PAD 11 Search Results
PAD 11 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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V36BEZ02307000T |
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ExtremePort QSFP-DD 112G stacked SMT connector, Glue pad version | |||
TPA3250D2DDW |
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70W Stereo / 130W Peak Ultra-HD, Analog-In, Pad-Down Class-D Amplifier 44-HTSSOP 0 to 70 |
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TPA3244DDWR |
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60W Stereo / 110W Peak Ultra-HD Analog-In, Pad-Down Class-D Amplifier 44-HTSSOP 0 to 70 |
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TPA3244DDW |
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60W Stereo / 110W Peak Ultra-HD Analog-In, Pad-Down Class-D Amplifier 44-HTSSOP 0 to 70 |
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TPA3250D2DDWR |
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70W Stereo / 130W Peak Ultra-HD, Analog-In, Pad-Down Class-D Amplifier 44-HTSSOP 0 to 70 |
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PAD 11 Datasheets (2)
Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
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PAD1-100 | Sipex | Low Leakage Pico Amp Diode | Original | 25.51KB | 2 | ||
PAD1-100 |
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Low Leakage PICO Amp Diodes | Scan | 48.02KB | 2 |
PAD 11 Price and Stock
APEM Inc IPR3PAD1104SWITCH PUSH SPST-NO 0.5A 48V |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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IPR3PAD1104 | Tray | 50 |
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Buy Now | ||||||
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IPR3PAD1104 | 24 |
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IPR3PAD1104 | Bulk | 50 |
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IPR3PAD1104 |
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Panduit Corp PAD-11645B-ASASSY,REEL COLLAR |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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PAD-11645B-AS | Bulk | 1 |
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PAD-11645B-AS | Bulk | 1 |
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PAD-11645B-AS | 1 |
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Panduit Corp PAD-11606B-PGCOLLAR,REEL FRONT*PDS/PDM |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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PAD-11606B-PG | Bulk | 1 |
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PAD-11606B-PG | Bulk | 1 |
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PAD-11606B-PG | 1 |
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Panduit Corp PAD-11664C-ASWIRE MANAGEMENT |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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PAD-11664C-AS | Bulk |
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Abracon Corporation AK2PAD1-156.2500T3XTAL OSC XO 156.25MHZ 3.3V LVPEC |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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AK2PAD1-156.2500T3 | Reel |
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PAD 11 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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AMI350XXPR
Abstract: ODCHXX16 MAP 3959 crystal oscillator 4049
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AMI350XXPR ODCHXX16 MAP 3959 crystal oscillator 4049 | |
Contextual Info: SURFACE MOUNT TCXO & VCTCXO CRYSTAL OSCILLATORS QSMO-5400 SERIES Hy-Q International QSMO-5410 4 Pads 7.0 1.3 9.6 1.3 2 11.4 8.4 PAD CONNECTIONS 3 MARKING PAD 1: Vcont or NC 7.62 PAD 2: GROUND 7.62 1.4 PAD 3: OUT 1 4 PAD 4: +Vcc 1.9 1.85 Trimmer Access 1.4 |
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QSMO-5400 QSMO-5410 QSMO-5420 QSMO-5410 QSMO-5420 10ppm 14ppm | |
SDA356N
Abstract: SDA180A SDA188A SDA240A SDA240B SDA280A SDA380A SDA381A SDA382A SDA39AUF
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OCR Scan |
150ns SDA240A SDA240B SDA39AUF SDA40AHF SDA180A SDA280A SDA380A SDA381A SDA382A SDA356N SDA188A SDA240A SDA240B | |
aces_85201-20051
Abstract: Compal Electronics LS-3245P
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SMT1-05 HT-191UYG-DT OT-723 OT-723 LS-3245P 4059CB aces_85201-20051 Compal Electronics LS-3245P | |
ADN2845
Abstract: 18-PAD
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18-Pad ADN2845 1140m 1340m ADN2845 | |
AMI350XXPFContextual Info: 0.35 Micron CMOS Pad Library Datasheets AMI350XXPF 3.3/5.0 Volt Section 4 Revision 1.1 PAD LIBRARY Pad Selection Guide AMI350XXPF 0.35 micron CMOS Pad Library PAD SELECTION GUIDE Input Drive Pieces Description IDCIx IDCIC IDCIT IDCR0 IDCSx IDCSC IDCST IDCXx |
