PACKAGE OUTLINE BGA208 Search Results
PACKAGE OUTLINE BGA208 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 54ACT825/QKA |
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54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP |
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| TPH1R306PL |
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N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPH9R00CQH |
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MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPH9R00CQ5 |
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N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPHR8504PL |
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N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet |
PACKAGE OUTLINE BGA208 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA208 package SOT595-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
BGA208 OT595-1 OT595-1 | |
package outline bga208
Abstract: SOT-595 BGA208 MS-034
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Original |
BGA208: OT595-1 MS-034 package outline bga208 SOT-595 BGA208 MS-034 | |
bga208
Abstract: sot595 package outline bga208
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Original |
BGA208: OT595-1 1SOT595-1 bga208 sot595 package outline bga208 | |
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Contextual Info: Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C T e R P N M L K J e2 H G 1/2 e F E D C B A 1 shape optional 4x |
Original |
BGA208: OT595-1 MS-034 |