PACKING INFORMATION Search Results

VSSOP8

Contextual Info: P8 SO VS SOT765-1 VSSOP8; Reel pack, reverse; SMD, 7" Q3/T4 Standard product orientation Orderable part number ending ,125 or H Ordering code 12NC ending 125 Rev. 5 — 3 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel

Contextual Info: TS SO P5 SOT353-1 TSSOP5; Reel pack; SMD, 7"; Q3 Reversed product orientation; Orderable part number ending, 125 or H; Ordering code 12NC ending 125 Rev. 1 — 13 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: TS SO P4 8 SOT362-1 TSSOP48; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 5 — 15 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape

chip Capacitors 100 nf X7R

Abstract: B37987F1104K0 ceramic capacitor of 220 nF B37979N ammo packing drawing B37981F5332K0 B37987F5154K0 B37987F1473K
Contextual Info: Multilayer Ceramic Capacitors Leaded Leaded Capacitors Ordering code system B37979N 1 100 K 54 Packaging 51 ^ cardboard tape, reel packing 360-mm reel 54 ^ Ammo packing (standard) 00 ^ bulk Internal coding Capacitance tolerance J ^ ± 5 % (standard for C0G)

2220 footprint

Abstract: C0603JR 1808 FOOTPRINT YNM0015
Contextual Info: DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS Product Specification – November 12, 2012 V.17 General data Product specification Surface-Mount Ceramic Multilayer Capacitors 2 2 General data PACKING TAPE AND REEL SPECIFICATIONS Packing conforms fully with “IEC 60286-3”, “EIA 481-1”

B37979N

Abstract: B37986
Contextual Info: Multilayer Ceramic Capacitors Leaded C0G, X7R, Z5U Y5U Ordering code system B37979N 1 100 K 54 Packaging 51 ^ cardboard tape, reel packing (360-mm reel) 54 ^ Ammo packing (standard) 00 ^ bulk Internal coding Capacitance tolerance J ^ ± 5% K ^ ± 10 % (standard for C0G)

transistor ka7812

Abstract: G1N60 TO-264 corrugated box 7103 corrugated packaging KA7812 INTEGRATED CIRCUIT TO-264 weight
Contextual Info: TO-264 Tube Packing Data TO-264 Tube Packing Configuration: Figure 1.0 25 units per Tube F G1N60 RUFD113 Packaging Description: Bubble Sheet 15 Tubes per box TO-264 parts are shipped in tube. The tube is made of PVC plastic treated with anti-static agent.These tubes in

G40N60

Abstract: G40N60UF g40n60uf circuit g40n60u 7103 KA7812 KA7812 INTEGRATED CIRCUIT transistor ka7812
Contextual Info: TO-3PF Tube Packing Data TO-3PF Tube Packing Configuration: Figure 1.0 30 units per Tube Packaging Description: F G40N60UF 113 Bubble Sheet 12 Tubes per box TO-3PF parts are shipped in tube. The tube is made of PVC plastic treated with anti-static agent.These tubes in

switch smd

Abstract: B3FS-1000 B3FS-1000P B3FS-1002 B3FS-1002P
Contextual Info: Mechanical Key Switch SMD B3FS Surface-mounting Switches Ideal for High-density Mounting Tape packing style also available. Allows reflow soldering. Incorporates a snap-action contact mechanism that ensures sharp switching operations. Ordering Information

TACTILE SWITCH SPST FLAT

Abstract: B3FS-1000 B3FS-1000P B3FS-1002 B3FS-1002P B3FS-1010 B3FS-1012P B3FS-1050 B3FS-1050P B3FS-1052
Contextual Info: Tactile Switch SMD Type B3FS Surface-mounting Switches Ideal for High-density Mounting • Tape packing style also available. ■ Allows reflow soldering. ■ Incorporates a snap-action contact mechanism that ensures sharp switching operations. Ordering Information

lt 719

Abstract: Allegro Packing Tape Dimensions A1441
Contextual Info: A1441 Low-Voltage Full-Bridge Brushless DC Motor Driver with Hall Element Commutation Datasheet Addendum This addendum details the packing specifications for the EL package 2 mm x 2 mm footprint to the information offered in the main datasheet for these devices.

TE32D

Abstract: EIA and EIAJ tape standards TE3212 EIA and EIAJ standards RC-1009B TA7745
Contextual Info: 6. PACKING INFORMATION To deliver flat IC packages, three package method are available: the same stick packages as the ordinary DIP type, taping, and embossed taping. 6-1 Stick Specifications for Flat Packages • Shape and dimensions Example: FLP type Fig. 6-1

Contextual Info: RECOMMENDED MOUNTING METHOD RECOMMENDED MOUNTING METHOD Soldering Methods, Recommended Soldering Method for Moisture-Proof Packing and Flux Cleaning are in the following. Mounting was evaluated with the following profiles in our company, so there was no problem.

