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69192-440HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch. |
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10127819-24421LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 30u\\ Gold plating, Black Color, 24 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
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10131319-2442100LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 30u\\ Gold on Contact area (100u\\ Matte Tin on Tails) plating, Black Color, 24 Positions, Non GW Compatible Nylon66, Tray Packing. |
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10131319-244110TLF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 30u\\ Gold on Contact area (100u\\ Matte Tin on Tails) plating, Natural Color, 24 Positions, Non GW Compatible Nylon66, Tape and Reel with cap. |
PDF
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10131319-24412GTLF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 30u\\ Gold on Contact area (100u\\ Matte Tin on Tails) plating, Natural Color, 24 Positions, LCP, GW Compatible, Tape and Reel with cap. |
PDF
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