MELF "LAND PATTERN Search Results

RC 6123

Abstract: MELF "Land Pattern" BEYSCHLAG IPCSM-782 ipc-SM-782 MELF pad layout RC-6123 Resistor 0102 MELF resistor size 0204
Contextual Info: MELF Resistor Products General Information Product Dimensions MMU 0102 Style MMA 0204 MMB 0207 CMA 0204 DIN - Size CECC - Size 0102 0204 0207 RC 2211 RC 3715 RC 6123 D mm max 1,1 max 1,4 max 2,2 D1 mm min 1,06 / max 1,1 min 1,25 / max 1,4 min 2,0 / max 2,2

Contextual Info: Metal Film MELF Resistors NFR Series FEATURES • SURFACE MOUNT IN SIZES 0102 0805 , 0204 (1406) AND 0207 (2410) • AVAILABLE IN PRECISION TOLERANCE AND TC (TO ±0.1% TOL. AND ±10PPM TC) • ALL SIZES ARE AVAILABLE IN TAPE/REEL FOR AUTOMATIC MOUNTING • SAC REFLOW SOLDERABLE (+260°C FOR 3 SECONDS)

Contextual Info: Metal Film MELF Resistors NFR Series FEATURES • SURFACE MOUNT IN SIZES 0102 0805 , 0204 (1406) AND 0207 (2410) • AVAILABLE IN PRECISION TOLERANCE AND TC (TO ±0.1% TOL. AND ±10PPM TC) • ALL SIZES ARE AVAILABLE IN TAPE/REEL FOR AUTOMATIC MOUNTING • SAC REFLOW SOLDERABLE (+260°C FOR 3 SECONDS)

NFR0207ZOTRF

Abstract: NFR0102
Contextual Info: Metal Film MELF Resistors NFR Series FEATURES • SURFACE MOUNT IN SIZES 0102 0805 , 0204 (1406) AND 0207 (2410) • AVAILABLE IN PRECISION TOLERANCE AND TC (TO ±0.1% TOL. AND ±10PPM TC) • ALL SIZES ARE AVAILABLE IN TAPE/REEL FOR AUTOMATIC MOUNTING • SAC REFLOW SOLDERABLE (+260°C FOR 3 SECONDS)

Contextual Info: Metal Film MELF Resistors NFR Series FEATURES • SURFACE MOUNT IN SIZES 0204 1406 , 0207 (2410) AND 0309 (3414) • AVAILABLE IN PRECISION TOLERANCE AND TC (TO ±1% TOL. AND ±25PPM TC) • ALL SIZES ARE AVAILABLE IN TAPE/REEL FOR AUTOMATIC MOUNTING • SAC REFLOW SOLDERABLE (+260°C FOR 3 SECONDS)

NFR0204ZO

Contextual Info: Metal Film MELF Resistors NFR Series FEATURES • SURFACE MOUNT IN SIZES 0102 0805 , 0204 (1406), 0207 (2410) AND 0309 (3414) • AVAILABLE IN PRECISION TOLERANCE AND TC (TO ±1% TOL. AND ±25PPM TC) • ALL SIZES ARE AVAILABLE IN TAPE/REEL FOR AUTOMATIC MOUNTING

Contextual Info: Metal Film MELF Resistors NFR Series FEATURES • SURFACE MOUNT IN SIZES 0102 0805 , 0204 (1406), 0207 (2410) AND 0309 (3414) • AVAILABLE IN PRECISION TOLERANCE AND TC (TO ±1% TOL. AND ±25PPM TC) • ALL SIZES ARE AVAILABLE IN TAPE/REEL FOR AUTOMATIC MOUNTING

Contextual Info: 【CSRV Series】 Metal Film Precision MELF Resistor •Features －AEC-Q200 Compliance －Thin film technology －Excellent overall stability －Sn termination on Ni barrier layer －Tight tolerance down to ±0.1% －Extremely low TCR down to ±10 PPM/°C

CSRV0204

Contextual Info: 【CSRV Series】 Metal Film Precision MELF Resistor •Features －AEC-Q200 Compliance －Thin film technology －Excellent overall stability －Sn termination on Ni barrier layer －Tight tolerance down to ±0.1% －Extremely low TCR down to ±10 PPM/°C

Y1 SOT-23

Abstract: MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8
Contextual Info: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523

ipc-SM-782

Abstract: MELF "Land Pattern" MiniMELF land pattern land pattern for TO 92 MELF pad layout SOD-323 land pattern ipc SMB SMC IPCSM-782 sod323 wave soldering
Contextual Info: Suggested Pad Layout Based on IPC-SM-782 Figure 1 Dimensions MiniMELF QuadroMELF MicroMELF MELF SOD-323 SOD-123 SMA SMB SMC Z 3.0 4.8 6.3 3.75 4.9 6.6 6.7 9.3 G 1.4 2.1 3.3 1.05 2.5 1.5 1.8 4.4 X 1.5 1.7 2.7 0.65 0.7 1.7 2.3 3.3 Y 0.8 ref. 1.3 ref. 1.5 ref.

