PACKAGE TOSHIBA Search Results

QFP80-P-1420-0

Abstract: TMP96C031Z QFP80-P
Contextual Info: TOSHIBA 64 Pin FP Flat Package Package : For TMP96C031Z Package Name :QFP64-P-1420-1.00A o X Unit r\ n mm (VI 270289 PKG900-2 TOSHIBA Package 80 Pin QFP (Flat Package) Package Name: QFP80-P-1420-0.80B CM PKG900-1

QFP64 package

Abstract: QFP80-P-1420-0 TLCS-900 TMP96C031Z LSI CMOS Technology TMP96C031
Contextual Info: TOSHIBA PACKAGE 80 Pin QFP Flat Package PACKAGE N A M E: QFP80-P-1420-0.80B CM PKG900-1 TOSHIBA 64 Pin FP (Flat Package) PACKAGE : For TMP96C031Z Package Name :QFP64-P-1420-1.00A o X Unit : mm r\ n CM 270289 PKG900-2 TOSHIBA TLCS-900 USER'S MANUAL POSTSCRIPT

QFP64-P-1414-0

Abstract: SDIP64-P-750-1 25602
Contextual Info: TOSHIBA PACKAGE PACKAGE Unit : mm SDIP28-P-400-1.78 28 15 Unit : mm SOP28-P-450-1.27 19.0MAX 18.5±0.2 6-1 TOSHIBA PACKAGE SDIP42-P-600-1.78 42 22 6-2 TOSHIBA PACKAGE Unit : mm SDIP64-P-750-1.78 w 17.8 ± 0.2 0.25 0°~15° 160289 6-3 TOSHIBA PACKAGE QFP44-P-1010-0.80

2SK3562 equivalent

Abstract: 2SK3561 2SK3759 2SK3566 to220sis 2SK3561 equivalent 2SK3568 equivalent 2SK3757 2SK3566 equivalent 2SK3563
Contextual Info: Power MOSFET TO220 Package Dec, 2003 TOSHIBA Semiconductor Company Discrete Semiconductor Division 2003 Dec DP0540007_01 1 /9 TO-220SIS π-MOS IV/VI Series New Package TO-220SIS(Smart ISolation) <Features> 1) Short-sized Package Mounted Package Height is Reduced by 2.8mm.

DIODE MARK 35

Abstract: TOSHIBA Package
Contextual Info: Thin Extreme Super Mini Quad Package TESQ Package Outline Dimensions Outline Dimensions Unit: mm 1.2 ±0.05 0.2 ±0.05 Package orientation mark 1 1.2 ±0.05 3 0.9 ±0.05 4 0.12 ±0.05 2 0.52 ±0.05 0.8 ±0.05 Land Pattern Example Unit: mm 0.95 0.35 0.3 Toshiba package name

toshiba mosfet

Contextual Info: Taped Power Device Standard Package TPS Package Outline Dimensions Outline Dimensions Unit: mm 1.5 7.0 ±0.2 8.0 ±0.2 1.4 ±0.1 13.5 min 1.05 ±0.1 0.5 +0.15 –0.05 0.5 +0.15 –0.05 2.5 ±0.5 1 2 3 1.3 3.5 ±0.2 2.5 ±0.5 Toshiba package name Toshiba package code

LSTM

Abstract: Transistor TO 41 package TO-92MOD TRANSISTOR CODE PACKAGE
Contextual Info: Large Type Small Signal Transistor Mold Package LSTM Package Outline Dimensions Outline Dimensions Unit: mm 8.2 max 5.1 max 0.75 max 0.6 max 0.6 max 1.27 4.1 max 1.27 10.5 min 1.0 0.8 max 2.2 max 1.0 max 1 2 3 Toshiba package name Toshiba package code 2–5J1A

toshiba smd marking

Abstract: SA MARKING SMD mos DONG YANG MOTOR kec smd marking smd marking S3A lg ultra slim tpc6004 TPC6001 TPC6002 TPC6005
Contextual Info: Power MOSFETs VS-6 Series PRODUCT GUIDE The four key features of the VS 4-1 Package 1 Ultra-thin package “ “ Toshiba have developed a new 6-pin SMD package for power MOSFETs known as the VS-6 . This package allows these devices to be used in compact, thin, lightweight, high-efficiency

TOSHIBA IGBT DATA BOOK

Abstract: TO-220AB transistor package 10P1A
Contextual Info: Transistor Outline Package TO-220AB Package Outline Dimensions Outline Dimensions Unit: mm 1.32 15.7 max 3.0 φ3.6 ±0.2 6.7 max 10.3 max 2.5 max 12.6 min 1.6 max 0.76 3 2 3 0.5 1 Bottom view Toshiba package name Toshiba package code Notes • The above diagrams may not be actual sizes. Diagrams may be enlarged,

Contextual Info: Deca Power Device Package Straight Lead DP Package Outline Dimensions Outline Dimensions Unit: mm 1.7 ±0.2 6.8 max 0.6 max 5.5 ±0.2 5.2 ±0.2 0.95 max 12.0 min 0.6 ±0.15 3 2.3 2.3 3 1 (Bottom view) Toshiba package name Toshiba package code Notes • The above diagrams may not be actual sizes. Diagrams may be enlarged,

