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    PACKAGE INFORMATION Search Results

    PACKAGE INFORMATION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54ACT825/QKA
    		Rochester Electronics LLC 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP PDF Buy
    TPH1R306PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    		Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet

    PACKAGE INFORMATION Datasheets (173)

    Vishay
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    Package Information
    		Vishay CERDIP: 16 LEAD Original PDF 11.99KB 1
    Package Information
    		Vishay QFN-16 LEAD (3 x 3) Original PDF 14.24KB 1
    Package Information
    		Vishay SC89 3 Original PDF 9KB 1
    Package Information
    		Vishay Diodes: Package Drawing - DO-35 Original PDF 31.04KB 2
    Package Information
    		Vishay SOIC (NARROW): 16-LEAD Original PDF 12KB 1
    Package Information
    		Vishay Diodes: Markings - Marking on Packages Original PDF 80.97KB 4
    Package Information
    		Vishay CERDIP: 28 LEAD Original PDF 12.32KB 1
    Package Information
    		Vishay SC 70: 3-LEADS Original PDF 11.58KB 1
    Package Information
    		Vishay SQFP: 64-LEAD (10 x 10 x 1.4 MM) SQUARE (POWER IC ONLY) Original PDF 35.46KB 1
    Package Information
    		Vishay PowerPAK 1212, (Single/Dual) Original PDF 41.66KB 1
    Package Information
    		Vishay MLP33-10 Original PDF 31.54KB 2
    Package Information
    		Vishay TO 206AC (TO 52) Original PDF 10.91KB 1
    Package Information
    		Vishay SOT 23 (TO 236): 3-LEAD Original PDF 11.87KB 1
    Package Information
    		Vishay PowerPAK MLP33-6, 8 and 10 Original PDF 52.8KB 2
    Package Information
    		Vishay MSOP: 8-LEAD (POWER IC ONLY) Original PDF 43.22KB 1
    Package Information
    		Vishay Optocouplers: Package Drawing - SOT-223-10 Original PDF 20.38KB 2
    Package Information
    		Vishay TSSOP: 20-LEAD (POWER IC ONLY) Original PDF 41.31KB 1
    Package Information
    		Vishay SOIC (WIDE BODY): 20 LEAD Original PDF 13.38KB 1
    Package Information
    		Vishay T0-100 CAN: 10 LEAD Original PDF 11.08KB 1
    Package Information
    		Vishay Diodes: Package Drawing - SOD-123-Pad Original PDF 24.38KB 2
    ...

    PACKAGE INFORMATION Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL

    Abstract: "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"
    Contextual Info: Package Information file:///D|/nec_intranet/package/index.htm Package Information Package Type Package List by NEC Code Explanation of Package and Packing Semiconductor Device Mounting Technology Manual Chip Size Package (CSP) BGA Family Flip Chip BGA (FCBGA)


    Original     		semiconductor device mounting technology manual PDF

    7261 markem

    Abstract: Markem 7224 Ink 7224 markem Markem 7254 Ink 7224 markem black 7261 markem black 7261 markem white k 897 TO-46 weight 7224 white
    Contextual Info: HERMETIC PACKAGE INFORMATION PACKAGE TYPE CERDIP PACKAGE MATERIAL Ceramic DESCRIPTION Package Dimensions mm inch WIDTH HEIGHT(2) PACKAGE STYLE = PACKAGE Package Code CODE + Lead Count Flat Pack Glass Sealed Notes 2-June-2010 Lead Frame, Board Type RAIL/BULK


    Original     		14-lead18-lead150degctpc460+112-june-20107261 markemmarkem 7224 ink7224 markemmarkem 7254 ink7224 markem black7261 markem black7261 markem whitek 897to-46 weight7224 white PDF

    sot-223 93

    Abstract: 3301 sot-89 3301-1000 5201 sot223
    Contextual Info: Package Information Package Types QFP Quad Flat Package The following are the package types and widths offered by Holtek. Pin Count DIP (Dual In-line Package) Pin Count Package Width Package Width 44, 48 10mm ´ 10mm 52 14mm ´ 14mm 8, 14, 16, 18, 20 300mil


    Original     		300mil400mil600mil1mm/20pitches+4sot-223 933301 sot-893301-10005201 sot223 PDF

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


    Original     		land pattern for tsop 2 86 pinland pattern for tsop 2 54 pinland pattern for tsop 56 pinoki naming+6qfp 64 0.4 mm pitch land patterntsop 54 land patternic packagestsop 66 pin package thermal resistancesoj 44 pcb landed730 PDF

    CDIP14

    Abstract: cdip28 SSOP20 300 mil MS-012AB MS-012AC SO20 sot73-1 sot94 150AH CDIP-14
    Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package outlines Package information January 1995 File under Integrated Circuits, IC04 Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm


