PAGE112 Search Results

ML26AA

Abstract: 532702B02500G ML26AAG 533902B02554G
Contextual Info: TO-220 Heat Sinks Grease & Epoxy page112 Extruded heat sink with radial fins ORDERING INFORMATION Mounting Surface Temp Rise Above Ambient—°C Extruded heat sink with radial fins and channel clip attach feature make device attachment easy. Includes clip and two solderable

577002B04000G

Abstract: In-Sil-8 577202B00000G 577102B04000G
Contextual Info: TO-220 Heat Sinks Grease & Epoxy page112 Channel style heat sink featuring recessed lower fins Air Velocity—Feet Per Minute 400 200 600 800 1000 10 Mounting Surface Temp Rise Above Ambient—°C 100 Channel style heat sink features recessed lower fins to allow closer component spacing and longer upper fins for

BW38-2G

Abstract: 513002b02500g BW50-2G BW-50 heat sink to220 513201b02500g heat sink for TO220
Contextual Info: TO-220 & TO-218 & TO-247 Heat Sinks Grease & Epoxy page112 Air Velocity—Feet Per Minute 400 200 600 800 100 Wide extruded heat sink with unequal channel widths on front and back can accommodate a TO-220, TO-218, or TO-247 device. Includes two solderable mounting pins which permit

7022PBG

Abstract: 7022BG
Contextual Info: Grease & Epoxy page112 Channel style heat sink with folded back fins 200 Air Velocity—Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient—°C 5 80 4 60 3 40 2 20 1 4 Channel style heat sink with folded back fins for increased cooling surface area. Available

507222B00000G

Abstract: heat sink to220 5070
Contextual Info: Grease & Epoxy page112 5069, 5070, 5071, 5072 Hat section style heat sink FIGURE A FIGURE B ø 3.66 0.144 THRU 17.78 (0.700) 13.46 (0.530) Mounting Kits page 99 ø 3.66 (0.144) THRU TYP 2 CL 37.34 (1.470) 10.16 (0.400) CL 13.59 (0.535) "A" Hat section style heat sinks are low

592502U03400G

Abstract: 542502D00000G 592502B03400G heat sink for TO220 PAGE-112
Contextual Info: Grease & Epoxy page112 Space saving staggered fin heat sink ORDERING INFORMATION Mounting Surface Temp Rise Above Ambient—°C Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features integrated solderable mounting tabs that can be twisted for

6399B

Abstract: 6400B-G 6381B 6400B-P2G 6396B-P2G 6399BG 6396BG 6396b 6400BG 6399B-P2G
Contextual Info: TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks Grease & Epoxy page112 High power extruded heat sink with large radial fins Mounting Surface Temp Rise Above Ambient—°C 5 80 4 60 3 40 2 20 1 High power extruded heat sink with large radial fins and solderable shoulder pins allows vertical

plx 9054

Abstract: plxtechnology tp 9054 333CJ PLX PCI9054 eeprom d4x MPC8S PC19054 pci 9054 RELAY lad1
Contextual Info: PCI 9054 PCI I/O Accelerator November 1998 Version 1.0 l20 Compatible, CompactPCI Hot Swap Friendly PCI Bus Master Interface Chip _ for Adapters and Embedded Systems FEA TU R E S • 3.3V, 5V tolerant PCI and Local signaling supports Universal PCI Adapter designs, 3.3V core, lowpower CMOS in 176-pin PQFP and 225-pin PBGA

NT5CB256M16bP-DI

Abstract: NT5CB256M16 NT5CC512M8BN NT5CB512M8BN-CGI NT5CB512M8BN-DI NT5CB256M16BP-DII NT5CB256M16B T14C NT5CC512M8 NT5CC256M16BP
Contextual Info: NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP Speed Bins -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Units tCK Parameter Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Clock Frequency

Contextual Info: 32-bit TX System RISC TX03 Series TMPM330FYWFG Rev 1.02 Semiconductor & Storage Products Company 2013-08-05 Table of Contents Table of Contents. i

NT5CB256M16

Abstract: NT5CC256M16 4Gb DDR3 SDRAM nanya ddr3 DDR3 DIMM SPD JEDEC
Contextual Info: 4Gb DDR3 SDRAM B-Die NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP CAS Latency Frequency -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Speed Bins Units tCK Parameter Min. Max. Min.

ADM660

Abstract: ADM8660 ADM8828 ADM8829 ADP3603 ADP3604 ADP3605 ADP3607
Contextual Info: POWER MANAGEMENT: DC to DC Converter, Switched Capacitor Model Vdc Input Volts Iq mA Isdown mA Switch Freq KHz Output Ripple mV Output Resistance Ohms Vout Volts Vout Accuracy Iout mA Load Reg mV/mA Price # Pins NOTES 100's FAX CODE Unregulated Switched Cap Voltage Converter

LMG5278XUFC-00T

Abstract: LMG5278XUFC-00T backlight LMG5278XUFC-00T-2 Y648 Y646 Hitachi DSA0046 2708L
Contextual Info: RECORD OF REVISION DATE SHEET No. SUMMARY MAR.27.’98 7B64PS 2710CHANGE: LMG5278XUFC-00T-2 CONTRAST IRREGULARITY SPOT IS CHANGED. PAGE 10-3/5 Sh. KAOHSIUNG HITACHI DATE MAR.27.’98 7B64PS 2702-LMG5278XUFC-00T-2 PAGE 2-1/1 No. ELECTRONICS CO.,LTD. 3. MECHANICAL DATA

