PACKAGE TOSHIBA Search Results

QFP80-P-1420-0

Abstract: TMP96C031Z QFP80-P
Contextual Info: TOSHIBA 64 Pin FP Flat Package Package : For TMP96C031Z Package Name :QFP64-P-1420-1.00A o X Unit r\ n mm (VI 270289 PKG900-2 TOSHIBA Package 80 Pin QFP (Flat Package) Package Name: QFP80-P-1420-0.80B CM PKG900-1

QFP64 package

Abstract: QFP80-P-1420-0 TLCS-900 TMP96C031Z LSI CMOS Technology TMP96C031
Contextual Info: TOSHIBA PACKAGE 80 Pin QFP Flat Package PACKAGE N A M E: QFP80-P-1420-0.80B CM PKG900-1 TOSHIBA 64 Pin FP (Flat Package) PACKAGE : For TMP96C031Z Package Name :QFP64-P-1420-1.00A o X Unit : mm r\ n CM 270289 PKG900-2 TOSHIBA TLCS-900 USER'S MANUAL POSTSCRIPT

QFP64-P-1414-0

Abstract: SDIP64-P-750-1 25602
Contextual Info: TOSHIBA PACKAGE PACKAGE Unit : mm SDIP28-P-400-1.78 28 15 Unit : mm SOP28-P-450-1.27 19.0MAX 18.5±0.2 6-1 TOSHIBA PACKAGE SDIP42-P-600-1.78 42 22 6-2 TOSHIBA PACKAGE Unit : mm SDIP64-P-750-1.78 w 17.8 ± 0.2 0.25 0°~15° 160289 6-3 TOSHIBA PACKAGE QFP44-P-1010-0.80

Contextual Info: Mini Package Mini Package Outline Dimensions Outline Dimensions Unit: mm 1.8 3.2 max 4.2 max 0.8 0.55 max 1.27 0.95 1.27 2.6 max 12.7 min 0.4 0.4 1 2 3 Toshiba package name Toshiba package code 1–4E2* Transistor 2–4E1* JEITA package code Notes • The above diagrams may not be actual sizes. Diagrams may be enlarged,

2SK3562 equivalent

Abstract: 2SK3561 2SK3759 2SK3566 to220sis 2SK3561 equivalent 2SK3568 equivalent 2SK3757 2SK3566 equivalent 2SK3563
Contextual Info: Power MOSFET TO220 Package Dec, 2003 TOSHIBA Semiconductor Company Discrete Semiconductor Division 2003 Dec DP0540007_01 1 /9 TO-220SIS π-MOS IV/VI Series New Package TO-220SIS(Smart ISolation) <Features> 1) Short-sized Package Mounted Package Height is Reduced by 2.8mm.

F2B transistor

Abstract: 3p transistor transistor TO-3P Outline Dimensions transistor 975 transistor 545
Contextual Info: Transistor Outline Package TO-3P LH Package Outline Dimensions Outline Dimensions Unit: mm 20.5 max 1.0 +0.3 –0.25 26.0 ±0.5 2.0 1.5 3.0 20.0 ±0.6 2.5 2.5 1.5 11.0 2.0 4.0 6.0 φ3.3 ±0.2 1 (Bottom view) Toshiba package name Toshiba package code Notes

transistor t1A

Abstract: t1a transistor toshiba mosfet
Contextual Info: Taped Power Device Large Package TPL Package Outline Dimensions Outline Dimensions Unit: mm 10.0 ±0.2 13.4 ±0.2 φ1.2 1.5 1.4 14.8 ±0.5 0.5 +0.15 –0.05 2.5 0.5 +0.15 –0.05 1 2 4.5 ±0.2 2 2.5 3 Toshiba package name Toshiba package code 2–10T1A MOSFET

toshiba mosfet

Abstract: jeita To-126 transistor to6 trangister TO126 package
Contextual Info: Trangister Outline Package TO-126 Package Outline Dimensions Outline Dimensions Unit: mm 8.3 max 11.0 ±0.3 3.5 φ3.1 ±0.1 1.9 max 0.75 ±0.15 2.3 ±0.1 2 3 0.75 ±0.15 3.4 max 1 1.6 2.3 ±0.1 14.0 min 1.9 max 1.0 max Toshiba package name Toshiba package code