Contextual Info: Freescale Semiconductor User’s Guide Document Number: KT33814UG Rev. 2.0, 4/2013 KIT33814AEEVBE Evaluation Board Featuring the MC33814 Two Cylinder Small Engine Control IC Figure 1. KIT33814AEEVBE Evaluation Board Table of Contents 1 Kit Contents / Packing List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

MMBT2222A

Abstract: MMBT2907A marking M22 MMBT2222A SOT23 transistor M22 marking
Contextual Info: MMBT2222A SMALL SIGNAL NPN TRANSISTOR PRELIMINARY DATA • ■ ■ ■ Type Marking MMBT2222A M22 SILICON EPITAXIAL PLANAR NPN TRANSISTOR MINIATURE SOT-23 PLASTIC PACKAGE FOR SURFACE MOUNTING CIRCUITS TAPE & REEL PACKING THE PNP COMPLEMENTARY TYPE IS MMBT2907A

na 39

Abstract: SO2222A SO2907A
Contextual Info: SO2222A SMALL SIGNAL NPN TRANSISTOR PRELIMINARY DATA • ■ ■ ■ Type Marking SO2222A N20 SILICON EPITAXIAL PLANAR NPN TRANSISTOR MINIATURE SOT-23 PLASTIC PACKAGE FOR SURFACE MOUNTING CIRCUITS TAPE & REEL PACKING THE PNP COMPLEMENTARY TYPE IS SO2907A

Contextual Info: ESMT M52S64164A Revision History Revision 1.0 Feb. 07, 2007 -Original Revision 1.1 (Apr. 20, 2007) - Delete BGA ball name of packing dimensions Revision 1.2 (Sep. 10, 2007) - Add -7.5 spec Revision 1.3 (Mar.11, 2008) - Modify ICC spec - Modify AC parameters

Contextual Info: ESMT M52D64322A Revision History Revision 1.0 Jan. 19, 2007 -Original Revision 1.1 (Mar. 03, 2007) - Delete BGA ball name of packing dimensions Revision 1.2 (Oct. 08, 2007) - Modify DC/AC characteristics Elite Semiconductor Memory Technology Inc. Publication Date: Oct. 2007

P025H

Abstract: marking 642 STF42 STF92 transistor marking 551 sot-89
Contextual Info: STF42 SMALL SIGNAL NPN TRANSISTOR PRELIMINARY DATA • ■ ■ ■ Type Marking STF42 642 SILICON EPITAXIAL PLANAR NPN HIGH VOLTAGE TRANSISTOR MINIATURE SOT-89 PLASTIC PACKAGE FOR SURFACE MOUNTING CIRCUITS TAPE AND REEL PACKING THE PNP COMPLEMENTARY TYPE IS

marking 36

Abstract: MMBT3906 TRANSISTOR MINIATURE MMBT3904 MMBT3906 36 MMBT3906 SOT-23
Contextual Info: MMBT3906 SMALL SIGNAL PNP TRANSISTOR PRELIMINARY DATA • ■ ■ ■ Type Marking MMBT3906 36 SILICON EPITAXIAL PLANAR PNP TRANSISTOR MINIATURE SOT-23 PLASTIC PACKAGE FOR SURFACE MOUNTING CIRCUITS TAPE AND REEL PACKING THE NPN COMPLEMENTARY TYPE IS MMBT3904

1GW NPN

Abstract: 1FW ST 1FW 07 1FW transistor marking 1gw marking 1FW 1FW npn 1fw 02 1FW marking BC847CW
Contextual Info: BC847BW BC847CW SMALL SIGNAL NPN TRANSISTORS PRELIMINARY DATA • ■ ■ ■ Type Marking BC847BW 1FW BC847CW 1GW SILICON EPITAXIAL PLANAR NPN TRANSISTORS MINIATURE SOT-323 PLASTIC PACKAGE FOR SURFACE MOUNTING CIRCUITS TAPE AND REEL PACKING BC847BW - THE PNP COMPLEMENTARY

P025H

Abstract: STF42 STF92 transistor marking 551 sot-89
Contextual Info: STF92 SMALL SIGNAL PNP TRANSISTOR PRELIMINARY DATA • ■ ■ ■ Type Marking STF92 692 SILICON EPITAXIAL PLANAR PNP HIGH VOLTAGE TRANSISTOR MINIATURE SOT-89 PLASTIC PACKAGE FOR SURFACE MOUNTING CIRCUITS TAPE AND REEL PACKING THE NPN COMPLEMENTARY TYPE IS

Contextual Info: T53Y Vishay Sfernice Miniature Trimmer Single-Turn Cermet FEATURES • Fully sealed • 0.25 Watt at 70 °C • Excellent stability • Wide ohmic range • Low temperature coefficient • Low contact resistance variation • Small size for optimum packing density

P025H

Abstract: BF620 BF621
Contextual Info: BF621 SMALL SIGNAL PNP TRANSISTOR PRELIMINARY DATA • ■ ■ ■ Type Marking BF621 621 SILICON EPITAXIAL PLANAR PNP HIGH VOLTAGE TRANSISTOR MINIATURE SOT-89 PLASTIC PACKAGE FOR SURFACE MOUNTING CIRCUITS TAPE AND REEL PACKING THE NPN COMPLEMENTARY TYPE IS