NSL-4122 Search Results

NSL-4122 Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
54122-412202500LF		Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch	PDF
10137785-041221LF		Amphenol Communications Solutions	Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Black Color, 4 Positions, Non GW Compatible, with Post, Tray packing.	PDF
10137784-04122LF		Amphenol Communications Solutions	Minitek® Pwr 4.2 HCC, Single Row, Right Angle Through Hole Header, Nylon 66, Tin plating, Black Color, 4 Positions, Non GW Compatible, Tray packing.	PDF
68604-122HLF		Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54 mm (0.100in) Pitch.	PDF
54122-109501450LF		Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 50 position, 2.54mm (0.100in) pitch	PDF

NSL-4122 Datasheets (3)

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Silonex

Part	ECAD Model	Manufacturer	Description	Datasheet Type	PDF	PDF Size	Page count
NSL-4122		Silonex	Photocells(Ceramic)	Original	PDF	27.74KB	1
NSL-4122		Silonex	TO-18 Photoconductive Cells	Scan	PDF	130.59KB	2
NSL-4122		Silonex	Over 600 obsolete distributor catalogs now available on the Datasheet Archive - PLASTIC ENCAPSULATED CERAMIC PKG, TO-18	Scan	PDF	47.6KB	1