O28 PACKAGE Search Results

51-85062-C

Abstract: package
Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Lead 5.3 mm Shrunk Small Outline Package O20 51-85077-*C 1 Package Diagram 24-Lead (5.3 mm) Shrunk Small Outline Package O24 51-85078-* 2 Package Diagram 28-Lead (5.3 mm) Shrunk Small Outline Package O28

34-pin

Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Packag O20 1 Package Diagram 28-Lead Shrunk Small Outline Package O28 34-Pin Shrunk Small Outline Package O34 2 Package Diagram 48-Lead Shrunk Small Outline Package O48 56-Lead Shrunk Small Outline Package O56

MAB 01D

Abstract: c336 transistors connect water level sensor to msp430 DIODE c336 MSP430C337 MSP430P337 MSP430C336 2R5 PTC LS29
Contextual Info: MSP430x33x MIXED SIGNAL MICROCONTROLLERS SLAS163 – FEBRUARY 1998 D D D D D D D D D D D VSS1 Xin Xout/TCLK XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI R33 R23 R13 R03 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 VCC1 CIN TP0.0 TP0.1 TP0.2 TP0.3 TP0.4

Contextual Info: MSP430x33x MIXED SIGNAL MICROCONTROLLERS SLAS163 – FEBRUARY 1998 D D D D D D D D D D D VSS1 Xin Xout/TCLK XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI R33 R23 R13 R03 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 VCC1 CIN TP0.0 TP0.1 TP0.2 TP0.3 TP0.4

O28 Package

Abstract: WF2M32-XXX5 WF2M32U-XG2UX 68 lead CQFJ
Contextual Info: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES Access Time of 90, 120, 150ns Organized as 2Mx32 Packaging: Commercial, Industrial, and Military Temperature Ranges • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .

Contextual Info: fax id: 2053 CYPRESS PRELIMINARY C YM 1861V33 2,048K X 32 3.3V Static RAM Module Features • H igh-density 3.3V 64-megabit SRAM module • 32-bit Standard F ootprint supports densities from 16K x 32 through 2M x 32 • High-speed SRAMs packages mounted on an epoxy laminate substrate. Four chip

WF2M32-XXX5

Contextual Info: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square

MACH131SP-5YC-7YI

Abstract: 14051k MACH Programmer PAL 007 PAL 007 A Pal programming MACH111SP MACH211SP mach210 die Vantis macro gates
Contextual Info: MACH 1 and 2 CPLD Families High-Performance EE CMOS Programmable Logic FEATURES ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ High-performance electrically-erasable CMOS PLD families 32 to 128 macrocells 44 to 100 pins in cost-effective PLCC, PQFP and TQFP packages

MACH211SP

Abstract: mach schematic MACH111SP
Contextual Info: MACH 1 and 2 CPLD Families High-Performance EE CMOS Programmable Logic FEATURES ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ High-performance electrically-erasable CMOS PLD families 32 to 128 macrocells 44 to 100 pins in cost-effective PLCC, PQFP and TQFP packages

Contextual Info: White Electronic Designs WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Access Times of 15, 17, 20ns Low Power CMOS Low Voltage Operation TTL Compatible Inputs and Outputs Packaging Fully Static Operation: • 66-pin, PGA Type, 1.075 inch square, Hermetic

Contextual Info: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES Access Times of 15*, 17, 20, 25, 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging 5 Volt Power Supply • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400 .

WS512K32V-XXX

Abstract: WS512K32V-XG2UX
Contextual Info: White Electronic Designs WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Access Times of 15, 17, 20ns Low Power CMOS Low Voltage Operation TTL Compatible Inputs and Outputs Packaging Fully Static Operation: • 66-pin, PGA Type, 1.075 inch square, Hermetic

Contextual Info: White Electronic Designs WS512K32V-XXX PRELIMINARY* 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Low Power CMOS Access Times of 15, 17, 20ns TTL Compatible Inputs and Outputs Low Voltage Operation Fully Static Operation: Packaging • No clock or refresh required.

