OKI PACKAGE INFORMATION PB Search Results

PBGA313

Contextual Info: P-BGA313-3535-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

Contextual Info: P-BGA420-3535-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

PBGA352

Abstract: BGA352 P-BGA-352 PBGA3523535
Contextual Info: P-BGA352-3535-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

PBGA272

Abstract: PBGA-272 P-BGA-272 BGA272
Contextual Info: P-BGA272-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

PBGA388

Contextual Info: P-BGA388-3535-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

P-BGA-292

Abstract: PBGA292
Contextual Info: P-BGA292-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

Contextual Info: P-BGA560-3535-1.00 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

BGA256

Abstract: P-BGA-256-2
Contextual Info: P-BGA256-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

PBGA225

Abstract: BGA225
Contextual Info: P-BGA225-2727-1.5 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

822 gfp

Abstract: MG73Q oki cross MG74Q MSM98Q MSM99Q lvds vhdl B15240
Contextual Info: DATA SHEET O K I A S I C P R O D U C T S MG73Q000/74Q000 and MSM98Q000/99Q000 0.35µm Customer Structured Arrays November 1999 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––

539 b14

Abstract: oki cross MG73Q MG74Q MSM98Q MSM99Q M98Q memory compiler
Contextual Info: DATA SHEET O K I A S I C P R O D U C T S MG73/74Q and MSM98Q/99Q 0.35µm Customer Structured Arrays August 2002 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––

oki cross

Abstract: BGA 27X27 pitch
Contextual Info: DATA SHEET O K I A S I C P R O D U C T S MG87P3/87P4/87P5 0.25µm Standard Cell August 2002 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––

oki cross

Abstract: ARM920T MG73M MG74M MG75M
Contextual Info: DATA SHEET O K I A S I C P R O D U C T S MG73M/74M/75M 0.16µm Customer Structured Arrays August 2002 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––

MSM13Q

Abstract: L9013Q13Q
Contextual Info: DATA SHEET O K I A S I C P R O D U C T S MSM13/14Q 0.35 µm Sea of Gates Arrays August 2002 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––

AMBIT inverter

Abstract: oki cross MG113P MG115P MG73P MG74P MG75P
Contextual Info: D ATA SHEET O K I A S I C P R O D U C T S MG113P/114P/115P/73P/74P/75P 0.25µm Sea of Gates and Customer Structured Arrays July 2001 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––

oki cross

Contextual Info: D ATA SHEET O K I A S I C P R O D U C T S MG87P3/87P4/87P5 0.25µm Standard Cell July 2001 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––

oki cross

Abstract: MG63P MG64P MG65P b0268
Contextual Info: DATA SHEET O K I A S I C P R O D U C T S MG63P/64P/65P 0.25µm Embedded DRAM/ Customer Structured Arrays November 1998 MG63P/64P/65P 0.25µm Embedded DRAM/Customer Structured Arrays DESCRIPTION Oki’s 0.25 µm MG63P/64P/65P Application-Specific Integrated Circuit ASIC provides the ability to

oki cross

Abstract: MG113P MG115P MG73P MG74P MG75P MSI IC application with calculation
Contextual Info: DATA SHEET O K I A S I C P R O D U C T S MG113P/114P/115P/73P/74P/75P 0.25µm Sea of Gates and Customer Structured Arrays August 2002 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––

MG74n

Abstract: MG75N oki cross MG73N inverter ic 3524 application
Contextual Info: DATA S HEET O K I A S I C P R O D U C T S MG73N/74N/75N 0.22µm Customer Structure Array August 2002 MG73N/74N/75N ii 0.22µm Customer Structure Array Oki Semiconductor CONTENTS

MG75M

Abstract: IC ATA 2398 oki cross ARM920T MG73M MG74P MG75P virage virage .spec
Contextual Info: D ATA SHEET O K I A S P RELIMINARY I C P R O D U C T S MG73M/74M/75M 0.16µm Customer Structured Arrays July 2001 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––

MSM13Q

Abstract: base cell floorplan io uart vhdl
Contextual Info: DATA SHEET O K I A S I C P R O D U C T S MSM13Q/14Q000 0.35 µm Sea of Gates Arrays November 1999 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––

oki cross

Abstract: MG113P MG115P MG73P MG74P MG75P
Contextual Info: DATA SHEET O K I A S I C P R O D U C T S Preliminary MG113P/114P/115P/73P/74P/75P 0.25µm Sea of Gates and Customer Structured Arrays March 1998 MG113P/114P/115P/73P/74P/75P Preliminary 0.25µm Sea of Gates and Customer Structured Arrays DESCRIPTION Oki’s 0.25µm Application-Specific Integrated Circuit ASIC products are available in both Sea Of Gates

BCM2002X

Abstract: CX72303 ML7055 ML7055HB ML7055LA ML7055LP
Contextual Info: OKI Semiconductor ML7055 FEDL7055-02 Issue Date: Apr. 8, 2003 Bluetooth Baseband Controller IC GENERAL DESCRIPTION The ML7055 is a CMOS digital IC for use in 2.4 GHz band Bluetooth systems. This IC incorporates the ARM7TDMI as the CPU core, features a highly expandable architecture, and supports the interfaces for a variety

ML81221GD

Abstract: OKI date code OKI PACKAGE INFORMATION PB OKI pB FREE
Contextual Info: OKI Semiconductor ML81221GD FEDL81221GD-01 Issue Date: February. 8, 2008 High Isolation DPDT RF Switch GENERAL DESCRIPTION The ML81221GD is a DPDT Double-Pole Double-Throw MOSFET RF (Radio Frequency) switch IC. This switch is designed to cover a broad range of applications from DC through 2GHz, and integrates on-chip CMOS