METCAL IRON Search Results

hakko 907

Abstract: hakko 850 METCAL SP200 AC1102 HAKKO 937 2200C metcal Weller EC1302A AC1101
Contextual Info: Fume Extraction Systems OK O K I N T E R N A T I O N A LT M T o o l s OK International has been a leading manufacturer of tools for the electronics assembly work bench for almost 60 years. And, under the Metcal and Impell brand names, OK International has been an innovator in efficient, cost-effective systems to protect operators from hazardous fumes.

sdc 603

Abstract: SDC-602 plcc 52 SOCKET sdc603 MX-500P-21 sdc 606 sdc606 STTC-136 132 qfp extraction tool METCAL SP200
Contextual Info: soldering desoldering & rework systems contents and preface Contents 1 Introducing the QX2 2 QX2 system elements and functions 3 QX2 system elements and functions 4 Part numbers for the QX2 5 The power of SmartHeat 6 The power of SmartHeat 7 MX rework systems

weller ec 4000

Abstract: WRS3000 METCAL SP200 metcal ps-800 transistor WT4 wsp80 WT4 Transistor SSC50 weller wsp80 WD1000M
Contextual Info: WRS3000X Soldering/Desoldering Station PS-800 and PS-800E Soldering System Features: • The PS-800 Soldering System is compact for repetitive manual soldering and touch-up • Utilizes SmartHeat Technology • Requires no calibration • Uses replaceable heater tips rather than cartridges

metcal ps-800

Abstract: METCAL SP200 MX-500 metcal circuit ps-800 mx500 pht 094 tips SP200 sfv 04 STTC-1137P
Contextual Info: SmartHeat Power TipsTM Our SmartHeat® PowerTipTM technology meets the needs of high thermal demands of lead-free alloys and other high thermal demand applications. In concert with our SmartHeat® technology, we have enhanced both the heater efficiency and thermal transfer characteristics of our tips,

IPC-7527

Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
Contextual Info: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2

transistor working principle

Abstract: weller tinning rf transistor 320 SN62 SN63 Cold solder joint gold embrittlement METCAL MX-500 circuit metcal iron
Contextual Info: RF Power Innovations 310 320-6160 AN3025 Transistor Mounting and Soldering Brett Kelley and Eric Hokenson 18 December 2003 Introduction There are three basic steps recommended to mount and solder RF power transistors into a circuit. 1. Solder pre-tin the transistor leads.

AN3025

Abstract: transistor working principle tinning METCAL MX-500 circuit free transistor SN62 SN63 GC Electronics 108109 metcal transistor free
Contextual Info: Application Note AN3025 Transistor Mounting and Soldering Rev. 3 Introduction There are three basic steps recommended to mount and solder RF power transistors into a circuit. Solder pre-tin the transistor leads Mount the transistor Solder the transistor leads to the circuit trace

74397

Abstract: steinel HG3002LCD steinel "air gun" APR-5000 AN828 AR5000 SiE802DF Simple test MOSFET Procedures PolarPAK WEIGHT
Contextual Info: AN828 Vishay Siliconix Working With PolarPAK In-Lab Soldering and Re-Working Recommendations By Kandarp Pandya INTRODUCTION ® PolarPAK , a new-generation Vishay Siliconix power MOSFET package, offers double-sided cooling with a metal surface on both the top and bottom sides. As it

SLMA002

Abstract: "x-ray machine" DCA56 land pattern for tSOP56 powerPAD SMTC-0118 750-W METCAL removal iron TQFP64 land package IPC-7525 SLMA004
Contextual Info: Application Report SLMA002E – November 1997 – Revised January 2010 PowerPAD Thermally Enhanced Package Steven Kummerl. ABSTRACT

Contextual Info: MFR-2200 Series Dual Simultaneous Output Soldering and Rework System One power supply. Two simultaneous ports. Three hand-pieces to choose from. New MFR Series with SmartHeat Power and Control The MFR-2200 Series Soldering and Rework Systems provide a high power, flexible solution for production soldering, touch-up soldering and SMD rework. SmartHeat®

SLMA002

Abstract: land pattern for tSOP56 double sided pcb, thermal via "x-ray machine" TQFP64 land package cut template DRAWING tsop20 TQFP100 TQFP64 TSOP24
Contextual Info: PowerPAD Thermally Enhanced Package TECHNICAL BRIEF: SLMA002 Mixed Signal Products Semiconductor Group 21 November 1997 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information