DIODE MARK 35

Abstract: TOSHIBA Package
Contextual Info: Thin Extreme Super Mini Quad Package TESQ Package Outline Dimensions Outline Dimensions Unit: mm 1.2 ±0.05 0.2 ±0.05 Package orientation mark 1 1.2 ±0.05 3 0.9 ±0.05 4 0.12 ±0.05 2 0.52 ±0.05 0.8 ±0.05 Land Pattern Example Unit: mm 0.95 0.35 0.3 Toshiba package name

toshiba mosfet

Contextual Info: Taped Power Device Standard Package TPS Package Outline Dimensions Outline Dimensions Unit: mm 1.5 7.0 ±0.2 8.0 ±0.2 1.4 ±0.1 13.5 min 1.05 ±0.1 0.5 +0.15 –0.05 0.5 +0.15 –0.05 2.5 ±0.5 1 2 3 1.3 3.5 ±0.2 2.5 ±0.5 Toshiba package name Toshiba package code

LSTM

Abstract: Transistor TO 41 package TO-92MOD TRANSISTOR CODE PACKAGE
Contextual Info: Large Type Small Signal Transistor Mold Package LSTM Package Outline Dimensions Outline Dimensions Unit: mm 8.2 max 5.1 max 0.75 max 0.6 max 0.6 max 1.27 4.1 max 1.27 10.5 min 1.0 0.8 max 2.2 max 1.0 max 1 2 3 Toshiba package name Toshiba package code 2–5J1A

TO-3P Jedec package outline

Abstract: 3p transistor transistor outline package 3
Contextual Info: Transistor Outline Package TO-3P W Package Outline Dimensions Outline Dimensions Unit: mm 0.8 +0.2 –0.1 15.5 ±0.3 A 20.0 ±0.3 3.0 max 4.5 φ3.2 ±0.2 A 1.0 +0.3 –0.25 5.45 1 2 3 3 0.8 +0.3 –0.1 5.45 1 (Bottom view) Toshiba package name Toshiba package code

toshiba smd marking

Abstract: SA MARKING SMD mos DONG YANG MOTOR kec smd marking smd marking S3A lg ultra slim tpc6004 TPC6001 TPC6002 TPC6005
Contextual Info: Power MOSFETs VS-6 Series PRODUCT GUIDE The four key features of the VS 4-1 Package 1 Ultra-thin package “ “ Toshiba have developed a new 6-pin SMD package for power MOSFETs known as the VS-6 . This package allows these devices to be used in compact, thin, lightweight, high-efficiency

transistor TO-3P Outline Dimensions

Abstract: TRANSISTOR 545 3p transistor TO-3P Jedec package outline TOSHIBA IGBT DATA BOOK
Contextual Info: Transistor Outline Package TO-3P L Package Outline Dimensions Outline Dimensions Unit: mm 20.5 max 26.0 ±0.5 11.0 2.0 4.0 6.0 φ3.3 ±0.2 3.0 1.0 +0.3 –0.25 20.0 ±0.6 2.5 2.5 3 1 (Bottom view) Toshiba package name Toshiba package code Notes • The above diagrams may not be actual sizes. Diagrams may be enlarged,

Contextual Info: Deca Power Device Package Straight Lead DP Package Outline Dimensions Outline Dimensions Unit: mm 1.7 ±0.2 6.8 max 0.6 max 5.5 ±0.2 5.2 ±0.2 0.95 max 12.0 min 0.6 ±0.15 3 2.3 2.3 3 1 (Bottom view) Toshiba package name Toshiba package code Notes • The above diagrams may not be actual sizes. Diagrams may be enlarged,

