MITSUBISHI INTEGRATED CIRCUIT PACKAGES Search Results

carton

Abstract: packaging
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES STANDARD PACKAGING 1.3 PACKAGING WITH EMBOSSED CARRIER TAPING 1 STANDARD PACKING Inner packing label Inner carton Inner packing label Reel Outer carton Outer packing label Mar.’98 MITSUBISHI INTEGRATED CIRCUIT PACKAGES

carton

Abstract: MITSUBISHI integrated circuit
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES STANDARD PACKAGING 1.1 PACKAGING WITH TUBES 1 STANDARD PACKAGING Tubes Inner carton Inner packing label Outer carton Outer packing label Mar.’98 MITSUBISHI INTEGRATED CIRCUIT PACKAGES STANDARD PACKAGING (2) STANDARD PACKAGING (FOR MEMORY ICs)

mitsubishi marking

Abstract: mitsubishi part marking
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES MARKING SPECIFICATIONS 4.4 CUSTOMIZED MARKING Mitsubishi Electric can also produce devices with clientspecified part numbers, logos, etc. on a special order basis. Please contact your rep for detail. Mar.’98

Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6. IC PACKAGE ELECTRICAL CHARACTERISTICS Semiconductor devices are making rapid progress. They are becoming faster in speed, and more integrated, multifunctinal, and sophisticated. Mitsubishi is committing itself to developing IC packages with smart electrical characteristics, which are essential for

Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4.4 ADHESIVE TAPE 32 26 6 8 4.0 4 0.2 0.25 12 φ1.0 Mar.’98

integrated circuit

Abstract: 2 A 98
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4.5 TAPE REELS 1 EMBOSSED CARRIER TAPING REEL 330mm DIAMETER (MATERIAL : PS COMPOUND) T G φA φN φ13 MITSUBISHI Dimensions(mm) No. A G T 12mm 14.0 18.0 16mm 16.4

BGA and QFP Package mounting

Abstract: mitsubishi package integrated circuit
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE CLASSIFICATION 2. IC PACKAGE CLASSIFICATION The following pages classify Mitsubishi Packages by the sealing method and the mounting method. The conventions shown here are used throughout this DATA BOOK, so we suggest you take the time to review them.

ls00

Abstract: M74LS00P mitsubishi marking lot number mitsubishi marking m74ls00 mitsubishi lot marking marking mitsubishi MITSUBISHI marking example
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES MARKING SPECIFICATIONS 4. MARKING SPECIFICATIONS 4.1 GENERAL SPECIFICATIONS Mitsubishi ICs are marked with the device number, the lot number, and the Mitsubishi logo . We include the complete device number on all ICs except such space limited packages as 8-pin DIP and SOPs and so on. Available space determine the shortened form.

L142

Abstract: M095-51 M095-37 M095-14B M095-45 M095-06 M095-29 M095-23B m095
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4.2 TRAYS 1 TRAYS M095(MATERIAL : M095-01~06 : PS COMPOUND) M095-14B~ : PP COMPOUND W : 152.6 MITSUBISHI M095-40 ZW eW NW 160P6E-A HEAT PROOF L : 300.0 H ZL eL NL Pocket Pitch(mm)

Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES STANDARD PACKAGING 1.4 PACKAGING WITH ADHESIVE TAPING 1 STANDARD PACKAGING Inner packing label Inner carton Inner packing label Reel Outer carton Outer packing label Mar.’98

detail in table SURFACE MOUNT COMPONENTS

Abstract: MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.2 PRINTED CIRCUIT BOARD DESIGN In surface mounting, mount pad designing and board material selection are critical. Mount pad designing may influence solder yield. The substrate material may influence post-soldering reliability.

lga 1336

Abstract: ED-7401-2 pga144 lattice package dimension sop40 PGA0144-C-S15U-2 R400 S115 ZIP0020-P-0400-1 QFP 64 Cavity package
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES EIAJ PACKAGE CODES 3. EIAJ PACKAGE CODES Package codes specified in EIAJ Packages name and code for semiconductor device package (Integrated Circuits ED-7401-2) (1) Construction of package code (1) (2) (3) (4) (5) (6)

QFP PACKAGE thermal resistance

Abstract: ic and equivalent
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5. PACKAGE THERMAL RESISTANCE 5.1 EQUIVALENT THERMAL CIRCUIT The power dissipation of many ICs is, on a par with that of small-signal transistors, extremely small so that with the exception of power ICs

MP016PC2

Abstract: poly vinyl chloride MP525PC MP016PC-2 SP178 chloride MITSUBISHI INTEGRATED CIRCUIT PACKAGES Mitsubishi drawings
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4.1 TUBES Stopper pin Tube Stopper Scale : N.T.S Material Electrostatic protection Treatment 550 —1.5 Overall length PVC Poly Vinyl Chloride Electrostatic protection

hssop

Abstract: 32 QFP PACKAGE thermal resistance mitsubishi mounting technology
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES ORDERING INFORMATION TABLE OF CONTENTS 1 . GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION 3. PACKAGE STRUCTURE 4. PACKAGE CODING CONVENTIONS 5. PACKAGE LINE-UP 2 . DETAILED DIAGRAM OF PACKAGE OUTLINES

MO95

Abstract: carton L142 Mitsubishi LABEL
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES STANDARD PACKAGING 1.2 PACKAGING WITH TRAYS 1 MOISTURE-PROOF PACKAGING (L142 Tray Series; mainly used for shipment of TSOPs) Foam plastic bag Desiccant Trays yyyyyyyy yyyyyyyy yyyyyyyy yyyyyyyy yyyyyyyy yyyyyyyy yyyyyyyy

324pc

Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension

Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2. SURFACE MOUNTING PROCESS This chapter describes the surface mounting process, focusing on surface mounting technologies. For more information on the material and/or equipment, please consult your supplier.

"vacuum tube"

Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES FUNCTIONAL REQUIREMENTS 1. FUNCTIONAL REQUIREMENTS The history of electronic components is one of miniaturization and of increasing component-mounting densities. Active devices have evolved from vacuum tube through transistors to integrated circuits that contain peripheral circuitry as well. IC integration has advanced from LSI to

100MHZ

Abstract: IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6.2 IC PACKAGE ELECTRICAL CHARACTERISTICS Tables 1, 2 and 3 show electrical characteristics of packages of various types. They are called LCR values, which include Ls, Lm, Co, Cm,

printer component

Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES MOUNTING TECHNOLOGY OUTLINE 1. MOUNTING TECHNOLOGY OUTLINE In the electronics industry, the demand is increasing for devices that are more multifunctional while compact, with components mounted densely. This demand is expected to escalate.

senju solder paste

Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste

Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES DIRECTIONS FOR STORAGE AND TRANSPORTATION 2. DIRECTIONS FOR STORAGE AND TRANSPORTATION The design of packaging material has been devised to ensure that the quality of ICs will be retained until installation. However, handle the

1000H

Abstract: MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES INSTRUCTIONS TO BE FOLLOWED IN MOUNTING 3. INSTRUCTIONS TO BE FOLLOWED IN MOUNTING 3.1 PACKAGE CRACKING Introduction With electronic equipment becoming more compact, light-weight and sophisticated, the high-intensity mounting of semiconductor devices,