NEC ASIC PRODUCT LETTER Search Results

a1701

Abstract: CPRI CDR obsai NEC Technologies nec 0511 cpri
Contextual Info: SerDes ASIC Technology Macro for 622 Mbps to 3.2 Gbps in CB-130 ASIC technology Product Letter Description With the internal nick-name LINUS, NEC Electronics has developed a high speed interface SerDes macro for NEC's advanced CB-130 ASIC technology. It achieves data

CB-11

Abstract: nec asic product letter nec cb cell product letter
Contextual Info: 0.18 µm ASIC Technology CB-11 Cell-based CMOS ICs Product Letter Description NEC’s 0.18 µm CB-11 family incorporates ultra-high performance, deep sub-micron cellbased ASIC’s for high-end applications requiring high speeds, high integration density and

0.18-um CMOS technology characteristics

Abstract: NEC 71055 NEC V30MX DSPG 71055 STEPS 30175 V30MX VR10000 A1246 CMOS-10
Contextual Info: DATA SHEET PRODUCT LETTER CB-C10 2.5 Volt 0.25-Micron CMOS Cell-Based ASIC PRELIMINARY Figure 1. Chip Size Package CSP Description NEC’s 0.25 µm (0.18 µm eff.) CB-C10 family incorporates ultra-high performance, deep submicron cell-based ASIC’s for high-end

k941

Abstract: k 941 CMGS nec asic product letter sequential CIRCUIT nec ddr nec cb cell product letter
Contextual Info: ISSP/150 nm ASIC Technology ISSP1 - Standard Family Product Letter Description NEC‘s Instant Silicon Solution Platform ISSP is an ASIC architecture, that offers high system performance – up to 150 MHz system frequency and up to 250 MHz for local areas – in 0.13 µm (drawn) gate length technology at low NRE. ISSP

ISSP90

Abstract: FCBGA 1849-pin mb 1155 LVPECL25
Contextual Info: ISSP/ 90 nm ASIC Technology ISSP90 - Standard Family Product Letter Description NEC Electronics has introduced its next generation of Instant Silicon Solutions Platform ISSP™ with the ISSP90 Standard family, based on the company’s latest state-of-the-art

Contextual Info: SYSTEM-ON-CHIP LITE System-on-Chip Gate Array with ARM7TDMI subsystem Product Letter Description System-on-Chip Lite SoCLite is NEC’s new approach to low- to mid-volume system-onchip projects. SoCLite is based on standard ASIC technology and consists of two blocks:

ARM7tdmi functional diagram

Abstract: SMALL ELECTRONICS PROJECTS free 32-bit ARM A1504 A15402EE1V0UM00 AMBA AHB memory controller AMBA APB UART
Contextual Info: SYSTEM-ON-CHIP LITE System-on-Chip ARM7TDMI -based, customizable controller Product Letter Description System-on-Chip Lite SoCLite is NEC’s new approach for low- to mid-volume system-on-chip projects. The SoCLite device is based on standard ASIC technology and consists of two blocks: an ARM7TDMI®

A1430

Abstract: ea-9hd
Contextual Info: EA-9HD ASIC Technology 0.35 µm Embedded Array Product Letter Description The high performance density-enhanced 0.35 µm 0.25 µm effective EA-9HD embedded array family offers support for embedded high density macros combined with a short TAT of a gate array resulting in a time-to-market advantage. NEC Electronics combines high

CMOS-N5

Abstract: 45600 65882 NEC 65881 65881 sunrise tqfp nec tqfp 304 QFP 65882 nec
Contextual Info: 0.5 µm ASIC Technology CMOS-N5 Gate Array ICs Product Letter Description To serve the low-end gate-array market, where 5 Volt supply voltage is still a common requirement, NEC has released its 0.5 µm CMOS-N5 family of cost optimised gate-arrays. Drastic cost reductions have been achieved compared with the conventional CMOS-6 1 µm

32 bit AHB lite bus

Abstract: ARM7 microcontroller pin configuration ARM7TDMI-STM-based ARM7TDMI-S external bus interface unit multiport memory controller EB-SOCLITEPLUS-EP1S60V1 suffix part number NEC microcontroller free arm controller bridge 4580 a16902ee
Contextual Info: SYSTEM-ON-CHIP LITE + System-on-Chip Extended ARM7TDMI-STM-based, customizable microcontroller Product Letter • ARM7TDMI-S-based customizable microcontroller • Development platform for ARM7TDMI-S-based System-on-Chip design • Easy development and verification flow

a1698

Abstract: 8B10B asic nec 928 Cell-based ASIC 8B10B
Contextual Info: ISSP/150 nm ASIC Technology ISSP1 - High-Speed Interface Family Product Letter Description The ISSP1-HSI, the Instant Silicon Solutions PlatformTM ISSP High-Speed Interface (HSI) family, is a new class of ASIC device that features built-in, highspeed Serializer/Deserializer (SerDes) transceiver cores. Ideal for mid-volume

