PACK12 Search Results

Contextual Info: C a t a lo g 1 3 0 7 5 1 5 Issued 9-99 Z-PACK12 Row 2mm Connectors Right Angle Receptacle Center Module Continued (Continued) Backplane Systems M aterials: Contact Area Plating — 0.8pm Au min. over 1.3pm Ni min. Compliant Pin Plating — 0.5pm Tin min. over 1.3pm Ni min.

Contextual Info: Issued 9-99 Z-PACK12 Row 2mm Connectors Right Angle Receptacle Right Module C ontinued (Continued) Materials: Contact Area Plating — 0.8pm Au min. over 1.3|jm Ni min. Compliant Pin Plating — 0.5pm Tin min. over 1.3pm Ni min. Contact — Phosphor Bronze

Contextual Info: Catalog 1307515 Issued 9-99 Z-PACK12 Row 2mm Connectors Continued Z-PACK 12 Row Pin Sequencing Request Form Custom er: Prepared By: Date: Order/Ref. No: Dept.: Select Male Contact Type A, B, C, K, P,T, or blank. Left Center Right (circle one) Male Pin Options

sound Processor acp 2371

Abstract: MAC198 SI 1340H MSP2400 ACP 2371 1030h vcu2133a SI 1020H dma2275 TPU2740
Contextual Info: MICRONAS INTERMETALL DMA 2275, DMA 2286 C/D/D2-MAC Descrambler MICRONAS Edition May 20, 1992 6251-330-1E DMA 2275, DMA 2286 Contents Page Section Title 4 4 4 1. 1.1. 1.2. Introduction General Information Environment 5 2. Chip Architecture 6 6 6 6 6 3. 3.1.

itt digit 2000

Abstract: vcu2133a DMA2271 DMA 2386 MSP2400 uvc3130 CCU 3000 07c0H-07f8H ITT semiconductors ACP 2371
Contextual Info: MICRONAS INTERMETALL DMA 2275, DMA 2286 C/D/D2-MAC Descrambler MICRONAS Edition May 20, 1992 6251-330-1E DMA 2275, DMA 2286 Contents Page Section Title 4 4 4 1. 1.1. 1.2. Introduction General Information Environment 5 2. Chip Architecture 6 6 6 6 6 3. 3.1.

ITT ccu 3000 i

Contextual Info: MICRONAS INTERMETALL DMA 2275, DMA 2286 C/D/D2-MAC Descrambler MICRONAS Edition May 20, 1992 6251-330-1E DMA 2275, DMA 2286 Contents Page Section Title 4 4 4 1. 1.1. 1.2. Introduction General Information Environment 5 2. Chip Architecture 6 6 6 6 6 3. 3.1.