PACKAGE OUTLINES Search Results

FX609LG

Abstract: FX609 FX609J FX609L2 FX609P6
Contextual Info: FX609P6 package discontinued 1 FX609P6 package discontinued 2 FX609P6 package discontinued 3 FX609P6 package discontinued 4 FX609P6 package discontinued 5 Package Outlines Handling Precautions The FX609 is available in the package styles outlined below. Pin 1 identification marking is shown on the relevant

Contextual Info: FX609P6 package discontinued 1 FX609P6 package discontinued 2 FX609P6 package discontinued 3 FX609P6 package discontinued 4 FX609P6 package discontinued 5 Package Outlines Handling Precautions The FX609 is available in the package styles outlined below. Pin 1 identification marking is shown on the relevant

CDIP14

Abstract: cdip28 SSOP20 300 mil MS-012AB MS-012AC SO20 sot73-1 sot94 150AH CDIP-14
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package outlines Package information January 1995 File under Integrated Circuits, IC04 Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm

LG ai 0068

Abstract: sot162ag jedec Package TO-39
Contextual Info: Philips Semiconductors Objective specification Package information Package outlines PACKAGES Packages in ascending order of packages outline version PACKAGE OUTLINE VERSION CODE RENAMED PACKAGE VERSION CODE (NON­ STANDARD) PACKAGE NAME DESCRIPTION PAGE

MARKING SMD T43

Abstract: siemens Package Outlines Plastic Package siemens Package Outlines smd marking l5 7750a
Contextual Info: Package Outlines SIEMENS Mem ory Com ponents P-DIP-20-2 Plastic Package Plastic dual in-line package P-SOJ-26/20-1 (SMD) Plastic Package (Plastic small outline J-lead) P-SOJ-26/20-5 (SMD) Plastic Package (Plastic dual in-line package) P-SO J-28-2 (SMD) Plastic Package

Contextual Info: Package Outlines Package Outlines

1653G

Contextual Info: v00.0909 C-20 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-20 Package Outline Drawing Package Information Package Type C-20 Package Weight [1] 16.53g Spacer Weight 4.6g [1] Does not include connectors, or mounting hardware B - 24 NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR

hssop

Abstract: 32 QFP PACKAGE thermal resistance mitsubishi mounting technology
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES ORDERING INFORMATION TABLE OF CONTENTS 1 . GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION 3. PACKAGE STRUCTURE 4. PACKAGE CODING CONVENTIONS 5. PACKAGE LINE-UP 2 . DETAILED DIAGRAM OF PACKAGE OUTLINES

DIP40

Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
Contextual Info: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)

pmfp

Abstract: SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1
Contextual Info: PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

tensolite

Contextual Info: v01.0310 C-11 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-11 Package Outline Drawing Package Information NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. PLATING: GOLD PLATE OVER NICKEL PLATE Package Type C-11 Package Weight [1] 20 gms [2] 4. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].

BGA and QFP Package mounting

Abstract: oki Package SOJ PGA wire bonding he package information document consisting of 8 chapters in total "the package information document consisting of 8 chapters in total"
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 2. PACKAGE OUTLINES AND DIMENSIONS This document is Chapter 2 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 2. PACKAGE OUTLINES AND DIMENSIONS

SMD BOOK

Abstract: smd 842 SMD Packages TQFP Package 44 lead 20B40 P-MQFP-44-2 P-MQFP-144-1 SMD Devices smd transistor marking 26 MARKING BOOK
Contextual Info: Package Outlines Plastic Package, P-DIP-40 Plastic Dual In-Line Package 20B40 DIN 41870 T10 Plastic Package, P-LCC-28-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-44-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-68 (Plastic Leaded Chip Carrier) – SMD

tensolite

Abstract: 231CCSF tensolite price 231CC
Contextual Info: v01.0310 C-10 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-10 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms +/- 1 gms Tolerance NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE

Siemens Aktiengesellschaft

Contextual Info: Package Outlines Siemens Aktiengesellschaft 245 Summary of Package Outlines Memory Components Siemens Aktiengesellschaft 246 Summary of Package Outlines Siemens Aktiengesellschaft 247 Summary of Package Outlines Memory Modules Siemens Aktiengesellschaft 248

Contextual Info: v00.0704 C8 – 8 LEAD CERAMIC/METAL SMT PACKAGE PACKAGE OUTLINES C8 Package Outline Drawing NOTES: 1. PACKAGE BODY MATERIAL: WHITE ALUMINA 92% 2. LEAD, PACKAGE BOTTOM MATERIAL: COPPER 3. PLATING: ELECTROLYTIC GOLD 100-200 MICROINCHES, OVER ELECTROLYTIC NICKEL 100-250 MICROINCHES.

sot267

Contextual Info: Philips Semiconductors Package information Package outlines INDEX VERSION DESCRIPTION NAME PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 ; SOT97 593 DIP16 plastic dual in-line package; 16 leads (300 mil); long body

Application Notes

Abstract: MWT-7
Contextual Info: FET Application Notes Package Information Package Outlines All Leads are Gold-Plated Kovar Dimensions are in Inches and mm Package 71 (Solder Seal) Package 70 (Solder Seal) Package 73 (Epoxy Seal) 0.98 (2.5) 0.07 (1.78) 0.10 (2.5) Min. All Leads D D .25

BGA PACKAGE thermal profile

Abstract: 896-Pin TQFP 144 PACKAGE DIMENSION CII51015-2 EP2C20 EP2C35 EP2C50 F256 EP2C5256 CII51015
Contextual Info: 15. Package Information for Cyclone II Devices CII51015-2.3 Introduction This chapter provides package information for Altera Cyclone® II devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Table 15–1 shows Cyclone II device package options.

SOT263-5

Abstract: 075E05 MS-012AA SC13 SO24 SSOP16 SSOP24 4 PIN THROUGH HOLE TRANSISTORS SOT-263
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET Package outlines PowerMOS transistors 1998 Apr 02 File under Discrete Semiconductors, SC13 Philips Semiconductors PowerMOS transistors Package outlines PACKAGE OUTLINES Package SOT23 SOT54 TO-92 SOT54variant (TO-92variant)

Contextual Info: PACKAGE INFORMATION Page Package outlines 874 Soldering 897

tensolite

Contextual Info: v01.0310 C-5 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-5 Package Outline Drawing Typical Package Weight Package 17.7 gms Spacer 2.6 gms NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE 3. MOUNTING SPACER: NICKEL PLATED ALUMINUM

philips package information

Contextual Info: Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 SOT109-1 SOT162-1 SOT163-1 SOT137-1 SOT136-1 plastic small outline package; 14 leads; body width 3.9 mm plastic small outline package; 16 leads; body width 3.9 mm

tensolite

Abstract: tensolite price
Contextual Info: v01.0310 C-9 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-9 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE 3. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]