66207

Abstract: nec 151 nec asic product letter
Contextual Info: 150 µm Structured ASICs CMOS-12M Structured Array Product Letter Description CMOS-12M is NEC Electronics’ new structured array technology with embedded highdensity SRAMs and analog PLLs. The technology enables the integration of large size SRAM modules in structured array and is capable of supporting up to 2.6 Mb of embedded

NZ70008H

Abstract: STEPS 30175 STR 6755 k2736 NZ70 NEC V30MX V30MX nec 2508 nec 772 K398
Contextual Info: DATA SHEET PRODUCT LETTER CB-C9VX/VM 0.35-Micron CMOS Cell-Based ASICs Description Figure 1: System-Level-Integration The CB-C9VX/VM family offers ultra-high performance, deep submicron cell-based ASICs for high-end applications requiring high speeds, high integration density and low power

ARM7 instruction set

Abstract: 8 bit multiplier free 32-bit ARM block diagram for barrel shifter 8 bit barrel shifter 4 bit barrel shifter block diagram ARM7TDMI
Contextual Info: RISC CPU ASIC Core Library ARM7TDMI 32-bit Core Product Letter Description The ARM7TDMI is an ARM7 32-bit RISC processor core with the Thumb extension, Embedded ICE for ‘in ASIC’ debugging and a DSP enhanced multiplier. Thumb offers 32-bit RISC performance at

lvds to eDP

Abstract: CB-130UH Power consumption of FCBGA nec asic product letter nec cb cell-based product letter
Contextual Info: CB-130 0.13 µm Features >> 0.13 µm drawn silicon gate CMOS process >> Four transistor characteristics (low power, mid-range power, high speed, ultra-high speed) selectable on the same chip >> All-layer Cu wiring with up to 9 metal-layers options CB-130 Cell-based CMOS ASIC

32 bit AHB lite bus

Abstract: usb to rj45 connection diagram sub-d9 F uclinux JTAG MINI nec cpld SUBD25
Contextual Info: SYSTEM-ON-CHIP LITE + System-on-Chip Start it! Development Board Product Letter Description The System-on-Chip Lite+ Start it! development board is a starter kit for evaluation of the System-onChip Lite+ architecture by system designers who want to enter the ARM-based System-on-Chip world

nec 0511

Abstract: A1504 UDL 2003
Contextual Info: SYSTEM-ON-CHIP LITE System-on-Chip Design Flow Product Letter Introduction System-on-Chip Lite SoCLite is NEC’s new approach for low- to mid-volume SOC projects. Due to the fact, that the customer is required to design the UDL (User Defined Logic) area of the SoCLite device a smooth an easy design flow becomes important. The

ARM710T

Abstract: NEC 32bit Processor D-70565 I-00139
Contextual Info: RISC CPU ASIC Core Library ARM710T 32-bit Core with Cache Product Letter Description The ARM710T is a general-purpose 32-bit microprocessor with 8 KB cache, enlarged write buffer and Memory Management Unit MMU combined in a single chip. The CPU within the ARM710T is the

electrical project report

Contextual Info: CAD Design Services Static Timing Analysis & Postlayout Timing Fix Product Letter Description In deep submicron designs the impact of the wire gets more and more important and has to be taken into account already during initial logical synthesis. This is done by using

ARM946

Abstract: A14702EE3V0PL00 CB12 nec asic product letter
Contextual Info: CB-12 0.15 µm Features >> 0.15 µm drawn, 0.11 µm effective Cobalt Salicide CMOS process >> Three transistor characteristics (low power, standard, high performance) selectable on the same chip >> Up to 8 metal layers CB-12 Cell-based CMOS IC Featuring the selection of three different transistor characteristics on the same chip for achieving

e210882

Abstract: dell e210882 front 34 pin connector ibm pc FRONT PANEL connector CIRCUIT e210882 e210882* cmos reset intel Pentium 111 E210882 dell front connector e210882 dell e210882 e210882 beep codes Intel Desktop Board E210882 ibm E210882
Contextual Info: Intel Desktop Board D850EMD2/D850EMV2 Technical Product Specification April 2002 Order Number: A94395-001 The Intel® Desktop Boards D850EMD2/D850EMV2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications.

MF1359-02

Abstract: Q11C02RX Q22MA306 E0C33202 E0C33204 E0C33A104 PC-9800 S1C33L01 EM33-4M ASM-33
Contextual Info: MF1359-02 CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33 ASIC DESIGN GUIDE Embedded Array S1X50000 Series NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice.

SETE

Abstract: N1 ASIC EPOD332128
Contextual Info: MF1359-02 CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33 ASIC DESIGN GUIDE Embedded Array S1X50000 Series NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice.

se617

Abstract: vhdl code for 74192 UPD65891 a1387 transistor F495 transistor f422 equivalent tt 2246 Transistor TT 2246 transistor f422 UPD65883
Contextual Info: Design Manual CMOS-N5 Series CMOS Gate Array Ver. 7.0 Document No. A13826EJ7V0DM00 7th edition Date Published March 2004 N CP(K) c Printed in Japan [MEMO] 2 Design Manual A13826EJ7V0DM NOTES FOR CMOS DEVICES 1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the