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AMI350XXPF | |
11-365
Abstract: truth table NOT gate 74 AMI350XXPE ami-350
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AMI350XXPE 11-365 truth table NOT gate 74 ami-350 | |
Sil-Pad 400®Contextual Info: SIL-PAD 400 The Original Fiberglass Based Sil-Pad SIL-PAD 400 Sil-Pad 400 is the original Sil-Pad material. Sil-Pad 400 is a composite of silicone rubber and fiberglass. It is flame retardant and is specially formulated for use as a thermally conductive insulator. Primary use is to electrically isolate |
Original |
SP-R-0022A Sil-Pad 400® | |
Contextual Info: PART NUMBER REV. LD D -S M A 2004R I-T R B UNCONTROLLED DOCUMENT 12,96 [0,510] - PAD 20 3 '00 C0.118] — 0,80 [0,031] 1,44 [0,057] 9 P L S . fw rm r n m ri 1 0,90 [0,035] <20 P L S ,) REV. A B PAD 11 8,00 [0,315] PAD m PAD 10 R0.325 [R0.013] |
OCR Scan |
LDD-SMA2004RI-TR | |
4510
Abstract: HY-Q 4510 datasheet 4540 top marking QSMO-4510 QSMO-4520 QSMO-4530 QSMO-4540
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QSMO-4510 QSMO-4530 QSMO-4540 QSMO-4520 4510 HY-Q 4510 datasheet 4540 top marking QSMO-4510 QSMO-4520 QSMO-4530 QSMO-4540 | |
NASA SP-R-0022A
Abstract: SP-R-0022A ASTM D 2240 ASTM-D412 SIL-PAD 600 SP-R0022A SIL-PAD SPR-0022A astm 412 IN4500
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SP-R-0022A NASA SP-R-0022A SP-R-0022A ASTM D 2240 ASTM-D412 SIL-PAD 600 SP-R0022A SIL-PAD SPR-0022A astm 412 IN4500 | |
CTC 1351
Abstract: CTC 1351 transistor transistor ctc 1351 CTC 1351 data sheet smooth l725 Oriole Alcoa full tension sleeve STR S 6531 L726 P724
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Fryer Filter MediaContextual Info: PROJECT QUANTITY ITEM NO SuperSorb pad PHT envelope SmartFilter pad and paper Fryer Filter Media ® Above: SuperSorb® filter pad Above right: SuperSorb® filter pad in pad holder SuperSorb filter pads are composed of a unique filtration medium that combines |
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17417Contextual Info: SOT-23-Pad VISHAY Vishay Semiconductors Mounting Pad Layout 0.8 0.031 0.9 (0.035) 2.0 (0.079) 0.95 (0.037) 0.95 (0.037) 17417 Document Number 84007 Rev. 1.1, 11-Dec-03 www.vishay.com 1 SOT-23-Pad VISHAY Vishay Semiconductors Ozone Depleting Substances Policy Statement |
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OT-23-Pad 11-Dec-03 D-74025 17417 | |
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TN0702Contextual Info: Supertex inc. TN0702 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 65 50 11.0 ± 1.5 Au (mils) TN0702 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
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TN0702 TN0702 A031710 | |
TP0620Contextual Info: Supertex inc. TP0620 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 45 45 11 ± 1.5 Au (mils) TP0620 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
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TP0620 TP0620 A031610 | |
ami-350
Abstract: AMI350XXPE cmos 4026
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AMI350XXPE 33MHz ami-350 cmos 4026 | |
Contextual Info: UNCONTROLLED DOCUMENT - 12,96 [0,510] - 3,00 [0,118] 1,44 [0,057] 9 PLS. PAD 20 PART NUMBER LDD-SM C2003RI-SY — 0,80 [0,031] 0 REV. A PAD 11 PARAMETER cr. IT) m m MIN PAD 10 R0.325 [R0.013] <20 PLS.) [EAD FR EE REF[QW PROFILE 2.0 Vf Vr |
OCR Scan |
LDD-SMC2003RI-SY 10OjuA | |
VP0808Contextual Info: Supertex inc. VP0808 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 45 45 11 ± 1.5 Au (mils) VP0808 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
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VP0808 VP0808 A031610 | |
HV93
Abstract: HV94 HV97 HV98
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OCR Scan |
HV93/HV94 HV97/HV98 HVOUT32 HVOUT32 HVOUT31 HVOUT31 HVOUT30 HVOUT30 HVOUT29 HVOUT29 HV93 HV94 HV97 HV98 | |
TN2435Contextual Info: Supertex inc. TN2435 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) TN2435 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
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TN2435 TN2435 A031610 | |
DN2470Contextual Info: Supertex inc. DN2470 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) DN2470 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
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DN2470 DN2470 A031610 | |
VN2410Contextual Info: Supertex inc. VN2410 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) VN2410 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
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VN2410 VN2410 A031610 | |
TN2510Contextual Info: Supertex inc. TN2510 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN2510 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
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TN2510 TN2510 A031610 |