 mm] standard

40114

Contextual Info: TR8 Vishay Sprague Solid Tantalum Chip Capacitors MICROTAN Low ESR, Leadframeless Molded FEATURES • 0603 and 0805 footprint • Lead Pb -free face-down terminations • 8 mm tape and reel packaging available per EIA-481-1 and reeling per IEC 286-3 7" [178 mm] standard

TR8M106M010C2000

Abstract: TR8M1
Contextual Info: TR8 Vishay Sprague Solid Tantalum Chip Capacitors MICROTAN Low ESR, Leadframeless Molded FEATURES • 0603 and 0805 footprint • Lead Pb -free face-down terminations RoHS • 8 mm tape and reel packaging available per EIA-481-1 and reeling per IEC 286-3

MIL-STD-202G 204D

Abstract: 292D 298D 292D225X
Contextual Info: Not for New Designs. See Vishay 298D Series for New Design and/or Replacements 292D Vishay Sprague Solid Tantalum Chip Capacitors, TANTAMOUNT , Leadframeless Molded P and R cases Image is not to scale Not for New Designs - please refer to: www.vishay.com/doc?40065

Contextual Info: TFDU2201 Vishay Semiconductors Low Profile Transceiver Module PIN Photodiode and Infrared Emitter FEATURES • Package dimension: L 7.3 mm x W 4.55 mm x H 2.75 mm • SMD side view • Fast PIN photodiode for SIR and FIR applications • Detector with high efficiency and high speed at

Contextual Info: TR8 Vishay Sprague Solid Tantalum Chip Capacitors MICROTAN Low ESR, Leadframeless Molded FEATURES • 0603 and 0805 footprint  Lead Pb -free face-down terminations  8 mm tape and reel packaging available per EIA-481-1 and reeling per IEC 286-3 7" [178 mm] standard

292D336X

Contextual Info: Not for New Designs. See Vishay 298D Series for New Design and/or Replacements 292D Vishay Sprague Solid Tantalum Chip Capacitors, TANTAMOUNT , Leadframeless Molded P and R cases Image is not to scale Not for New Designs - please refer to: www.vishay.com/doc?40065

tl 5069

Abstract: srf 10-15
Contextual Info: Multilayer Organic Inductors The Multilayer Organic Inductor MLOI is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. The MLOI series of components are based on AVX’s patented multilayer organic technology

292D

Abstract: 298D vishay 298d
Contextual Info: Not for New Designs. See Vishay 298D Series for New Design and/or Replacements 292D Vishay Sprague Solid Tantalum Chip Capacitors, TANTAMOUNT , Leadframeless Molded P and R cases Image is not to scale Not for New Designs - please refer to: www.vishay.com/doc?40065

Contextual Info: TFDU2201 Vishay Semiconductors Low Profile Transceiver Module PIN Photodiode and Infrared Emitter FEATURES • Package dimension: L 7.3 mm x W 4.55 mm x H 2.75 mm • SMD side view • Fast PIN photodiode for SIR and FIR applications • Detector with high efficiency and high speed at

m1522

Contextual Info: 298D Vishay Sprague Solid Tantalum Chip Capacitors MICROTAN Leadframeless Molded FEATURES • 0805 and 0603 footprint • Lead Pb -free L-shaped terminations • 8 mm tape and reel packaging available per EIA-481-1 and reeling per IEC 286-3 7" [178 mm] standard

Contextual Info: TFDU2201 Vishay Semiconductors Low Profile Transceiver Module PIN Photodiode and Infrared Emitter Description The miniaturized TFDU2201 is an ideal PIN photodiode transmitter combination in a unique package for applications in telecommunications like mobile