7141DG

Abstract: 504102B00000G 50410-2 507302B00000
Contextual Info: TO-220 Heat Sinks Copper narrow channel style heat sink with integrated clip 80 8 60 6 40 4 Case Temp Rise Above Ambient—°C 2 1 2 3 Heat Dissipated—Watts 4 16.51 0.650 3.05 (0.120) 5.72 (0.225) 5 Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION

Contextual Info: 15-Serie 1200-A_20-Serie 1200-A 21/11/12 16:41 Page107 1200 series Momentary pushbutton switches - round plunger Distinctive features and specifications ❑ Butt action contacts, double break ❑ NF EN 61058-1 , UL and CSA approved B2 ELECTRICAL SPECIFICATIONS

NT5CB256M16

Abstract: NT5CB256m16bp NT5CB512M8BN-DII NT5CC256
Contextual Info: 4Gb DDR3 SDRAM B-Die NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP CAS Latency Frequency -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Speed Bins Units tCK Parameter Min. Max. Min.

MOSFET-48V

Abstract: powr607 emmc schematic 4700uF mosfet-n EIA96 ISPPAC-POWR607 eMMC DC-DC 5V-3,3V ISPPAC-POWR1014
Contextual Info: Power 2 You 電源管理・制御の完全ガイド ボードレベルの電源管理機能 学習できるハウツーには以下が含まれます： »» 電源管理コストの低減 »» システムの信頼性を向上 »» 回路基板を改版するリスクの軽減

NT5CB256M16CP

Abstract: NT5CC256M16CP NT5CC256M16CP-DI NT5CC512M8CN DDR3-2133-CL14 NT5CB512M8CN NT5CC512M8CN-DII NT5CB512M8CN-CG NT5CB256M16 NT5CC256M16CP-DII
Contextual Info: 4Gb DDR3 SDRAM C-Die NT5CB512M8CN / NT5CB256M16CP NT5CC512M8CN / NT5CC256M16CP CAS Latency Frequency -BE* -CG* -DI/DII* -EK* -FL* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL13 DDR3-2133-CL14 Speed Bins Units tCK Parameter Min. Max. Min. Max.

NT5CB256M16BP-CG

Abstract: NT5CB256M16BP-DI
Contextual Info: 4Gb DDR3 SDRAM B­Die NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP CAS Latency Frequency -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Speed Bins Units tCK Parameter Min.

SW25-4G

Abstract: 529702B02500G SW38-4G SW63
Contextual Info: TO-220 & TO-218 & TO-247 Heat Sinks 80 8 60 6 40 4 20 2 2 SW25 SW38 4 6 Heat Dissipated—Watts 8 Air Velocity—Feet Per Minute 400 200 600 800 100 1000 10 8 60 6 40 4 20 2 2 4 6 Heat Dissipated—Watts 8 ORDERING INFORMATION “A” Dim 34.50 1.358 2.00

T10X5X5

Abstract: EER54 EE55B
Contextual Info: Magnetic Material Ind . Co., LTD Introduction & Characteristics of MnZn Ferrite cores Page1-12 Mnzn Power Material EER,ETD,RM,UYF,EP,EPC,UY,EFD,LP Page13-18 PQ,URS,UF&UI,ED,T,EI,EE Page19-26 Mnzn High Permeability Material EE,EI,EP,FT&ET,UF&UI,T,RM, Common mode choke cores applied in EMS,ET

ABB inverter motor fault code

Abstract: PT100 temperature sensor ABB motor 3AFE68735190 ACS350 ABB ACS350 3AFE68586704 ACS350 drives 3AFE68591091 03X-12A5-4 3AFE68591082
Contextual Info: ACS350 User’s Manual ACS350 Drives 0.37…22 kW, 0.5…30 HP ACS350 drive manuals OPTION MANUALS (delivered with optional equipment) FCAN-01 CANopen Adapter Module User’s Manual 3AFE68615500 (EN) FDNA-01 DeviceNet Adapter Module User’s Manual 3AFE68573360 (EN)

LT 7659

Abstract: lin bus example C codes HG123 TMXF281553BAL-2-DB SDH 209 GR-253-CORE JT-G704 JT-G706 TMXF28155 TR-62411
Contextual Info: Preliminary Data Sheet May 2001 TMXF28155 Super Mapper 155/51 Mbits/s SONET/SDH x28/x21 DS1/E1 1 Features • ■ Versatile IC supports 155/51 Mbits/s SONET/SDH interface solutions for T3/E3, DS2, T1/E1/J1, and DS0/E0/J0 applications. Implementation supports both linear 1 + 1, unprotected and ring (UPSR) network topologies.

LT 7659

Abstract: Lucent SLC 2000 installation LTE DL Channel Encoder transistor fcs 9012 GR-253-CORE JT-G704 JT-G706 TMXF28155 TR-62411 21153 specification update
Contextual Info: Preliminary Data Sheet May 2001 TMXF28155 Super Mapper 155/51 Mbits/s SONET/SDH x28/x21 DS1/E1 1 Features • ■ Versatile IC supports 155/51 Mbits/s SONET/SDH interface solutions for T3/E3, DS2, T1/E1/J1, and DS0/E0/J0 applications. Implementation supports both linear 1 + 1, unprotected and ring (UPSR) network topologies.