PACKING Search Results

Contextual Info: Taping Specifications TPS Packing Packing format Taping specification display # i Applicable package type Dimensions Unit: mm Packing unit O uiine 12 7 TP Ammo type 1 1 Ù n J - f f l ill , 2 ) 0 9 O/ 2000pcs /carton li211 TPS SOT-89 Packing Packing format

TE32D

Abstract: EIA and EIAJ tape standards TE3212 EIA and EIAJ standards RC-1009B TA7745
Contextual Info: 6. PACKING INFORMATION To deliver flat IC packages, three package method are available: the same stick packages as the ordinary DIP type, taping, and embossed taping. 6-1 Stick Specifications for Flat Packages • Shape and dimensions Example: FLP type Fig. 6-1

35502a

Contextual Info: 2A01G - 2A07G CREAT BY ART Pb 2.0 AMPS. Glass Passivated Rectifiers DO-15 RoHS COMPLIANCE Features Glass passivated chip junction High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing

oeg relay 6vdc

Abstract: 3-1461491-6 3-1461491-3 PCN-112D3MHZ PCN-124D3MHZ
Contextual Info: General Purpose Relays PCB Relays OEG Slimline PCB Relay PCN n 1 pole 3 A, 1 form A NO contact 5mm wide n 3A switching current, load range 1mA up to 5A n Sensitive coil 120mW n Allows high function-/packing density n Cadmium-free contacts n Z type with reinforced insulation

LST67B

Contextual Info: VLM.33. www.vishay.com Vishay Semiconductors Power SMD LED PLCC-2 FEATURES • Utilizing AS AlInGaP technology • Available in 8 mm tape • Luminous intensity and color categorized per packing unit • Luminous intensity ratio per packing unit IVmax./IVmin. ≤ 1.6

F MARKING 6PIN

Abstract: k937
Contextual Info: S A ftm 5/6-Pin CPs FC Series The Sanyo 5/6-pin chip packs are small-sized packages that facilitate higher-density mounting. We have various Packings that meet automatic mounting requirements. ale FETs for LF Amp General-purpose Amp, Differential Amp Applications

Contextual Info: Data sheet from 02.06.2010 Item no.: 231-110/026-000 Product description: FEMALE CONNECTOR 10 POLE PIN SPACING 5 MM / 0.197 IN WITH CODING FINGERS WITH INTEGRATED FIXING FLANGES Packing unit 50 pieces Product group 3 Multi Conn. System Weight 18 g Color

Contextual Info: Data sheet from 23.02.2012 Item no.: 733-203 Product description: MALE CONNECTOR 3 POLE PIN SPACING 2.5 MM / 0.098 IN 100% PROTECTED AGAINST MISMATING Produkt kann von Bild abweichen / product may differ Packing unit 200 pieces RoHS compliant Weight 1.71 g

Contextual Info: Data sheet from 16.07.2010 Item no.: 773-114 Product description: PUSH-WIRE CONNECTOR FOR JUNCTION BOXES 4CONDUCTOR TERMINAL BLOCK Produkt kann von Bild abweichen / product may differ Packing unit 100 pieces Product group 7 Push Wire Conn. pole count 4 Cross section [mm²]

gem 65

Abstract: modbus wago
Contextual Info: Data sheet from 20.06.2012 Item no.: 750-842 Product description: ETHERNET TCP/IP PROGRAMMABLE FIELDBUS CONTROLLER 10 MBit/s DIGITAL AND ANALOG SIGNALS Produkt kann von Bild abweichen / product may differ Packing unit 1 piece RoHS compliant Product group 15 I/O System

wago 769

Contextual Info: Data sheet from 26.05.2010 Item no.: 769-110/022-000 Product description: 1-CONDUCTOR ANGLED FEMALE PLUG FOR USE WITH RECEPTACLE TERMINAL BLOCKS OF SERIES 769 AND 870 OR MALE CONNECTORS 10 POLE WITH CODING FINGERS Packing unit 50 pieces Product group 18 X-COM-SYSTEM

WAGO 734

Contextual Info: Data sheet from 18.08.2011 Item no.: 734-231 Product description: Operating tool for socket and plug connectors with CAGE CLAMP connector for Series 734 Produkt kann von Bild abweichen / product may differ Packing unit 100 4*25 pieces RoHS compliant Product group