Contextual Info: New Power Mold Package Straight Lead New PW-Mold2 Package Outline Dimensions Outline Dimensions Unit: mm 1.5 ±0.2 6.5 ±0.2 0.6 max 4.1 ±0.2 1.6 0.9 1.1 max 0.8 max 0.6 ±0.15 2 3 1 (Bottom view) Toshiba package name Toshiba package code Notes • The above diagrams may not be actual sizes. Diagrams may be enlarged,

toshiba tape and reel

Abstract: TA7291F
Contextual Info: [3] Tape Specifications for Flat-Package Bipolar ICs [ 3 ] Tape Specifications for Flat-Package Bipolar ICs 1. Scope These specifications apply to the taping for flat-package bipolar ICs supplied by Toshiba Corporation and to related issues such as ordering.

TLN119

Contextual Info: TLN119 F TOSHIBA Infrared LED GaAs Infrared Emitter TLN119(F) Printers, Fax Machines Home Electric Appliances Opto-Electronic Switches Unit: mm Package /Package • φ3.1-mm plastic package • Radiant intensity: IE = 5 mW / sr (typ.) • Harf−angle value: θ1 / 2 = ±30°(typ.)

SSOP8 Package

Abstract: land pattern ssop8 SSOP8 ssop8 Package dimension SSOP8-p-0.65
Contextual Info: 8-Pin Super Mini Package SM8 Package Outline Dimensions Outline Dimensions Unit: mm 2.9 ±0.1 0.15 ±0.05 1 4.0 ±0.1 5 2.8 ±0.1 8 0.2 +0.1 –0.05 4 0.65 0.65 0.65 0 ~0.1 1.1 ±0.1 2.9 ±0.1 Land Pattern Example Unit: mm 3.4 0.9 0.4 Toshiba package name

Contextual Info: 3-pin Thin Super Mini Package TSM Package Outline Dimensions Outline Dimensions Unit: mm 2.9 ±0.2 0.4 ±0.1 0.16 ±0.05 2 0.95 0 ~0.1 1.9 ±0.2 0.15 0.95 0.7 ±0.05 1 2.8 +0.2 –0.3 1.6 +0.2 –0.1 3 Land Pattern Example Unit: mm 2.4 1.0 0.8 Toshiba package name

transistor SSOP6

Abstract: SSOP6 transistor toshiba
Contextual Info: 6-Pin Ultra Super Mini Package US6 Package Outline Dimensions Outline Dimensions Unit: mm 2.0 ±0.2 0.2 +0.1 –0.05 1 2.1 ±0.1 4 1.25 ±0.1 6 0.15 ±0.05 3 0.65 0.65 0 ~0.1 0.9 ±0.1 1.3 ±0.1 Land Pattern Example Unit: mm 1.9 0.8 0.4 Toshiba package name

7B1A

Abstract: toshiba mosfet
Contextual Info: Power Mold Package Straight Lead PW-Mold Package Outline Dimensions Outline Dimensions Unit: mm 1.7 ±0.2 6.8 max 0.6 max 5.5 ±0.2 5.2 ±0.2 0.95 max 12.0 min 0.6 ±0.15 2.3 2.3 3 0.6 max 2 1 2 3 2.5 max 1 1.1 ±0.2 (Bottom view) Toshiba package name Toshiba

oki qfp tray

Abstract: Ultrasonic humidifier circuit 750H OKI Year Work Week "the package information document consisting of 8 chapters in total" Oki Moisture Oki Moisture level
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE This document is Chapter 3 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE

MCP 256M nand toshiba

Abstract: TY80009000AMGF toshiba mcp FBGA149 toshiba mcp nand 512M nand mcp nand sdram mcp TOSHIBA M9
Contextual Info: TY80009000AMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY80009000AMGF is a mixed multi-chip package containing a 268,435,456-bit Low Power Synchronous DRAM and a 553,648,128-bit Nand E2PROM. The TY80009000AMGF is available in a 149-pin BGA package

Contextual Info: TCR3DM32 New product CMOS point regulator single output Description Properties Document Inquiries on our product Description RoHS Compatible Product(s) (#) Assembly bases Available Japan Properties Package Information Absolute Maximum Ratings Toshiba Package

Contextual Info: TCR3DM10 New product CMOS point regulator single output Description Properties Document Inquiries on our product Description RoHS Compatible Product(s) (#) Assembly bases Available Japan Properties Package Information Absolute Maximum Ratings Toshiba Package

Contextual Info: TCR3DM36 New product CMOS point regulator single output Description Properties Document Inquiries on our product Description RoHS Compatible Product(s) (#) Assembly bases Available Japan Properties Package Information Absolute Maximum Ratings Toshiba Package

Contextual Info: TCR3DM18 New product CMOS point regulator single output Description Properties Document Inquiries on our product Description RoHS Compatible Product(s) (#) Assembly bases Available Japan Properties Package Information Absolute Maximum Ratings Toshiba Package

Contextual Info: TCR3DM28 New product CMOS point regulator single output Description Properties Document Inquiries on our product Description RoHS Compatible Product(s) (#) Assembly bases Available Japan Properties Package Information Absolute Maximum Ratings Toshiba Package