MICRO CIRCUIT ENGINEERING Search Results

Glenair MWDM2L

Abstract: Microway 85049 backshell saddle clamp BS9523 pcb connectors BS9523F0002 ASTM a240 83513 pigtail glenair 85049 torque 4-40 brass jackscrew "installation torque"
Contextual Info: Micro-D TwistPin Connectors and Accessories Product Selection Guide MIL-DTL-83513 Connectors Glenair COTS Micro-D Connectors Section A Section B Micro-D Printed Circuit Board Connectors Micro-D Backshells and Accessories Section B Section C MicroEdgeboard Connectors

Contextual Info: Manual Press with 25 Circuit Tooling Manual Press with Micro-D Backshell Crimp Tool Kit 25 Circuit Instruction Manual Order No. 62202-0000 For Micro-D Backshell Assembly 83424-9014 ΠΠΠDescription Operation Maintenance Order No ATS-622020000 Revision: A

393 EZ 952

Abstract: AA59466-0017 PM1015
Contextual Info: NEW PRODUCTS * MICRO-SCALE TEST KIT Micro-scale Test Kit accessories are designed to attach to industry standard multimeter test probes or prods. These accessories allow convenient and safe testing on breadboards or printed circuit boards. KT-MS002 includes:

AN-100

Abstract: CPC7582BC EIA-481-2 J-STD-020A 5510P
Contextual Info: CPC7584 Line Card Access Switch Description • Small 16-pin SOIC or micro-leadframe package • Micro-leadframe package MLP printed circuit board footprint is 70% smaller than 4TH generation EMRs and 60% smaller than SOIC version • Monolithic IC reliability

Contextual Info: 10/3/13 Micro-Ohm Precision Wirewound Miniature Rectangular Printed Circuit Lead Resistor produc guide PRECISION WIREWOUND MINIATURE RECTANGULAR Configuration with Printed Circuit Lead FEATURES: Ultra Stable - Meets Mil R-39005 Non-Inductive - Low Thermal EMF

Contextual Info: Agilent 11923A Connectors Product Overview Flexible micro-circuit packaging The Agilent Technologies 11923A 1.0 mm female-connector launch threads into a package or fixture housing to transition a microwave circuit from microstrip to coaxial connector. The 11923A

STR F 6234

Abstract: SC4105 AMD AM3 Processor Functional SB264 D16KB 8B44 pin diagram of amd am3 processor 36097E 1241GB 00314E
Contextual Info: STE D □ 2S7S27 aG313*ìO 043 • AMD3 PRELIMINARY AD V MICRO TELECOM Am79C30A ^ 7 5 -1 5 Advanced Micro Devices Digital Subscriber Controller (DSC™) Circuit DISTINCTIVE CHARACTERISTICS ■ Combines CCUT 1.430 S/T-lnterface Trans­ ceiver, D-Channel LAPD Processor, Audio

Contextual Info: STE □ 2S7S27 aG313*ìO 043 • AMD3 D PRELIMINARY AD V MICRO TELECOM ^ 7 5 -1 5 Am79C30A Advanced Micro Devices Digital Subscriber Controller (DSC™) Circuit DISTINCTIVE CHARACTERISTICS ■ Combines CCUT 1.430 S/T-lnterface Trans­ ceiver, D-Channel LAPD Processor, Audio

EIA-364-13

Abstract: EIA-364-20 EIA-364-21 EIA-364-27 EIA-364-28 EIA-364-52
Contextual Info: tifca Electronics 108-1955 Product Specification 160ct02 Rev A EC 0990-1551-02 AMPMODU* Micro Interconnect Plug and Receptacle Connectors 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the AMPMODU* Micro Interconnect cable mounted plug and printed circuit board mounted receptacle connectors available in

ARINC 568

Abstract: Micro Circuit Engineering "Micro Circuit Engineering" Micro Circuit Engineering 70014 application notes on ARINC-429 receiver return to zero decoder arinc 429 70003 four channel decoder 5 to 32 decoder circuit
Contextual Info: MICRO CIRCUIT ENGINEERING ALEXANDRA WAY ASHCHURCH BUSINESS CENTRE TEWKESBURY GLOUCESTERSHIRE, GL20 8TB UNITED KINGDOM DATABUS – ARINC 429 • One way digital information transmission system • Words of 32 bits are transmitted in bipolar return to zero format

TFD-101-011-10

Abstract: CC848808551 CC109103157 TFD-101-011-09 CC408617410 407998244 CC109145463 ED83368 ED83368-30 406700658
Contextual Info: PRODUCT OVERVIEW Micro-BDCBB -48V DC Battery Distribution Circuit Breaker Bay • Ideal for customer premise power applications • Digital meter interface Benefits Reliability – Delivers decades of service – High availability architecture – NEBS level 3 certified

