PAD PATTERN Search Results

sc-70 package pcb layout

Abstract: sc70-3 PCB PAD AN813 mosfet 3pin SC70-6 320 SC70-6 12 mosfet 3pin
Contextual Info: AN813 Vishay Siliconix Single-Channel LITTLE FOOTR SC-70 3-Pin and 6-Pin MOSFET Recommended Pad Pattern and Thermal Peformance INTRODUCTION BASIC PAD PATTERNS This technical note discusses pin-outs, package outlines, pad patterns, evaluation board layout, and thermal performance

Contextual Info: PAD Pattern Vishay Siliconix RECOMMENDED MINIMUM PAD FOR PowerPAIR 3 x 3 0.450 0.650 0.018 (0.026) 0.450 (0.018) 1.036 2.450 (0.096) 0.084 (0.003) (0.041) 0.209 (0.008) 0.306 (0.012) 0.562 (0.022) (0.063) 1.611 0.390 (0.015) 1.200 (0.047) Recommended PAD for PowerPAIR 3 x 3

so8 pcb pattern

Abstract: 1206-8 chipfet layout vishay so-8 pin dimensions
Contextual Info: AND8237/D Low VCE sat BJT in 1206A ChipFETt Package Recommended Pad Pattern and Thermal Performance http://onsemi.com APPLICATION NOTE INTRODUCTION Basic Pad Patterns The basic pad layout with dimensions is shown in Figure 2. This is sufficient for low VCE(sat) BJT applications,

FR4 SUBSTRATE SHEET

Abstract: 0343
Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES

DS1822X

Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES

0660H

Contextual Info: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES. SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION 5. SPECIAL NOTE: OFFSET PAD DESIGN DO NOT SHRINK OR GROW LAND PAD

QFN 5X5

Abstract: "thermal via" qfn land pattern
Contextual Info: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.5 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.17 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should

QFN 5x5

Abstract: qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"
Contextual Info: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.7 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.15 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should

Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. U N D ER FILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. NUMBER LAND PAD CONNECTIONS AND CENTER COORDINATES

SO8L

Abstract: 63818 PowerPAK SO-8L 1291
Contextual Info: PAD Pattern www.vishay.com Vishay Siliconix RECOMMENDED MINIMUM PAD FOR PowerPAK SO-8L SINGLE 5.000 0.197 0.510 (0.020) 2.310 (0.091) 4.061 (0.160) 0.595 (0.023) 6.250 (0.246) 8.250 (0.325) 3.630 (0.143) 0.610 (0.024) 0.410 (0.016) 2.715 (0.107) 0.860

Contextual Info: PAD Pattern www.vishay.com Vishay Siliconix RECOMMENDED MINIMUM PAD FOR PowerPAK SO-8L DUAL 6.7500 0.266 5.1300 (0.202) 0.4100 (0.016) 0, 0 1.7300 (0.068) 0.5000 (0.020) 1.9800 (0.078) 0.9150 (0.036) 0.5850 (0.023) 0.7200 (0.028) 2.1100 (0.083) 3.0750

underfill

Abstract: DS2415X D085-002 FR4 substrate
Contextual Info: NOTES: 1. DIMENSIDN5: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COQRDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS

MHz6025

Abstract: 280110c
Contextual Info: MICROPROCESSOR CRYSTALS AT 4.88 mm LEAD SPACING, LOW PROFILE 4-PAD ABSM 5 FEATURES: • Excellent all-purpose surface-mount crystal. • Four pad land pattern compatible with common ceramic package. APPLICATIONS: • Modems, communications and density equipment

DS2430AX

Abstract: FR4 substrate 0537
Contextual Info: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR F R 4 SUBSTRATE APPLICATION TABLE 1. PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS

Contextual Info: PAD Pattern Vishay Siliconix RECOMMENDED MINIMUM PADS FOR MINI QFN 8L 1.70 0.80 1.70 0.60 x6 0.125 typ. 0.25 x2 0.50 0.40 0.25 x6 Suggested Minimum Pad Dimensions in mm Document Number: 66555 Revision: 05-Mar-10 www.vishay.com 1