    Original     		ot108-1ot109-1ot162-1ot163-1+16ot137-1ot136-1ot337-1cdip24ot94-1mbb910cdip14cdip28ssop20 300 milms-012abms-012acso20sot73-1sot94150ahcdip-14 PDF

    32TSOP

    Contextual Info: PACKAGE INFORMATION 1. OUTLINE DIMENSIONS FOR CDIP PACKAGE 2. OUTLINE DIMENSIONS FOR .600 FAMILY PDIP PACKAGE 3. OUTLINE DIMENSIONS FOR .300 FAMILY SOP PACKAGE 4. OUTLINE DIMENSIONS FOR .330 FAMILY SOP PACKAGE 5. OUTLINE DIMENSIONS FOR .450 FAMILY SOP PACKAGE


    Original     		32tsop40tsop64lqfp-28tsop+140ttline PDF

    LG ai 0068

    Abstract: sot162ag jedec Package TO-39
    Contextual Info: Philips Semiconductors Objective specification Package information Package outlines PACKAGES Packages in ascending order of packages outline version PACKAGE OUTLINE VERSION CODE RENAMED PACKAGE VERSION CODE (NON­ STANDARD) PACKAGE NAME DESCRIPTION PAGE


    OCR Scan     		ot27-1ot38-1ot38-4ot96-1+9ot97-1ot101-1ot102-1ot108-1ot109-1ot136-1lg ai 0068sot162agjedec package to-39 PDF

    transistor SO

    Abstract: SOL 18 package tab ic 14 pin ic dip datasheet 24-Pin Plastic DIP ic base for 40 pin DIP ic SOL-18 transistor 115 single inline 14gull
    Contextual Info: PACKAGE INFORMATION PACKAGE THERMAL CHARACTERISTICS PACKAGE THERMAL CHARACTERISTICS Allegro Package Code Package Type Common Package Designators Qty-Type of Terminals RθJA (°C/W) RθJC (°C/W) A Plastic Dual In-Line (DlP or PDlP) 14-Pin 16-Pin 18-Pin 20-Pin


    Original     		14-pin16-pin18-pin20-pin+1322-pin28-pin40-pintransistor sosol 18 packagetab ic14 pin ic dip datasheet24-pin plastic dipic base for 40 pin dip icsol-18transistor 115single inline14gull PDF

    1653G

    Contextual Info: v00.0909 C-20 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-20 Package Outline Drawing Package Information Package Type C-20 Package Weight [1] 16.53g Spacer Weight 4.6g [1] Does not include connectors, or mounting hardware B - 24 NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR


    Original     		1653g PDF

    DALLAS 2430A

    Abstract: 2430A DS2430AX-S TO-92 4 bits microcontroller DS2430AP T&R DS2430A DS2430AP DS2430AX J-STD-020A TSOC 6
    Contextual Info: ƒ ƒ ƒ ƒ ƒ es ig D ew 2 ORDERING INFORMATION N ot R ec DS2430A TO-92 Package DS2430AP 6-pin TSOC Package DS2430A/T&R TO-92 Package, Tape & Reel DS2430AP/T&R TSOC Package, Tape & Reel DS2430A+ TO-92 Package DS2430AP+ 6-pin TSOC Package DS2430A+T&R TO-92 Package, Tape & Reel


    Original     		ds2430ads2430apds2430a/tds2430ap/t+8ds2430axdallas 2430a2430ads2430ax-sto-92 4 bits microcontrollerds2430ap t&rj-std-020atsoc 6 PDF

    hssop

    Abstract: 32 QFP PACKAGE thermal resistance mitsubishi mounting technology
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES ORDERING INFORMATION TABLE OF CONTENTS 1 . GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION 3. PACKAGE STRUCTURE 4. PACKAGE CODING CONVENTIONS 5. PACKAGE LINE-UP 2 . DETAILED DIAGRAM OF PACKAGE OUTLINES


    Original     		hssop32 qfp package thermal resistancemitsubishi mounting technology PDF

    DIP40

    Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
    Contextual Info: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)


    Original     		ot97-1dip14ot27-1dip16+13ot38-1dip20ot146-1dip24ot101-1dip28dip40lqfp100lqfp128lqfp64qfp44015adze 004-1 PDF

    pmfp

    Abstract: SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1
    Contextual Info: PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1


    Original     		ot97-1dip16ot38-1ot144-1+10ot96-1ot96-2ot158-2pmfpso8 packagems-012aavso40sot176-1075e03sot144-1 PDF

    tensolite

    Contextual Info: v01.0310 C-11 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-11 Package Outline Drawing Package Information NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. PLATING: GOLD PLATE OVER NICKEL PLATE Package Type C-11 Package Weight [1] 20 gms [2] 4. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].


