P2185 Search Results

dn729

Abstract: P2254 P22154 P22264 P22328 P2252
Contextual Info: RELIABILITY MONITOR DS1210S JAN '98 MONITOR-HYUNDAI DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210 C1 9750 DN738347AAA 16 PIN SOIC HYUNDAI-KOREA HEI PROCESS Single Poly, Single Metal 3.0 µm POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)

Contextual Info: DATE THIS DESIGN HAS NOT BEEN APPROVED BY THE ASP DEPARTMENT AS OF 0 1 -0 6 -0 0 COW ANY: □ ACCEPTANCE O F DRAYYNQ CUSTOMER SIGNATURE □ A C C ffT E D WITH DEVIATIONS LIS T S DO NOT FAX THIS PRINT IF YOU HAVE fm QUESTIONS REGARDING THIS PRINT PLEASE CONTACT CLAY WHITTAKER AT EXT. 231B

P21096

Abstract: 208-MIL P2075
Contextual Info: RELIABILITY MONITOR DS1000M-25 NOV.'97 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9727 DD711504ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1

P22328

Abstract: P22157 p22230 mar 9746
Contextual Info: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153 A7 JUN '98 P22294 9740 ANAM-KOREA AICL DN725561AAB 44 PIN PLCC 48 237 DS2153Q A7 MAR '98 P22292

P22157

Abstract: P21637 9744 P2220 P22200 P22123 208mil
Contextual Info: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153 A7 JUN '98 P22294 9740 ANAM-KOREA AICL DN725561AAB 44 PIN PLCC 48 237 DS2153Q A7 MAR '98 P22292

P22243

Abstract: DS1267E DN7-36 P22154 P21256
Contextual Info: RELIABILITY MONITOR DS1000M-25 FEB '98 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9750 DD740614ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1

P2215

Abstract: P22102 P22372 P22121 40Pn B1 9742 P22071 dallas date code ds1230 208mil P22403
Contextual Info: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250T Y JUN 98 P22125 9814 DALLAS 101397 SIP STICK 100 11 DS2250T Y JUN 98 P22125 9814 DALLAS

h 9740

Abstract: dallas date code ds12887 P21256 9735 h P21490 P2070 P22149 B1 9742 dallas date code DS80320
Contextual Info: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250 na DEC 97 P21100 9743 DALLAS 096841 SIP STICK 100 11 DS2250 na DEC 97 P21100 9743 DALLAS

Contextual Info: a Preliminary Technical Data DSP Microcomputer ADSP-2185M FEATURES Performance • • • • • • • 13.3 ns Instruction Cycle Time @ 2.5 Volts internal , 75 MIPS Sustained Performance Single-Cycle Instruction Execution Single-Cycle Context Switch 3-Bus Architecture Allows Dual Operand Fetches in Every Instruction Cycle

P21256

Abstract: P22102 P22154 P22149 ds1302 dallas h 9740 P22021 P21308
Contextual Info: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250T Y JUN 98 P22125 9814 DALLAS 101397 SIP STICK 100 11 DS2250T Y JUN 98 P22125 9814 DALLAS

DS80320

Abstract: P21091
Contextual Info: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153Q A7 DEC.'97 P21120 9730 ANAM-KOREA AICL DN718550AAE 44 PIN PLCC 48 233 DS2153Q A7 MAR '98 P22292

Contextual Info: ANALOG DEVICES FEATURES P E RF O RMANC E DSP Microcomputer ADSP- 2185 L FUNC TIO NAL BLOCK DIAGRAM 30 ns I n s t r u c t i o n Cycl e T i m e 33 MI PS S u s t a i n e d P e r f or m ance S i n g l e- Cy c l e I n s t r u c t i o n Ex e c u t i o n S i n g l e- Cy c l e C o n t e x t S w i t c h