MS512P Search Results
MS512P Price and Stock
Coilcraft Inc MS512PJD104MSZ |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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MS512PJD104MSZ | 80 |
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Buy Now | |||||||
MS512P Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: 6030 POWER INDUCTORS High Reliability Power Inductors MS512PYA • High temperature materials allow operation in ambient temperatures up to 155°C ■ Tin-lead Sn-Pb termination for the best possible board adhesion ■ Passes vibration testing to 80 G and shock testing to 1000 G |
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ms512pyams800-2 | |
TRAY FBGA 11X13
Abstract: S72MS512PE0HF94V MCP NAND sDR S72MS-P BGA 15X15 137-Ball MCP NAND DDR S30MS-P Spansion NAND Flash Spansion NAND Flash DIE
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s72ms-ptray fbga 11x13s72ms512pe0hf94vmcp nand sdr+6 | |
S30MS-P
Abstract: AMB128 S29WS-P S75WS256PEFJF5 S75WS256PEFKFF S75WS-P UtRAM Density Spansion NAND Flash DIE MS512P
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s75ws-ps30ms-pamb128s29ws-p+5 | |
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Contextual Info: 6235 POWER INDUCTORS High-Reliability Power Inductors MS512PJB • High temperature materials allow operation in ambient temperatures up to 155°C. ■ Special construction allows it to pass vibration testing to 80 G and shock testing to 1000 G. ■ Tin-lead Sn-Pb termination for the best possible board |
Original |
ms512pjbms587-1 | |
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Contextual Info: 6235 POWER INDUCTORS High-Reliability Power Inductors MS512PJB • High temperature materials allow operation in ambient temperatures up to 155°C. ■ Special construction allows it to pass vibration testing to 80 G and shock testing to 1000 G. ■ Tin-lead Sn-Pb termination for the best possible board |
Original |
ms512pjbms587-1 | |
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Contextual Info: 6030 POWER INDUCTORS High Reliability Power Inductors MS512PYA • High temperature materials allow operation in ambient temperatures up to 155°C ■ Tin-lead Sn-Pb termination for the best possible board adhesion ■ Passes vibration testing to 80 G and shock testing to 1000 G |
Original |
ms512pyams800-3 | |
N1056
Abstract: 2g nand mcp bsc nm 1st year S30MS-P 3g hsdpa signal Schematic Diagram S30MS01GP spansion ms nand flash format h.264
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s30ms-ps30ms01gps30ms512pgb/512+7 | |
137-Ball
Abstract: S30MS-P N1056 MS512P
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s30ms-ps30ms01gps30ms512p1gb/512mb+4 | |
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Contextual Info: 6030 POWER INDUCTORS High Reliability Power Inductors MS512PYA • High temperature materials allow operation in ambient temperatures up to 155°C ■ Tin-lead Sn-Pb termination for the best possible board adhesion ■ Passes vibration testing to 80 G and shock testing to 1000 G |
Original |
ms512pyams800-3 | |
S72WS512PFFJF9GH
Abstract: BGA 15X15 BGA 130 MCP NAND DDR 12X12 POP PACKAGE TRAY 15x15 bta 137 S72WS512PFFKFKGH N-ADQ14 NAND01
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s72ws-ps72ws512pffjf9ghbga 15x15bga 130 mcp nand ddr+6 | |
BGA 130 MCP NAND DDR
Abstract: JEP95 137-Ball DSA00272754 Flash MCp nand DRAM 137-ball S72WS512PEF N-ADQ12 130 MCP NAND DDR NAND FLASH BGA Flash MCp nand DRAM 107-ball
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s72ws-pbga 130 mcp nand ddrjep95137-ball+7 | |
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Contextual Info: 6235 POWER INDUCTORS High-Reliability Power Inductors MS512PJB • High temperature materials allow operation in ambient temperatures up to 155°C. ■ Special construction allows it to pass vibration testing to 80 G and shock testing to 1000 G. ■ Tin-lead Sn-Pb termination for the best possible board |
Original |
inductorsms512pjbms587-2 |