    Original     		231ccsftensolite PDF

    BGA and QFP Package mounting

    Abstract: oki Package SOJ PGA wire bonding he package information document consisting of 8 chapters in total "the package information document consisting of 8 chapters in total"
    Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 2. PACKAGE OUTLINES AND DIMENSIONS This document is Chapter 2 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 2. PACKAGE OUTLINES AND DIMENSIONS


    Original     		bga and qfp package mountingoki package sojpga wire bondinghe package information document consisting of 8 chapters in total+1the package information document consisting of 8 chapters in total PDF

    oki qfp tray

    Abstract: Ultrasonic humidifier circuit 750H OKI Year Work Week "the package information document consisting of 8 chapters in total" Oki Moisture Oki Moisture level
    Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE This document is Chapter 3 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE


    Original     		oki qfp trayultrasonic humidifier circuit750hoki year work week+3the package information document consisting of 8 chapters in totaloki moistureoki moisture level PDF

    dallas 2430A

    Abstract: 2430A 2430A IC DS2430AP/T-R DS2430A DS2430AP DS2430AX DS2430AX-S J-STD-020A rn wire wrap
    Contextual Info: DS2430A 256-Bit 1-Wire EEPROM ƒ ƒ ƒ ƒ ƒ ORDERING INFORMATION N ot R ec DS2430A TO-92 Package DS2430AP 6-pin TSOC Package DS2430A/T&R TO-92 Package, Tape & Reel DS2430AP/T&R TSOC Package, Tape & Reel DS2430A+ TO-92 Package DS2430AP+ 6-pin TSOC Package


    Original     		ds2430a256-bitds2430apds2430a/t+9ds2430ap/tdallas 2430a2430a2430a icds2430ap/t-rds2430axds2430ax-sj-std-020arn wire wrap PDF

    SC-606-B

    Abstract: SC-555-24A BP-119 SC-639 MO-142BA MO-061-AB
    Contextual Info: Package Information Package Names and Code Designations T he package nam e assigned by the com pany is a package code indicating the shape of the package, the package m aterial, and the num ber o f pins. The diagram below show s the content o f the code designation.


    OCR Scan     		cp-28dnmo-077absc-633-acp-32db+11mo-061absc-638ttp-32drmo-133ca119-0obp-119sc-606-bsc-555-24asc-639mo-142bamo-061-ab PDF

    QFP160-P-2828-0

    Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
    Contextual Info: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE


    Original     		qfp160-p-2828-0qfp304tsop 66 pin package thermal resistancetsop 48 thermal resistance+6bga 208 packageqfj32-p-r450-1sdip64-p-750-1soj28-p-400-1qfp208-p-2828-0tsop 48 thermal resistance junction to case PDF

    dallas 2430A

    Abstract: BF422 EQUIVALENT DS2430A T equivalent DS2430AP T
    Contextual Info: DS2430A 256-Bit 1-Wire EEPROM ƒ ƒ ƒ ƒ ƒ ORDERING INFORMATION N ot R ec DS2430A TO-92 Package DS2430AP 6-pin TSOC Package DS2430A/T&R TO-92 Package, Tape & Reel DS2430AP/T&R TSOC Package, Tape & Reel DS2430A+ TO-92 Package DS2430AP+ 6-pin TSOC Package


    Original     		ds2430a256-bit64-bit48-bit+756-g0006-001a56-g0006-003ads2430axdallas 2430abf422 equivalentds2430a t equivalentds2430ap t PDF

    SC 2272

    Contextual Info: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration o f your circumstance. When you use the package that has the material variation, please write down the package name in a form in


    OCR Scan     		dp-22ndp-22nbhm6287hm6288+6dp-24nchm6208hhm6207hdp-28hm62256bsc 2272 PDF

    EDR-7311

    Abstract: MS-024BB MO-142BO HN27C256A
    Contextual Info: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration o f your circumstance. When you use the package that has the material variation, please write down the package name in a form in


    OCR Scan     		dp-22ndp-22nbhm6287hm6288+9dp-24nchm6208hhm6207hdp-28hm62256bedr-7311ms-024bbmo-142bohn27c256a PDF

    HM51W16405

    Contextual Info: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration o f your circumstance. When you use the package that has the material variation, please write down the package name in a form in


    OCR Scan     		dp-22ndp-22nbhm6287hm6288+6dp-24ncdp-28hm6208hhm6207hhm62256bhm51w16405 PDF

    SC-606-B

    Abstract: HM62256B MS-024BB HM6207H HM6208H HM6264B HM6287 HM6288 HM9264B 024bb
    Contextual Info: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration of your circumstance. When you use the package that has the material variation, please write down the package name in a form in


    Original     		dp-22nhm6287dp-22nbhm6288+10hm6208hdp-24nchm6207hdp-28hm62256bsc-606-bms-024bbhm6264bhm9264b024bb PDF