NTHS Search Results

ChipFET

Abstract: NTHS5443T1
Contextual Info: NTHS5443T1 Power MOSFET P-Channel ChipFETE 3.6 Amps, 20 Volts Features • Low RDS on for Higher Efficiency • Logic Level Gate Drive • Miniature ChipFET Surface Mount Package Saves Board Space http://onsemi.com 3.6 AMPS 20 VOLTS RDS(on) = 65 mW Applications

65a3

Abstract: NTHS5441 NTHS5441T1 NTHS5441T1G
Contextual Info: NTHS5441 Power MOSFET −20 V, −5.3 A, P−Channel ChipFET] Features • • • • • Low RDS on Higher Efficiency Extending Battery Life Logic Level Gate Drive Miniature ChipFET Surface Mount Package Pb−Free Package is Available http://onsemi.com

Contextual Info: NTHS4111P Power MOSFET −30 V, −6.1 A, Single P−Channel, ChipFETt Features • • • • Offers an Ultra Low RDS on Solution in the ChipFET Package ChipFET Package 40% Smaller Footprint than TSOP−6 Low Profile (<1.1 mm) for Extremely Thin Environments

max9520

Abstract: NTHS4501N
Contextual Info: NTHS4501N Power MOSFET 30 V, 6.7 A, Single N−Channel, ChipFETt Package Features • Planar Technology Device Offers Low RDS on and Fast Switching Speed • • • in a ChipFET Package Leadless ChipFET Package has 40% Smaller Footprint than TSOP−6. Ideal Device for Applications Where Board Space is at a Premium.

Contextual Info: MODEL NTHS 1012 ElA Size NTC Thermistors with Nickel Barrier Surface Mount Chip FEATURES • Wraparound Nickel Barrier termination • Allows design flexibility for use with hybrid circuitry • High-density monolithic ceramic construction • Available in 17mm tape and reel

NTHS-1005

Abstract: NTHS-1205 S-1005N02 S-1012N02
Contextual Info: MODEL NTHS NTC Thermistors Surface Mount Chip FEATURES • W rapa rou nd te rm in a tio n s • A llo w s de sig n fle xib ility fo r use w ith hybrid circu itry • H igh-d en sity m on olithic ce ra m ic con stru ction • A va ila b le in 8m m tap e and reel packaging

SMD Thermistors-Sample Kit

Abstract: NTHS0603N01N1003JE
Contextual Info: SMD Thermistors-Sample Kit www.vishay.com Vishay Sample Kit Surface Mount Thermistors NTCS, TFPT, NTHS, PTS FEATURES • NTC and PTC thermistors • AEC-Q200 qualified and UL certified products available • Material categorization: for definitions of compliance please see

NTHS4166NT1G

Contextual Info: NTHS4166N Power MOSFET 30 V, 8.2 A, Single N-Channel, ChipFETt Package Features •ăTrench Technology •ăLow RDS on to Minimize Conduction Losses •ăLeadless ChipFET Package has 40% Smaller Footprint than TSOP-6 •ăExcellent Thermal Capabilities •ăThis is a Pb-Free Device

3x47

Abstract: 100 K NTC 2381
Contextual Info: NTHS a nd 2381 615 Se r ie s Key Benefits • Nickel/tin and tin/lead terminations available • Wraparound terminations • Allows design flexibility for use with hybrid circuitry • High-density monolithic construction • Customized values available APPLICATIONS

Contextual Info: NTHS a nd 2381 615 Se r ie s KEY BENEFITS • Nickel/tin and tin/lead terminations available • Wraparound terminations • Allows design flexibility for use with hybrid circuitry • High-density monolithic construction • Customized values available APPLICATIONS

Contextual Info: NTHS5443 Power MOSFET P−Channel ChipFETE −3.6 Amps, −20 Volts Features • Low RDS on for Higher Efficiency • Logic Level Gate Drive • Miniature ChipFET Surface Mount Package Saves Board Space Applications http://onsemi.com V(BR)DSS RDS(on) TYP

NTHS-0805

Abstract: ntc 008 NTHS-0603 NTC 30K NTC 6,8K NTC 22K 0805 ntc 470
Contextual Info: Model NTHS Vishay Dale NTC Thermistors Surface Mount Chip Glass Overglaze FEATURES Inner Electrode • Nickel barrier, tin/lead terminations. • Wraparound terminations. • Allows design flexibility for use with hybrid circuitry. • High-density monolithic construction.

