PAD 11 Search Results
PAD 11 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| V36BEZ02307000T | Amphenol Communications Solutions | ExtremePort QSFP-DD 112G stacked SMT connector, Glue pad version | |||
| NDHN3B1 | Amphenol Communications Solutions | Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, Gold flash plating | |||
| NDHN6B1 | Amphenol Communications Solutions | Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Bulkhead, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, Gold flash plating | |||
| MSPEP6P2270 | Amphenol Communications Solutions | SPE IP67 Plug, Push Pull Lock, Solder Pad, 28 to 18 AWG, Cable OD 0.216in to 0.252in, 1 Grommet | |||
| NDHN3A7 | Amphenol Communications Solutions | Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, A Key, Plug with Solder Pad Termination, 30u\\ Pd Ni with Gold flash plating |
PAD 11 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| PAD1-100 | Sipex | Low Leakage Pico Amp Diode | Original | 25.51KB | 2 | ||
| PAD1-100 | Calogic | Low Leakage PICO Amp Diodes | Scan | 48.02KB | 2 |
PAD 11 Price and Stock
APEM Inc IPR3PAD1104Switch Push Button N.O. SPST Round Plunger 5A 48VAC 48VDC Momentary Contact Panel Mount/Through Hole PC Pins Automotive |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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IPR3PAD1104 |
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IPR3PAD1104 | Bulk | 50 |
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Buy Now | ||||||
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IPR3PAD1104 |
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Buy Now | ||||||||
Abracon Corporation AK7PAD1-125.0000T- Tape and Reel (Alt: AK7PAD1-125.0000T) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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AK7PAD1-125.0000T | Tape & Reel | 3,000 | 12 Weeks | 1,000 |
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Buy Now | ||||
Panduit Corp PAD-11645B-ASASSY,REEL COLLAR - Bulk (Alt: PAD-11645B-AS) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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PAD-11645B-AS | Bulk | 14 Weeks | 1 |
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Buy Now | |||||
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PAD-11645B-AS | 1 |
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Buy Now | |||||||
Abracon Corporation ASGTX5PAD1-100.0000TCXO 5032 8-SMD - Bulk (Alt: ASGTX5PAD1-100.0000) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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ASGTX5PAD1-100.0000 | Bulk | 100 |
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Get Quote | ||||||
Panduit Corp PAD-11606B-PGCOLLAR,REEL FRONT*PDS/PDM ** DRAWING NUMBER: 11606 - Bulk (Alt: PAD-11606B-PG) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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PAD-11606B-PG | Bulk | 14 Weeks | 1 |
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Buy Now | |||||
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PAD-11606B-PG | 1 |
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Buy Now | |||||||
PAD 11 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
AMI350XXPR
Abstract: ODCHXX16 MAP 3959 crystal oscillator 4049
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Original |
ami350xxprodchxx16map 3959crystal oscillator 4049 | |
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Contextual Info: SURFACE MOUNT TCXO & VCTCXO CRYSTAL OSCILLATORS QSMO-5400 SERIES Hy-Q International QSMO-5410 4 Pads 7.0 1.3 9.6 1.3 2 11.4 8.4 PAD CONNECTIONS 3 MARKING PAD 1: Vcont or NC 7.62 PAD 2: GROUND 7.62 1.4 PAD 3: OUT 1 4 PAD 4: +Vcc 1.9 1.85 Trimmer Access 1.4 |
Original |
qsmo-5400qsmo-5410qsmo-542010ppm+1 | |
SDA356N
Abstract: SDA180A SDA188A SDA240A SDA240B SDA280A SDA380A SDA381A SDA382A SDA39AUF
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OCR Scan |
150nssda240asda240bsda39auf+8 | |
aces_85201-20051
Abstract: Compal Electronics LS-3245P
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Original |
smt1-05ht-191uyg-dtot-723ls-3245p+3 | |
ADN2845
Abstract: 18-PAD
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Original |
18-padadn28451140m1340m | |
AMI350XXPFContextual Info: 0.35 Micron CMOS Pad Library Datasheets AMI350XXPF 3.3/5.0 Volt Section 4 Revision 1.1 PAD LIBRARY Pad Selection Guide AMI350XXPF 0.35 micron CMOS Pad Library PAD SELECTION GUIDE Input Drive Pieces Description IDCIx IDCIC IDCIT IDCR0 IDCSx IDCSC IDCST IDCXx |