Contextual Info: New Power Mold Package Straight Lead New PW-Mold2 Package Outline Dimensions Outline Dimensions Unit: mm 1.5 ±0.2 6.5 ±0.2 0.6 max 4.1 ±0.2 1.6 0.9 1.1 max 0.8 max 0.6 ±0.15 2 3 1 (Bottom view) Toshiba package name Toshiba package code Notes • The above diagrams may not be actual sizes. Diagrams may be enlarged,

toshiba tape and reel

Abstract: TA7291F
Contextual Info: [3] Tape Specifications for Flat-Package Bipolar ICs [ 3 ] Tape Specifications for Flat-Package Bipolar ICs 1. Scope These specifications apply to the taping for flat-package bipolar ICs supplied by Toshiba Corporation and to related issues such as ordering.

TLN119

Contextual Info: TLN119 F TOSHIBA Infrared LED GaAs Infrared Emitter TLN119(F) Printers, Fax Machines Home Electric Appliances Opto-Electronic Switches Unit: mm Package /Package • φ3.1-mm plastic package • Radiant intensity: IE = 5 mW / sr (typ.) • Harf−angle value: θ1 / 2 = ±30°(typ.)

Contextual Info: 3-pin Ultra Super Mini Flat Package UFM Package Outline Dimensions Outline Dimensions Unit: mm 2.0 ±0.1 0.3 +0.1 –0.05 0.166 ±0.05 2.1 ±0.1 1.7 ±0.1 3 2 0.65 ±0.05 1 0.7 ±0.05 0.65 ±0.05 Land Pattern Example Unit: mm 1.9 0.8 0.5 Toshiba package name

AN USQ 125

Contextual Info: Ultra Super Mini Quad Package USQ Package Outline Dimensions Outline Dimensions Unit: mm 2.0 ±0.2 0.2 +0.1 –0.05 4 0.15 ±0.05 1 2.1 ±0.1 1.25 ±0.1 3 2 0.95 +0.05 –0.15 0 ~0.1 0.7 1.3 ±0.1 Land Pattern Example Unit: mm 1.9 1.0 0.6 Toshiba package name

Contextual Info: 5-Pin Extreme Super Mini Package ESV Package Outline Dimensions Outline Dimensions Unit: mm 1.6 ±0.05 0.2 ±0.05 1.6 ±0.05 4 1.2 ±0.05 5 0.12 ±0.05 0.5 0.5 1.0 ±0.05 Land Pattern Example 0.55 ±0.05 3 1 Unit: mm 1.35 0.45 0.3 Toshiba package name 0.5

2101A

Abstract: MSTM TOSHIBA toshiba mosfet MSTM Midium Type Small Signal Transistor 2-7D101A transistor outline package 3
Contextual Info: Midium Type Small Signal Transistor Mold Package MSTM Package Outline Dimensions Outline Dimensions Unit: mm 1.0 4.7 max 7.1 max 0.9 0.65 0.85 3.5 min 0.55 +0.15 –0.05 0.45 +0.15 –0.05 2.54 0.45 +0.15 –0.05 1 2 3 1.025 ±0.05 2.7 max 2.54 Toshiba package name

Contextual Info: 6-Pin Extreme Super Mini Package ES6 Package Outline Dimensions Outline Dimensions Unit: mm 1.6 ±0.05 0.2 ±0.05 6 0.12 ±0.05 1.6 ±0.05 1.2 ±0.05 4 0.5 0.5 1.0 ±0.05 Land Pattern Example 0.55 ±0.05 3 1 Unit: mm 1.35 0.45 0.3 Toshiba package name 0.5

A1 transistor

Abstract: transistor ESM 16 TRANSISTOR 2A1
Contextual Info: 3-Pin Extreme Super Mini Package ESM Package Outline Dimensions Outline Dimensions Unit: mm 1.6 ±0.1 0.27 +0.1 –0.05 0.13 ±0.05 1 1.6 ±0.1 0.85 ±0.1 3 2 0.5 0.5 0.7 ±0.1 1.0 ±0.1 Land Pattern Example Unit: mm 1.4 0.6 0.6 Toshiba package name 0.5 0.5