DS56X

Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] LASER MARK LANDING PAD NOT DEFINED BY SO LD ER Z. 3. MASK; FOR PAD CONNECTIONS AND COORDINATES. SE E TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS

SMD resistors

Abstract: vishay 1206 SMD resistors SMD resistors 1206 vishay 0603 SMD resistors
Contextual Info: Recommended Solder Pad Dimensions Vishay Beyschlag Surface Mount Resistors PATTERN STYLES FOR SMD RESISTORS limits for solder resistance 0.1 occupied area X Y G Z Dimensions in mm RECOMMENDED SOLDER PAD DIMENSIONS FOR FIXED LINEAR SMD RESISTORS WAVE SOLDERING

SMD resistors

Abstract: vishay 1206 SMD resistors vishay 0805 SMD resistors vishay 0603 SMD resistors vishay-beyschlag mma surface mount resistors BEYSCHLAG z 40 resistor mcs 0402 vishay 02MAR05
Contextual Info: Recommended Solder Pad Dimensions Vishay Beyschlag Surface Mount Resistors PATTERN STYLES FOR SMD RESISTORS limits for solder resistance 0.1 occupied area X Y G Z Dimensions in mm RECOMMENDED SOLDER PAD DIMENSIONS FOR FIXED LINEAR SMD RESISTORS WAVE SOLDERING

underfill

Abstract: DS2417X FR4 substrate ds2417
Contextual Info: NOTES: 1. 2. DIMENSIONS: LASER MARK MM [IN C H ] 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR CONNECTIONS AND COORDINATES, SEE TABLE 1 4. PAD UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILUMETERS

sot89 3X

Contextual Info: PAD LAYOUT DETAILS SOT23 SOT223 4.6 1 • I: 2.0 2.3 1.5 min 3x 6.8 - 0 .9 5 ~ 1 .9 -1 SOT23 pattern. Minimum Pad Size (dimensions in mm) S O T 2 2 3 p attern M in im u m Pad Sizes (d im e n s io n s in m m ) SOT89 r 2.4 4.0 1.5 -1 ,2 - ~ - 1 .C r 3.2 ^ 1 12 " ~

Contextual Info: PAD Pattern Vishay Siliconix RECOMMENDED MINIMUM PAD FOR PowerPAIR 6 x 5 7.080 0.279 2.720 (0.107) 8.080 (0.318) 5.820 (0.229) 0.407 (0.016) 0.567 (0.022) 1.960 (0.077) (0,0) 2.185 (0.086) 2.153 (0.085) 3.260 Pin 1 (0.128) 0.616 (0.024) 3.920 (0.154) 0.970

PAD Pattern

Abstract: TSSOP-16
Contextual Info: PAD Pattern www.vishay.com Vishay Siliconix RECOMMENDED MINIMUM PAD FOR TSSOP-16 0.193 4.90 0.171 0.014 0.026 0.012 (0.35) (0.65) (0.30) (4.35) (7.15) 0.281 0.055 (1.40) Recommended Minimum Pads Dimensions in inches (mm) Revision: 02-Sep-11 1 Document Number: 63550

handle

Abstract: P134 P156 T107
Contextual Info: CATALOG 126 backup:CATALOG 126.qxd 8/10/2009 9:58 AM Page 76 PCB Accessories ELECTRONICS & TECHNOLOGY, INC. A FINE TECHNOLOGY GROUP Tools & Handles Pad Cutters, Insertion Tools Shank Type A13 type Hand Insertion Tools for Push-In Terminals Pad Cutters: Vector Pad Cutters

IBM T42

Abstract: P134 P156 T107 P116C HD36B T-1523
Contextual Info: CATALOG 126:CATALOG 126.qxd 4/28/2009 8:34 AM Page 76 PCB Accessories ELECTRONICS & TECHNOLOGY, INC. A FINE TECHNOLOGY GROUP Tools & Handles Pad Cutters, Insertion Tools Shank Type A13 type Hand Insertion Tools for Push-In Terminals Pad Cutters: Vector Pad Cutters