Contextual Info: Data sheet from 28.09.2010 Item no.: 216-224 Product description: SCREWLESS END STOP SLEEVE FOR 1.5 MM² / AWG 16 INSULATED ELECTROLYTIC COPPER Produkt kann von Bild abweichen / product may differ Packing unit 1000 pieces Strip length to 8 mm Product group

000-023 Wago

Contextual Info: Data sheet from 17.01.2012 Item no.: 793-5501 Product description: WMB MULTI MARKING SYSTEM PLAIN FOR WIDTH 5 - 17.5 MM STRETCHABLE 5 - 5.2 MM 10 STRIPS á 10 MARKERS FOR EACH CARD Produkt kann von Bild abweichen / product may differ Packing unit 5 cards RoHS compliant

2SB1589

Contextual Info: Transistors SMD Type Silicon PNP Epitaxial Planar Type 2SB1589 Features Low collector to emitter saturation voltage VCE sat . Large collector power dissipation PC. Mini Power type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine

2SB709A

Abstract: marking Bq sot23 hFE CLASSIFICATION Marking MARKING BQ marking BS SOT-23
Contextual Info: Transistors IC SMD Type Silicon PNP Epitaxial Planar Type 2SB709A Features SOT-23 Unit: mm +0.1 2.9-0.1 +0.1 0.4-0.1 High forward current transfer ratio hFE. +0.1 1.3-0.1 +0.1 2.4-0.1 automatic insertion through the tape packing and the magazine 0.4 3 Mini type package, allowing downsizing of the equipment and

2SB710A

Contextual Info: Transistors IC SMD Type Silicon PNP Epitaxial Planar Type 2SB710A SOT-23 Features Unit: mm +0.1 2.9-0.1 +0.1 0.4-0.1 Large collector current IC. 1 0.55 insertion through the tape packing and the magazine packing. +0.1 1.3-0.1 +0.1 2.4-0.1 Mini type package, allowing downsizing of the equipment and automatic

2SB1073

Contextual Info: Transistors SMD Type Silicon PNP Epitaxial Planar Type 2SB1073 Features Low collector-emitter saturation voltage VCE sat Large peak collector current ICP Mini Power type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine

DR341

Abstract: DATATRON
Contextual Info: February 27, 2007 SELF-LEADED SMD INDUCTOR DR341 SERIES Features z z z z z z Low Profile Surface Mount Design Flat Top for Pick and Place Inductance Range from 26µH to 260µH Tape & Reel Packing Operating Temp. -40°C to +85°C Tinned Leads with Leaded Solder is Available note 3

LWT67

Contextual Info: VLMW33. Vishay Semiconductors Power SMD LED PLCC-2 FEATURES • High efficient InGaN technology • Chromaticity coordinate categorized acc. to CIE1931 per packing unit • Typical color temperature 5500 K • ESD-withstand voltage: up to 1 kV according to JESD22-A114-B

BAS40CGP

Contextual Info: CHENMKO ENTERPRISE CO.,LTD BAS40CGP SURFACE MOUNT SCHOTTKY DIODE VOLTAGE 40 Volts CURRENT 0.2 Ampere APPLICATION * Ultra high speed switching FEATURE * Small surface mounting type. SOT-23 * High speed. (TRR=2.5nSec Typ.) * Suitable for high packing density.

TQ2S-12

Abstract: 5v relay 8 pin 30v dc 125v ac TQ-SMD 5 pin 12v relay connection smd transistor 079 TQ2SA-12V
Contextual Info: TQ SMD LOW-PROFILE SURFACE-MOUNT RELAY 14 .551 TQ SMD RELAYS FEATURES 9 .354 5.6 .220 mm inch • Low-profile: 6 mm .236 inch Tape height: max. 6.5 mm .256 inch • Tape and reel package is available as standard packing style • Surge withstand between contacts and coil: 2,500 V

ST-300

Abstract: MMBT3906 SOT-23
Contextual Info: MMBT3906 SMALL SIGNAL PNP TRANSISTOR PRELIMINARY DATA • Type Marking MMBT3906 36 SILICON EPITAXIAL PLANAR PNP TRANSISTOR MINIATURE SOT-23 PLASTIC PACKAGE FOR SURFACE MOUNTING CIRCUITS TAPE AND REEL PACKING THE NPN COMPLEMENTARY TYPE IS MMBT3904 s

Contextual Info: APT30M85SVR 40A 0.085Ω 300V POWER MOS V Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect, increases packing density and reduces the on-resistance. Power MOS V also achieves faster switching speeds through optimized gate layout.