NTHS5404

Abstract: NTHS5404T1 NTHS5404T1G
Contextual Info: NTHS5404 Power MOSFET 20 V, 7.2 A, N−Channel ChipFETE Features • • • • Low RDS on for Higher Efficiency Logic Level Gate Drive Miniature ChipFET Surface Mount Package Saves Board Space Pb−Free Package is Available http://onsemi.com V(BR)DSS RDS(on) TYP

Contextual Info: NTHS2101P 8.0 V, P−Channel Power MOSFET ChipFET] Single Package Features • Offers an Ultra Low RDS on Solution in the ChipFET Package • Miniature ChipFET Package 40% Smaller Footprint than TSOP−6 • • • • making it an Ideal Device for Applications where Board Space is at a

NTHS4501N

Abstract: NTHS4501NT1 NTHS4501NT1G
Contextual Info: NTHS4501N Power MOSFET 30 V, 6.7 A, Single N−Channel, ChipFETt Package Features • Planar Technology Device Offers Low RDS on and Fast Switching Speed http://onsemi.com in a ChipFET Package • Leadless ChipFET Package has 40% Smaller Footprint than TSOP−6.

NTHS5404

Abstract: NTHS5404T1 NTHS5404T1G 1206A-02
Contextual Info: NTHS5404 Power MOSFET 20 V, 7.2 A, N−Channel ChipFETE Features • • • • Low RDS on for Higher Efficiency Logic Level Gate Drive Miniature ChipFET Surface Mount Package Saves Board Space Pb−Free Package is Available http://onsemi.com V(BR)DSS RDS(on) TYP

NTHS5443

Abstract: NTHS5443T1 NTHS5443T1G
Contextual Info: NTHS5443 Power MOSFET −20 V, −4.9 A, P−Channel ChipFETt Features • • • • Low RDS on for Higher Efficiency Logic Level Gate Drive Miniature ChipFET Surface Mount Package Saves Board Space Pb−Free Package is Available Applications http://onsemi.com

NTHS1206N17N1003J

Abstract: NTHS0603N02N1002JE nths0805n02n1002je NTHS1206N01N1003JE NTHS0805N01N3302J THERMISTORS SCK 016 NTHS0402N01N1003JE NTHS0603N01N1003JE 01M1002JF 541-1078-ND
Contextual Info: Dale NEW! NTHS Series Surface Mount Size NTC Chip Thermistors Code L Features: • Solderable terminations • Wraparound terminations • Allows design flexibility for use with hybrid circuitry • High density monolithic construction Size Code 0402 0603

NTHS5441T1

Contextual Info: NTHS5441T1 Power MOSFET P-Channel ChipFETE 3.9 Amps, 20 Volts Features • • • • http://onsemi.com Low RDS on Higher Efficiency Extending Battery Life Logic Level Gate Drive Miniature ChipFET Surface Mount Package 3.9 AMPS 20 VOLTS RDS(on) = 60 mW Applications

Sn90-Pb10

Abstract: Sn90Pb10
Contextual Info: NTHS Vishay Dale NTC Thermistors, SMD Chip FEATURES • Extended resistance values available in standard sizes • Wraparound Ni barrier terminations with 100 % Sn or Sn90Pb10 • Allows design flexibility for use with hybrid circuitry • Available in bulk or tape and reel packaging

Contextual Info: NTHS5443 Power MOSFET −20 V, −4.9 A, P−Channel ChipFETt Features • • • • Low RDS on for Higher Efficiency Logic Level Gate Drive Miniature ChipFET Surface Mount Package Saves Board Space Pb−Free Package is Available Applications http://onsemi.com

power diodes with V-I characteristics

Abstract: 65A3 marking code gen 900 v 9 amp mosfet MARKING QG 6 PIN NTHS5441 NTHS5441T1 NTHS5441T1G
Contextual Info: NTHS5441 Power MOSFET P−Channel ChipFETE −3.9 Amps, −20 Volts Features • • • • • http://onsemi.com Low RDS on Higher Efficiency Extending Battery Life Logic Level Gate Drive Miniature ChipFET Surface Mount Package Pb−Free Package is Available

Contextual Info: REV, NC DATE D E 3 C R IP T O N INITIAL RELEASE D 5 /< ? l/0 4 * 1- 3.70 [.146] RECOMM ENDED CABLE STRIPPING DIM'S 2 9 .8 0 [1 - 1 7 4 ] NO TE: 1 . C R IM P E D F E R R U L E H E X C R IM P S IZ E . 2 5 5 " 2. UNLESS UHERVISf SPETTO DIMENS0N5 ARE INMU-NTHS. UUCNSDNS M [ ] ARC N

vishay ntc

Abstract: NTC 200K 0603 NTC 50K ntc 30k 0402 ntc 1.8K 25 NTC 2.8k
Contextual Info: NTHS Vishay NTC Thermistors, Surface Mount Chip FEATURES • Solderable terminations • Wraparound terminations • Allows design flexibility for use with hybrid circuitry • High-density monolithic construction NTHS PRODUCT R25 °C VALUE RANGE BY CURVE AVAILABILITY