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MXP7001 Datasheets (1)

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Microsemi

Part	ECAD Model	Manufacturer	Description	Datasheet Type	PDF	PDF Size	Page count
MXP7001		Microsemi	Photodiode, PIN Module, 0.45A/W Sensitivity, 0.05nA	Original	PDF	89.41KB	2

MXP7001 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
PIN photodiode 850nm Abstract: MXP7000 MXP7001 Contextual Info: MXP7001 – 12.5Gbps GaAs PIN Photo Diode OPTO-ELECTRONIC PRODUCTS ENGINEERING SPECIFICATION KEY FEATURES DESCRIPTION High Responsivity Low Dark Current High Bandwidth Anode/Cathode on Illuminated Side APPLICATIONS S Short Reach Optical Networks S 10Gigabit Ethernet, Fibre Channel	Original	mxp7001 10gigabit mxp7000 850nm +1pin photodiode 850nm	PDF
Contextual Info: MXP7001 – 10Gbps GaAs PIN Photo Diode OPTO-ELECTRONIC PRODUCTS ENGINEERING SPECIFICATION KEY FEATURES DESCRIPTION High Responsivity Low Dark Current High Bandwidth Anode/Cathode on Illuminated Side APPLICATIONS S Short Reach Optical Networks S Gigabit Ethernet, Fibre Channel	Original	mxp7001 10gbps mxp7000 850nm	PDF
VCSEL array, 850nm flip Abstract: MXP7001 Contextual Info: MXP7001 I N T E G R A T E D P R O D U C T S 10 Gbps GaAs PIN Photo Diode P RODUCTION D ATA S HEET KEY FEATURES DESCRIPTION either bond wire or flip chip configurations. This device is ideal for manufacturers of optical receivers, transponders, optical transmission	Original	mxp7001 850nm vcsel array, 850nm flip	PDF
VCSEL array, 850nm flip Abstract: MXP7001 GaAs array, 850nm Contextual Info: MXP7001 I N T E G R A T E D P R O D U C T S 10 Gbps GaAs PIN Photo Diode P RODUCTION D ATA S HEET KEY FEATURES DESCRIPTION either bond wire or flip chip configurations. This device is ideal for manufacturers of optical receivers, transponders, optical transmission	Original	mxp7001 vcsel array, 850nm flip gaas array, 850nm	PDF