PACKAGE LQFP128 Search Results

PACKAGE LQFP128

Abstract: 1000ppm LQFP128 QFP15-128PIN QFP15 P-LQFP128-1414-0
Contextual Info: Eu-RoHS Compliance Package-type Epson Package name ； QFP15-128PIN JEITA Package name； P-LQFP128-1414-0.40 Terminal plating； Lead Pb Free The product which consisted of above package is compliant with RoHS Directive (2002/95/EC) RoHS Directive chemicals:

LQFP128

Abstract: LQFP128 20 14 1.4
Contextual Info: Philips Semiconductors Package outlines LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm 1997 Aug 04 640 SOT425-1

DIP40

Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
Contextual Info: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)

DIP18

Abstract: DIP20 DIP28 DIP40 LQFP100 LQFP128 LQFP32 LQFP64 ZE 004-1
Contextual Info: PACKAGE INFORMATION Page Index 1694 DIP LQFP QFP SDIP SO SSOP TSSOP VSO 1696 1706 1710 1712 1713 1721 1725 1726 Soldering 1728 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP128 package SOT425-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

100P6S-A

Abstract: LQFP100-P-1414-0 LQFP128-P-1420-0 QFP100-P-1420-0 128P6Q-A
Contextual Info: Renesas microcomputers M16C / 62P Group Package Dimensions SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Package Dimensions MMP 100P6S-A EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material Alloy 42 MD e JEDEC Code –

sc6038

Abstract: SC-6038 K 2941 SOT393-1 DBS13P DIP20 DIP28 HDIP18 LQFP100 LQFP48
Contextual Info: PACKAGE INFORMATION Page Index DBS DIP HDIP LQFP PLCC QFP SDIP SIL SO SSOP SQFP Soldering 1816 1818 1822 1823 1827 1830 1836 1839 1841 1849 1851 1852 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DBS DIL-bent-SIL

LQFP128

Abstract: PACKAGE LQFP128 ZD 103 MS-026
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 c y X A 102 103 65 64 ZE e E HE A A2 A 1 A 3 θ wM Lp bp pin 1 index L detail X 39 128 1 38 v M A ZD wM bp e

sot425

Abstract: LQFP128 20 14 1.4
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 c y X A 65 102 64 103 ZE e E HE A A2 A 1 A 3 θ wM Lp bp pin 1 index L detail X 39 128 1 38 v M A ZD wM bp e

ZD 103

Abstract: PACKAGE LQFP128 LQFP128 MS-026
Contextual Info: PDF: 2000 Jan 20 Philips Semiconductors Package outline LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 c y X A 65 102 64 103 ZE e E HE A A2 A 1 A 3 θ wM Lp bp pin 1 index L detail X 39 128 1 38 v M A ZD wM bp e

LQFP128

Abstract: PACKAGE LQFP128 lqfp128 MS-026 MS-026 sot420
Contextual Info: PDF: 1999 Nov 03 Philips Semiconductors Package outline LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 14 x 1.4 mm SOT420-1 c y X A 65 64 96 97 ZE e E HE A A2 A 1 A 3 θ wM Lp bp pin 1 index L detail X 33 32 128 1 v M A ZD wM bp e D

LQFP128

Abstract: MS-026 lqfp128 MS-026
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 14 x 1.4 mm SOT420-1 c y X A 65 64 96 97 ZE e E HE A A2 A 1 A 3 θ wM Lp bp pin 1 index L detail X 33 32 128 1 v M A ZD wM bp e D

Contextual Info: Package outline LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 14 x 1.4 mm SOT420-1 c y X A 65 64 96 97 ZE e E HE A A2 A 1 A 3 θ wM Lp bp pin 1 index L detail X 128 33 32 1 v M A ZD wM bp e D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

