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87916-118HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail. |
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131-6118-11D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate. |
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131-6118-21D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate. |
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68016-118HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100) Pitch. |
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131-6118-21H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP. |
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131-6118-11H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP. |
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