Original |
ami350xxpf | |
11-365
Abstract: truth table NOT gate 74 AMI350XXPE ami-350
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Original |
ami350xxpe11-365truth table not gate 74ami-350 | |
Sil-Pad 400®Contextual Info: SIL-PAD 400 The Original Fiberglass Based Sil-Pad SIL-PAD 400 Sil-Pad 400 is the original Sil-Pad material. Sil-Pad 400 is a composite of silicone rubber and fiberglass. It is flame retardant and is specially formulated for use as a thermally conductive insulator. Primary use is to electrically isolate |
Original |
sp-r-0022asil-pad 400 | |
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Contextual Info: PART NUMBER REV. LD D -S M A 2004R I-T R B UNCONTROLLED DOCUMENT 12,96 [0,510] - PAD 20 3 '00 C0.118] — 0,80 [0,031] 1,44 [0,057] 9 P L S . fw rm r n m ri 1 0,90 [0,035] <20 P L S ,) REV. A B PAD 11 8,00 [0,315] PAD m PAD 10 R0.325 [R0.013] |
OCR Scan |
ldd-sma2004ri-tr | |
4510
Abstract: HY-Q 4510 datasheet 4540 top marking QSMO-4510 QSMO-4520 QSMO-4530 QSMO-4540
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Original |
qsmo-4510qsmo-4530qsmo-4540qsmo-4520+4 | |
NASA SP-R-0022A
Abstract: SP-R-0022A ASTM D 2240 ASTM-D412 SIL-PAD 600 SP-R0022A SIL-PAD SPR-0022A astm 412 IN4500
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Original |
sp-r-0022anasa sp-r-0022aastm d 2240astm-d412+6 | |
CTC 1351
Abstract: CTC 1351 transistor transistor ctc 1351 CTC 1351 data sheet smooth l725 Oriole Alcoa full tension sleeve STR S 6531 L726 P724
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Original |
ctc 1351ctc 1351 transistortransistor ctc 1351ctc 1351 data sheet+6 | |
Fryer Filter MediaContextual Info: PROJECT QUANTITY ITEM NO SuperSorb pad PHT envelope SmartFilter pad and paper Fryer Filter Media ® Above: SuperSorb® filter pad Above right: SuperSorb® filter pad in pad holder SuperSorb filter pads are composed of a unique filtration medium that combines |
Original |
fryer filter media | |
17417Contextual Info: SOT-23-Pad VISHAY Vishay Semiconductors Mounting Pad Layout 0.8 0.031 0.9 (0.035) 2.0 (0.079) 0.95 (0.037) 0.95 (0.037) 17417 Document Number 84007 Rev. 1.1, 11-Dec-03 www.vishay.com 1 SOT-23-Pad VISHAY Vishay Semiconductors Ozone Depleting Substances Policy Statement |
Original |
ot-23-pad11-dec-03d-7402517417 | |
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TN0702Contextual Info: Supertex inc. TN0702 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 65 50 11.0 ± 1.5 Au (mils) TN0702 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
tn0702a031710 | |
TP0620Contextual Info: Supertex inc. TP0620 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 45 45 11 ± 1.5 Au (mils) TP0620 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
tp0620a031610 | |
ami-350
Abstract: AMI350XXPE cmos 4026
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Original |
ami350xxpe33mhzami-350cmos 4026 | |
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Contextual Info: UNCONTROLLED DOCUMENT - 12,96 [0,510] - 3,00 [0,118] 1,44 [0,057] 9 PLS. PAD 20 PART NUMBER LDD-SM C2003RI-SY — 0,80 [0,031] 0 REV. A PAD 11 PARAMETER cr. IT) m m MIN PAD 10 R0.325 [R0.013] <20 PLS.) [EAD FR EE REF[QW PROFILE 2.0 Vf Vr |
OCR Scan |
ldd-smc2003ri-sy10ojua | |
VP0808Contextual Info: Supertex inc. VP0808 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 45 45 11 ± 1.5 Au (mils) VP0808 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
vp0808a031610 | |
HV93
Abstract: HV94 HV97 HV98
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OCR Scan |
hv93/hv94hv97/hv98hvout32hvout31+6 | |
TN2435Contextual Info: Supertex inc. TN2435 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) TN2435 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
tn2435a031610 | |
DN2470Contextual Info: Supertex inc. DN2470 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) DN2470 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
dn2470a031610 | |
VN2410Contextual Info: Supertex inc. VN2410 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) VN2410 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
vn2410a031610 | |
TN2510Contextual Info: Supertex inc. TN2510 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN2510 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
tn2510a031610 | |