PACKAGE TRAY Search Results

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

oki qfp tray

Abstract: Ultrasonic humidifier circuit 750H OKI Year Work Week "the package information document consisting of 8 chapters in total" Oki Moisture Oki Moisture level
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE This document is Chapter 3 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE

28F160

Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
Contextual Info: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than

Contextual Info: SIEMENS 6 SD A 5642-6/X Package Outlines P-DSO-20-1 Plastic Dual Small Outline Package 1,27 0.85•to* a 41MÌ 20x 1) Does not Include plastic or metal protrusion of 0.15 max. per side 2) Does not Include damber protrusion to CL O Sorts of Packing Package outlines for tubes, trays etc. are contained in our

FET SOT-89

Abstract: 74 Series Logic ICs xc62a sot89 fet XC62C fet sot89 XC61B XB15A407 XP151A21A2MR XC62D
Contextual Info: Status of Obsolescence No. Product Status Product Series Classification Package 1 Discontinued Product XB15A105 Diode PIN Small Glass Package 2 Discontinued Product XB15A204 Diode(PIN) Small Glass Package 3 Discontinued Product XB15A301 Diode(PIN) Small Glass Package

360-200

Abstract: 3000VRMS
Contextual Info: THT COMMON MODE CHOKES - TWO PHASE 3000Vrms Isolation - PB01XX Series Height: 38.8mm Package 1 43.2mm (Package 2) Footprint: 35.6 x 15.6mm (Package 1) 45.7 x 21.6mm (Package 2) Current Range: up to 23.4Adc Dielectric strength: 3000Vrms (with 3.0mm creepage)

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Contextual Info: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses

CC7V-T1A

Abstract: SMT Crystal 32.768 KHZ Microcrystal CC7V-T1A t1A transistor smd CH-2540 cc7v-t1a 32.768
Contextual Info: CC7V-T1A Tuning Fork Crystal 32.768 kHz DIMENSIONS Package: Recommended Solder Pad: 3,2 1,0 1,5 1,8 0,7 max.0,90 1,5 0,7 1,0 100% leadfree, RoHS - compliant Miniature SMT ceramic package Package height 0.90 mm SMD-package in Tape and Reel Ind. and Ext. temperature ranges

Contextual Info: _LL PACKAGING TRAY-STANDARD PACKAGE 1000 TAPE AND REEL 54.00 50.2 42.545 - TRAY-STANDARD PACKAGE 200 H— .635 67X 2.9 .280 — |f-~ (68X) A II TAPE AND REEL 14.9 Propriete <te B£RC ELECTRONICS. Droits de reproduction BERG ELECTRONICS INC.

smd transistor t1A

Abstract: t1A transistor smd CH-2540
Contextual Info: CC5V-T1A Tuning Fork Crystal 32.768 kHz DIMENSIONS Package: Recommended Solder Pad: 4,1 2,3 1,1 0,7 max. 0,90 1,9 1,5 0,7 1,1 100% leadfree, RoHS - compliant Miniature SMT ceramic package Package height 0.90 mm SMD-package in Tape and Reel Ind. and Ext. temperature ranges

SOC008

Abstract: SOA008 w366
Contextual Info: ‹ Chapter 5 Trays Small Outline Package: SOA 008 w3669 / f29362c / 1.3.8 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 15 Aug 2007 5-97 ‹ Chapter 5 Trays Small Outline Package: SOA 008

CC4V-T1A 32.768 Khz

Abstract: t1A transistor smd 32,768 SMD crystal Component CC4V-T1A smd package CH-2540 CC4V-T1A
Contextual Info: CC4V-T1A Tuning Fork Crystal 30 kHz – 1.0 MHz DIMENSIONS Package: Recommended Solder Pad: 5,0 1,3 2,9 1,3 0,9 max.0,9 2,2 1,9 0,9 All dimensions in mm typical 100% leadfree, RoHS - compliant Miniature SMT ceramic package Package height 0.90 mm SMD-package in Tape and Reel