AMP Spec 109-21-7

Abstract: 10C1 Spec 109-28-1 17105-3608
Contextual Info: PRODUCT SPECIFICATION 1. 1.1. SCOPE Content This specification covers performance, tests and quality requirements for AMP* Micro-Strip board to board right angle and vertical connector family. These assemblies accommodate a variety of printed circuit board thicknesses. Plug

PA66-GF30 RELAY

Abstract: PA66-GF30 RELAis PA66-GF30 RELAY schema PA66-GF30 Miniature glass fuses color coding subminiature fuses color coding JASO d 611 PA66-GF30 start relais PIV RATING 36 V DIODE with peak repetitive current 60A STK 4252
Contextual Info: Automotive Circuit Protection Products Contents Fuseology 1 Fuseology Relays 8 Relays ISO MINI Relays MICRO Relays STARTER Relays Surface Mount Varistors Multilayer Transient Voltage Surge Surpressor Resettable PTCs 1206L Series Surface Mount PTCs 1812L Series Surface Mount PTCs

STR F 6234

Abstract: 09893E e712 09893f 56497 440-256 lmr2 5d DSC 5D
Contextual Info: Am79C30A/32A Advanced Micro Devices Digital Subscriber Controller DSC™ Circuit DISTINCTIVE CHARACTERISTICS • Combines CCITT 1.430 S/T-lnterface Transceiv­ er, D-Channel LAPD Processor, Audio Proces­ sor (DSC device only), and IOM-2 Interface in a

DM74ALS1245A

Contextual Info: DM54ALS1245A/DM74ALS1245A TRI-STATE Bus Transceivers General Description Features This advanced low power Schottky device contains 8 pairs of TRI-STATE logic elements configured as octal bus trans­ ceivers. This circuit is designed for use in memory, micro­

Z4D-B02

Abstract: 175489-4 amp
Contextual Info: Micro-displacement Sensor Z4D-B02 • Dimensions ■ Features • • • • Note: All units are in millimeters unless otherwise indicated. 175489-4 Tyco Electronics AMP Easier control enabled by built-in processor circuit. Resolution: ±50 µm. Operating area: 9.5±3 mm.

Contextual Info: Quality and Reliabilty Introduction Superior integrated circuit device reliability is attained when it is an integral part of process devel­ opment, design and manufacturing. This section describes the methodology used by the IBM Micro­ electronics Division to achieve robust DRAM

k1b0

Abstract: AN-100 CPC7581 EIA-481-2 J-STD-020A IPC-9502
Contextual Info: CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions. • Monolithic IC reliability

Contextual Info: Quality and Reliabilty Introduction Superior integrated circuit device reliability is attained when it is an integral part of process devel­ opment, design and manufacturing. This section describes the methodology used by the IBM Micro­ electronics Division to achieve robust DRAM

AN-100

Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE J-STD-020A
Contextual Info: CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions. • Monolithic IC reliability

munsell 6.5

Abstract: distance sensor circuit
Contextual Info: Micro-displacement Sensor Z4D-B01 • Dimensions ■ Features Note: All units are in millimeters unless otherwise indicated. • • • • 2-175489-4 Tyco Electronics AMP Easier control enabled by built-in processor circuit. Resolution: ±10 µm. Operating area: 6.5±1 mm.

MT32018

Abstract: MT32028 Micro Circuit Engineering T3G27 DALE crystal 16Mhz iran manchester encoder 1553B generation circuit of manchester "Micro Circuit Engineering"
Contextual Info: MCI MT32018 MT32028 Micro Circuit Engineering ENCODER/DECODER ACTUAL SIZE M IL -S T D -1553B THE INTERNATIONAL STANDARD FEATURES SIMPLIFIED BLOCK SCHEMATIC T E R M IN A I ADDR ESS PARITY S ER E EN DIS B*T* vü r i r A B C • COMPLIANT TO 1553 • COMPLETE WORD VALIDATION

Z4D-B01

Contextual Info: Micro-displacement Sensor Z4D-B01 • Dimensions ■ Features Note: All units are in millimeters unless otherwise indicated. • • • • 2-175489-4 Tyco Electronics AMP Mounting reference plane Emitter axis +0.05 Two, 2 −0.15 dia. Two, 1 dia. Easier control enabled by built-in processor circuit.

Contextual Info: Electro-Films has developed a thin film process that has the unique capability of incorporating up to 5.0 mil thick plated copper conductors on the same substrate with standard 100 to 300 micro-inch thick conductors. Some hybrid circuit applications require thick copper conductors for the power lines but