Contextual Info: Desoldering Braid & Desoldering Wick | Quick Braid, Sea Braid, One-Step Home About Us Material Safety Data Sheets FEATURED PRODUCTS CROSS REFERENCE PRODUCT OVERVIEW Compliance Documents Distributors Sales Reps Page 1 of 3 Request a Sample Contact Us REPLACEMENT SOLDERING TIPS

Application Note 27703

Abstract: Allegro
Contextual Info: SOLDERING OF SURFACE-MOUNT DEVICES Leaded through-hole products Allegro leaded products are designed to be through-hole soldered into printed wiring boards. They will withstand the temperature excursions experienced during hand soldering, reflow soldering, or wave soldering as long as normal, good

transistor smd marking mx

Abstract: desoldering MFR-PS2200 smd transistor marking MX metcal
Contextual Info: Welcome to OK International - Soldering, Rework and Fume Extraction System Home Literature Where to Buy Page 1 of 3 Languages >> Home > Products & Applications > Soldering/Desoldering > MFR-2200 Series > MFR-2240 MFR-2210, MFR-2220, MF

Contextual Info: Welcome to OK International - Soldering, Rework and Fume Extraction System Home Literature Where to Buy Page 1 of 7 Languages >> Home > Products & Applications > Soldering/Desoldering > MFR-2200 Series > MFR-2211 MFR-2210, MFR-2220, MF

Allegro

Contextual Info: Application Note 26009* APPLICATIONS INFORMATION SOLDERING OF SURFACE-MOUNT DEVICES Leaded through-hole products Allegro leaded products are designed to be through-hole soldered into printed wiring boards. They will withstand the temperature excursions experienced during hand soldering,

hallsensor application

Abstract: hallsensor HALL-SENSOR ALLEGRO Hallsensor
Contextual Info: Application Note 27703C APPLICATIONS INFORMATION SOLDERING OF THROUGH-HOLE HALL-SENSOR DEVICES Through-hole products Allegro leaded Hall-effect products package codes K, KA, LL, U, and UA are designed to be through-hole soldered into printed wiring boards. They will withstand the temperature

Contextual Info: Application Note 26009 APPLICATIONS INFORMATION SOLDERING OF SURFACE-MOUNT DEVICES Leaded through-hole products Allegro leaded products are designed to be through-hole soldered into printed wiring boards. They will withstand the temperature excursions experienced during hand soldering,

AN2222

Abstract: footprint mlf FOOTPRINT PCB Kester AN-2222 metcal
Contextual Info: Application Note AN2222 Flex-Pod Soldering Guide Author: Matt Basinger Associated Project: No Associated Part Family: CY8C21x34, CY8C29x66 Abstract This Application Note provides instructions on soldering PSoC Flex-Pods. Suggested Shop Supplies o Solder o

hallsensor 120

Abstract: hall-sensor hallsensor Application Note 27703 ALLEGRO Hallsensor an+503+hall+sensor 50G+HALL+SENSOR Hall+sensor+44e
Contextual Info: Application Note 27703.2* APPLICATIONS INFORMATION SOLDERING OF SURFACE-MOUNT HALL-SENSOR DEVICES Manual soldering Manual soldering of surface-mount products is not recommended! Hall sensors are sensitive to thermal shock. When the soldering temperature is high enough, and the transmission of

hallsensor

Abstract: hallsensor application hallsensor 120 metcal ALLEGRO Hallsensor 50G+HALL+SENSOR
Contextual Info: Application Note 27703.2 APPLICATIONS INFORMATION SOLDERING OF SURFACE-MOUNT HALL-SENSOR DEVICES Manual soldering Manual soldering of surface-mount products is not recommended! Hall sensors are sensitive to thermal shock. When the soldering temperature is high enough, and the transmission of

qfn 32 land pattern

Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern
Contextual Info: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and

weller ds100

Abstract: weller ec1000 weller ec 4000
Contextual Info: EASYBRAID CO. DESOLDERING BRAID 1 Easy Braid Co. is a manufacturer of desolder wick with an emphasis on continuing advancement in desoldering technology. Established in 1989, Easy Braid Co. quickly achieved widespread recognition in the rework/repair industry with its competitive pricing and innovative

anaren divider

Abstract: metcal 5000
Contextual Info: Model 2425FB50-50E Rev A Ultra Low Profile Filter Balun 50Ω to 100Ω Balanced Description The 2425FB50-50E is a low cost, low profile sub-miniature unbalanced to balanced transformer designed for differential inputs and output locations on next generation wireless chipsets in an easy to use surface mount package covering