t1A transistor smd

Abstract: CH-2540 CC1V
Contextual Info: CC1V-T1A Tuning Fork Crystal 10 kHz – 2.1 MHz DIMENSIONS Package: Recommended Solder Pad: 8,0 1,2 2,7 4,0 2,3 2,3 4,2 max.1,75 3,7 1,2 All dimensions in mm typical 100% leadfree, RoHS - compliant Small SMT ceramic package Package height 1.75 mm SMD-package in Tape and Reel

t1A transistor smd

Abstract: CH-2540 CC4V-T1A 32.768 Khz
Contextual Info: CC4V-T1A Tuning Fork Crystal 30 kHz – 1.0 MHz DIMENSIONS Package: Recommended Solder Pad: 5,0 1,3 2,9 1,3 0,9 max.0,9 2,2 1,9 0,9 All dimensions in mm typical 100% leadfree, RoHS - compliant Miniature SMT ceramic package Package height 0.90 mm SMD-package in Tape and Reel

Lucent Technologies LGX

Abstract: siecor
Contextual Info: Page 1 of 1 250µm 1 x 2 Fiber Optic Coupler Package Type S Features and Benefits • Primary coupler package. • Ideal for fusion splicing and confined space applications. • Fits into existing splice trays. • Dimensions: 3.7mm 0.14” ; length 47mm (1.77”).

3p connector

Abstract: 3p transistor
Contextual Info: miniSD Card Connector SERIES miniSD Card Connector EXCEPT CARD CLEARANCE 5338 ＣＡＲＤ LOCK POSITION 注文コード ORDERING CODE 1X 5338 011 1X0 862 + RoHS 対応品 RoHS Compliant Product 0: With Boss 1: Without Boss 4: Tape & Reel Package 9: Tray Package

Quad flat package

Abstract: all transistor chapter
Contextual Info: ‹ Chapter 5 Trays Plastic Quad Flat Package: PQR 080 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 15 Aug 2007 5-7 ‹ Chapter 5 Trays Plastic Quad Flat Package: PQR 080 Notes: 1 All dimensions are in millimeters

A7647

Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
Contextual Info: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package

transistors handbook

Abstract: UNE008
Contextual Info: ‹ Chapter 5 Trays Ultra Thin Small Outline No Lead Package: UNE 008 3535 \ 28809b \ 1.5.5 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 15 Aug 2007 5-85 ‹ Chapter 5 Trays Ultra Thin Small Outline No Lead Package: UNE 008

tsr 048

Contextual Info: ‹ Chapter 5 Trays Thin Small Outline Package: TS, TSR 032 Type 1 3592-1 / 24112j / 8.24.6 Notes: (See next page for detailed views) 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 15 Aug 2007 5-11 ‹ Chapter 5 Trays Thin Small Outline Package: TS, TSR 032 (Type 1)

DSP56001AFC33

Abstract: DSP56001A DSP56001AFE33 hack br mark
Contextual Info: Pin-out and Package PQFP Top View Package and Tray Descriptions 1 18 Orientation Mark chamfered edge DSP56001AFC33 (Top View) 51 84 nc D20 D19 D18 GNDD GNDD nc D17 D16 nc D15 D14 D13 nc D12 VCCD VCCD D11 nc D10 D9 nc D8 D7 D6 GNDD GNDD nc D5 D4 D3 D2 nc

WSON 6x8

Abstract: tube 6x8 6X5 TUBE WSON
Contextual Info: SPI Flash Part Numbering System FM X XX XX X - X X X X X X Fidelix Memory Product Family Packing Type T : Tube Standard R : Tape and Reel Y : Tray * Package NO Marking 25 : SPI Business Package Type Organization 1 : 8 Pin 208 mil SOIC S : Standard 2 : 16 Pin 300 mil SOIC

CC4V-T1A 32.768 Khz

Abstract: t1A smd smd transistor t1A smd t1A CC4V-T1A smd package CC4V-T1A SMD t1A Transistor t1A transistor smd CH-2540 AEC-Q200
Contextual Info: CC4V-T1A Auto Automotive Qualified AEC Q200 DIMENSIONS Package: Recommended Solder Pad: 5,0 1,3 2,9 1,3 0,9 max.0,9 2,2 1,9 0,9 All dimensions in mm typical 100% leadfree, RoHS - compliant AEC Q200 compliant Miniature SMT ceramic package Package height 0.90 mm