BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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bga16a1atternsbga676bga665bga-1156+7156 qfn 12x12lga240bga-783bga441bga1024bga15217286x
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SG-MLF-7017
Contextual Info: Top View GHz MLF Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm IC guide prevents over compression of elastomer
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225mm475mmultem1000mlf44c+5mlf64amlf60amlf76amlf36bsg-mlf-7017
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SG-MLF-7024
Abstract: MLF76A
Contextual Info: Top View GHz MLF Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm Sqr.
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225mm725mm475mmultem1000+2sg-mlf-7024mlf76a
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BA 758
Abstract: SG-MLF-7008 MLF24 MLF36
Contextual Info: GHz MLF Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm IC guide prevents over compression of elastomer
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225mmsg-mlf-7008ba 758mlf24+1mlf36
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