MEGTRON 6 Search Results

MEGTRON 6

Abstract: AN-672
Contextual Info: Transceiver Link Design Guidelines for High-Gbps Data Rate Transmission 2013.02.15 AN-672 Subscribe Feedback As transceiver data rates increase and the unit interval time UI decrease, the end-to-end link design of a transceiver channel becomes increasingly critical to the overall performance of the link. Consider an Altera

molex sfp 1 gbps

Abstract: SFF-8431
Contextual Info: 2013.07.10 AN-689 High Speed Channel Design Using the SFF-8431 Protocol Subscribe Feedback This document enables engineers to design high speed channels conforming to the SFF-8431 standard. It includes a case study of a board that was designed to highlight best practices for SFF-8431 compliant channel

MEGTRON 6

Abstract: CEI-11G ADC digital calibration time interleaved 56Gs ADC 30Ghz Fujitsu Batboard VLSI datasheet for DAC and ADC otu 4 MEGTRON VLSI for DAC and ADC
Contextual Info: Reality Check: Challenges of mixed-signal VLSI design for high-speed optical communications Mixed-signal VLSI for 100G and beyond  100G optical transport system  Why single-chip CMOS?  So what is so difficult ?  CHAIS ADC  On-chip noise coupling

Contextual Info: Stratix V GT Device Design Guidelines 2014.01.07 AN-681 Subscribe Send Feedback Altera’s Stratix V devices provide four duplex transceiver GT channels, each capable of a serial data rate up to 28.05 Gbps. Stratix V GT devices support chip-to-chip and chip-to-module applications. The GT

Contextual Info: Stratix V GT Device Design Guidelines 2013.03.29 AN-681 Subscribe Feedback Altera’s Stratix V devices provide four duplex transceiver GT channels, each capable of a serial data rate up to 28.05 Gbps. Stratix V GT devices support chip-to-chip and chip-to-module applications. The GT

Nelco 4000-13

Abstract: MEGTRON 6 370HR isola 370HR Nelco 4000-13 si Isola FR406 Rogers 4350B stackup 4000-13EP FR4 Prepreg
Contextual Info: PCB Stackup Design Considerations for Altera FPGAs AN-613-1.0 Application Note This application note presents an overview of the PCB stackup construction and material selection criteria. It discusses the important material parameters that influence the electrical

he807

Abstract: he804 SOCAPEX HE804 YL 69 moisture HE801-HE807 socapex 127 H 17 HE804 connector HE804 amphenol amphenol HiLinX HE801
Contextual Info: Board Level Interconnect products Amphenol 2 "NQIFOPM
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#PBSE
-FWFM Interconnect products Table of Contents About Amphenol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Board Level

Abstract: AMPHENOL HE 508 amphenol HiLinX ute 93-424
Contextual Info: Board Level Interconnect products Amphenol 2 "NQIFOPM
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#PBSE
-FWFM Interconnect products Table of Contents About Amphenol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4