Tuner matsushita vhf

Abstract: MN88441
Contextual Info: DATA SHEET Part No. MN88441 Package Code No. LQFP128-P-1818C SEMICONDUCTOR COMPANY MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. Publication date: December 2004 SDB00109AEM 1 MN88441 MN88441 OFDM Demodulation LSI for Digital Terrestrial Broadcasting in Japan „ Overview

ccd camera module

Abstract: QFP144-P-2020 CCD Linear Image Sensors DIODE MARKING B85 L69A TQFP100-P-1414 b86a T07 marking
Contextual Info: Package Outlines MOS LSI L O U 170 MOS Memories (M H O ) 185 CCD Area/Linear Image Sensors (C C O ) 190 CCD Camera Modules ( C C Q 193 TFT LCD Device (C C D ) 193 Bipolar IC s (B Q D ) 194 Discrete Semiconductors (DQZJ) 208 169 Package Outlines (MOS LSI)

SLIC-DC - PEF 4268

Abstract: vinetic PEB 3332 ADM5120 Vinetic Infineon VoIP 12V RELAY 1 C/O 723 ic ADM5120 reference board SoC SLIC PEF 4268
Contextual Info: To o l B r i e f EASY 5120 Wireless VoIP Router Reference Package The EASY 5120 reference package demonstrates Infineon’s Wireless VoIP router capabilities. This reference platform allows system engineers to develop time-to-market VoIP router products. The EASY 5120 reference design is based on Infineon’s VoIP, SLIC,

LQFP144

Abstract: QFP100-P-1818B scl-3b
Contextual Info: MN103L03 Series MN103LF03R Type Internal ROM type FLASH ROM byte 1024K RAM (byte) 63.5K LQFP128-P-1818C (Under development), LQFP144-P-2020A (Under development), QFP100-P-1818B (Under development) Package (Lead-free) Minimum Instruction Execution Time 25 ns (at 2.7 V to 3.6 V, 40 MHz)

MN102L2403

Contextual Info: MN102L2403 Type MN102L2403 [ES Engineering Sample available] ROM (x× 8-bit / × 16-bit) Maximum 16 M in total (special register 1 K included) RAM (×× 8-bit / × 16-bit) External ROM, RAM 3 K Package LQFP128-P-1818B Minimum Instruction Execution Time

Contextual Info: MN102L2403 Type MN102L2403 [ES Engineering Sample available] ROM (x× 8-bit / × 16-bit) Maximum 16 M in total (special register 1 K included) RAM (×× 8-bit / × 16-bit) External ROM, RAM 3 K Package LQFP128-P-1818B Minimum Instruction Execution Time

76VDD

Contextual Info: MN102L2403 Type MN102L2403 [ES Engineering Sample available] ROM (x× 8-bit / × 16-bit) Maximum 16 M in total (special register 1 K included) RAM (×× 8-bit / × 16-bit) External ROM, RAM 3 K Package LQFP128-P-1818B Minimum Instruction Execution Time

Contextual Info: MN102H46 Series MN102H460B Type External Internal ROM type ROM byte  RAM (byte) 4K Package (Lead-free) Minimum Instruction Execution Time LQFP128-P-1818C, TQFP128-P-1414B [With main clock operated] 50 ns (at 3.0 V to 3.6 V, 40 MHz) 100 ns (at 2.0 V to 3.6 V, 20 MHz)

AD03

Abstract: AD04 MN102L360C MN102L36K 128 k rom
Contextual Info: MN102L36K , MN102L360C Type MN102L36K [ES Engineering Sample available] MN102L360C ROM (x× 8-bit / × 16-bit) 256 K External RAM (×× 8-bit / × 16-bit) 10 K 5K Package LQFP128-P-1818C *Pb free Minimum Instruction Execution Time 100 ns (at 4.5 V to 5.5 V, 20 MHz)

AN13

Abstract: AN14 AN15 MN102H460B
Contextual Info: MN102H46 Series MN102H460B Type External Internal ROM type ROM byte  RAM (byte) 4K Package (Lead-free) Minimum Instruction Execution Time LQFP128-P-1818C, TQFP128-P-1414B [With main clock operated] 50 ns (at 3.0 V to 3.6 V, 40 MHz) 100 ns (at 2.0 V to 3.6 V, 20 MHz)

Contextual Info: MN102H460B MN102H460B Type External Internal ROM type ROM byte  RAM (byte) 4K Package (Lead-free) Minimum Instruction Execution Time LQFP128-P-1818C, TQFP128-P-1414B [With main clock operated] 50 ns (at 3.0 V to 3.6 V, 40 MHz) 100 ns (at 2.0 V to 3.6 V, 20 MHz)