BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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bga16a1atternsbga676bga665bga-1156+7156 qfn 12x12lga240bga-783bga441bga1024bga15217286x
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SG-MLF-7010
Abstract: TL-TORQUEDRIVER-05
Contextual Info: GHz MLF Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly IC guide prevents over compression of elastomer
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DG-QFN20A-01
Contextual Info: Top View GHz MLF Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable connection Minimum real estate required 12.225mm Compression plate distributes forces evenly Easily removable swivel socket lid
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MLF24
Abstract: SG-MLF-7003
Contextual Info: Top View GHz MLF Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 12.225mm IC guide prevents over compression of elastomer
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225mmeslf24cmlf16bmlf12c+5mlf28emlf28dmlf20asg-mlf-7003mlf24
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