SOT-563 SOT-666

Abstract: SOD523 land pattern IPC-7351A IPC SOD 323F SOT-95 SOD-323 land pattern SOT-353 G5 Y3 SOT23 DFN1006-3 DFN1006H4-2
Contextual Info: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523

IPC-7351A

Abstract: MiniMELF land pattern land pattern for TSsOP 16 land pattern for TSSOP sot89 land pattern PowerDI3333-8 SOD-323 land pattern y1 SOT23 DFN2020 SOD523 land pattern
Contextual Info: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523

IPC-SM-782

Abstract: IPCSM-782 IPC-782 IPC782 SOJ 44 PCB land MELF "Land Pattern" land pattern for TSOP J-Lead, QFP ceramic
Contextual Info: Number One Systems IPC-SM-782 Library Supplementary Surface Mount Library for Easy-PC For Windows IPC-SM-782 Library The optional IPCSM-782 library contains supplementary component IPC782.CML and PCB symbol (IPC782.PSL) libraries for use with any variant of Easy-PC For Windows,

IPC-7351A

Abstract: AP02001 DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP
Contextual Info: Suggested Pad Layout Based on IPC-7351A Figure 1 Dimensions DFN1006-2 MiniMELF MELF SOD-323 SOD-123 SOD-523 SMA SMB SMC 9.3 Z 1.1 4.8 6.3 3.75 4.9 2.3 6.5 6.7 G 0.3 2.1 3.3 1.05 2.5 1.1 1.5 1.8 4.4 X 0.7 1.7 2.7 0.65 0.7 0.8 1.7 2.3 3.3 Y 0.4 1.3 1.5 1.35

ah 471k capacitor

Abstract: perfect 1000w amplifier AH-50 33 OHM eia0603 RJ73 MELF-0102 EBG PCS 60 500w power amplifier stereo EIA1210 marking EBG
Contextual Info: TOKEN ULTRA PRECISION RESISTORS Metal Film / Surface Mount / Wire Wound Token Electronics Industry Co., Ltd. Taiwan: No. 137, Sec. 1, Chung Shin Rd., Wu Ku Hsiang, Taipei Hsien, Taiwan, R.O.C TEL: 886-2-2981 0109; FAX: 886-2-2988 7487 China: 12F, Zhongxing Industry Bld., Chuangye Rd., Nanshan District, Shenzhen, Guangdong

Contextual Info: TOKEN ULTRA PRECISION RESISTORS Metal Film / Surface Mount / Wire Wound Token Electronics Industry Co., Ltd. Taiwan: No. 137, Sec. 1, Chung Shin Rd., Wu Ku Hsiang, Taipei Hsien, Taiwan, R.O.C TEL: 886-2-2981 0109; FAX: 886-2-2988 7487 China: 12F, Zhongxing Industry Bld., Chuangye Rd., Nanshan District, Shenzhen, Guangdong

Contextual Info: CARBON FILM RESISTOR MELF & MINI-MELF CM, CML TYPE • Features ‧SMD enabled structure. ‧Conformal Multi-layer Coating Against Humidity ‧Lower current noise than thick film flat chip resistor ‧High solder ability due to specially plated electrodes

Melf composition

Contextual Info: Recommended Soldering Techniques Recommended Soldering Techniques by David B. Hutchins, Senior Applications Engineer Introduction The soldering process is the means by which electronic components are mechanically and electrically connected into the circuit assembly. Adhering to good soldering practices will preserve the inherent reliability of the original

Contextual Info: SMD Power Resistors Special Patented design eliminates need for leaded components. 4-terminal • Flexible J-bend terminations patented eliminate the need for leaded components and reduce the chance of solder-joint break­ age due to thermal expansion and vibration.

Contextual Info: METAL FILM RESISTOR MELF & MINI-MELF MM, MML TYPE • Features ‧SMD enabled structure. ‧Conformal Multi-layer Coating Against Humidity ‧Tight tolerance down to ±0.1% ‧Extremely low TCR down to ±10 PPM/°C ■ Applications ‧Telecommunication ‧Medical Equipment

Contextual Info: METAL FILM RESISTOR MELF & MINI-MELF MM, MML TYPE • Features ‧SMD enabled structure. ‧Conformal Multi-layer Coating Against Humidity ‧Tight tolerance down to ±0.1% ‧Extremely low TCR down to ±10 PPM/°C ■ Applications ‧Telecommunication ‧Medical Equipment

Contextual Info: Recommended Soldering Techniques Introduction The soldering process is the means by which electronic components are mechanically and electrically connected into the circuit assembly. Adhering to good soldering practices will preserve the inherent reliability of the original

Contextual Info: 5 i •rt- 1 9 ' i SMD Power Resistors Special Patented design eliminates need for leaded components. 4-terminal • Flexible J-bend terminations (patented eliminate the need for leaded components and reduce the chance of solder-joint break­ age due to thermal expansion and vibration.