Contextual Info: WS512K32V-XXX White Electronic Designs 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES n n Access Times of 15, 17, 20ns PRELIMINARY* Low Voltage Operation: • 3.3V ± 10% Power Supply n Low Voltage Operation n Low Power CMOS n Packaging n TTL Compatible Inputs and Outputs

WS512K32V-XXX

Abstract: ah55
Contextual Info: WS512K32V-XXX HI-RELIABILITY PRODUCT 512Kx32 SRAM 3.3V MODULE ADVANCED* FEATURES • Access Times of 70, 85, 100, 120ns ■ Low Voltage • 3.3V ±10% Power Supply ■ Packaging ■ Low Power CMOS • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401

M4A3-256

Contextual Info: ispMACH 4A CPLD Family High Performance E2CMOS In-System Programmable Logic FEATURES Lead-Free Package Options Available! ◆ High-performance, E2CMOS 3.3-V & 5-V CPLD families ◆ Flexible architecture for rapid logic designs ◆ ◆ ◆ ◆ ◆ ◆

WF4M32-XXX5

Contextual Info: White Electronic Designs WF4M32-XXX5 PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package 502), 3.5mm (0.140") height.

WS1M32-XG3X

Abstract: S1M32
Contextual Info: WS1M32-XXX White Electronic Designs 1Mx32 SRAM MODULE FEATURES • Access Times of 17, 20, 25ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging • 84 lead, 28mm CQFP, Package 511 ■ TTL Compatible Inputs and Outputs • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP

WS512K32V

Contextual Info: WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES  Access Times of 15, 17, 20ns  TTL Compatible Inputs and Outputs  Low Voltage Operation  Fully Static Operation: • No clock or refresh required.  Packaging  Three State Output.

WS128K32V-XG1UX

Abstract: WS128K32V-XG2TX WS128K32V-XH1X
Contextual Info: WS128K32V-XXX 128Kx32 3.3V SRAM MULTICHIP PACKAGE PRELIMINARY* FEATURES • Access Times of 15*, 17, 20, 25, 35ns ■ 3.3 Volt Power Supply ■ Low Voltage Operation ■ Low Power CMOS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic

tms 3755

Abstract: MACH110 MACH111SP MACH211SP MACHpro cpld manual
Contextual Info: MACH 1 & 2 FAMILIES 1 MACH 1 & 2 Families MACH 1 and 2 Families High-Performance, Low Cost EE CMOS Programmable Logic DISTINCTIVE CHARACTERISTICS ◆ High-performance, low-cost, electrically-erasable CMOS PLD families ◆ 32 to 128 macrocells 1250 to 5000 PLD gates

IDT7MP4060

Abstract: IDT7MP4095
Contextual Info: Integrated Device Technology, Inc. IDT7MP4060 IDT7MP4095 128K x 32 CMOS STATIC RAM MODULES FEATURES: DESCRIPTION: • High density 4 megabit static RAM modules • Low profile 64-pin ZIP Zig-zag In-line vertical Package , 64-lead, 72-lead SIMMs (Single In-line Memory Modules)

CY2281

Abstract: CY2281-11S
Contextual Info: PRELIMINARY CY2281 100MHz Pentium II Clock Synthesizer/Driver with Spread Spectrum for Mobile PCs Features duce EMI in certain high-speed systems. A summary of clock outputs for both devices is shown below. • Mixed 2.5V and 3.3V operation • Complete clock solution for Pentium® II, and other similar processor-based motherboards

IDT7MP4060

Abstract: IDT7MP4095
Contextual Info: IDT7MP4060 IDT7MP4095 128K x 32 CMOS STATIC RAM MODULES Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High density 4 megabit static RAM modules • Low profile 64-pin ZIP Zig-zag In-line vertical Package , 64-lead, 72-lead SIMMs (Single In-line Memory Modules)