MECHANICAL DESIGN NOTES Search Results

makrolon IR black

Abstract: makrolon 2805 makrolon 45-601 IR receiver TSOP RECEIVER TSOP IR tsop ir receiver lexan transparent bayer material 17074
Contextual Info: Mechanical Design Notes Vishay Semiconductors Mechanical Design Notes There are many aspects in the design of an appliance, which will affect the IR sensitivity of the receiver such as window size, window material, distance of the receiver to the window or to a light guide.

BGA 256 PACKAGE power dissipation

Abstract: capacitance in BGA package BGA 256 PACKAGE thermal resistance bga Crack Intel BGA Solder
Contextual Info: Technical Notes December 8, 1997 Revision 1.0 THERMAL, ELECTRICAL AND MECHANICAL CONSIDERATIONS IN APPLYING BGA TECHNOLOGY TO A DESIGN ABSTRACT This document briefly discusses the thermal, mechanical and electrical design considerations associated with using ball-grid array components.

usb mouse

Abstract: usb eeprom programmer schematic CY3649 mechanical mouse MOUSE mouse wheel wheel "8 bit RISC Microprocessor" CY3649-XXXV CY3083-DP48
Contextual Info: Low Cost USB Mouse Reference Design PRODUCT OVERVIEW Download complete reference design at www.cypress.com/usb Cypress offers a complete solution for developing an opto-mechanical 3 button wheel mouse at the minimum overall cost. This Reference Design is a

AMU-9110

Abstract: PIN DIAGRAM OF RJ45 IP CAMERA ip camera AMU-9111 CMOS Camera Module connector CMOS Camera Module ROHS "4 pin" camera connector LTC4267 4 pin wafer connector video Camera Module model
Contextual Info: AMU-9110 IP camera Encoder Module Electrical Mechanical Design Guide Version 2.2 Revision History Revision Number Change 1.0 Add important design notes 1.1 Remove all “Original Company” related wording 2.0 AMU-9110 version hardware upgrade to Version 2.0

hand movement based fan speed control

Contextual Info: InnovationS in thermal management DESIGN SERVICES and rapid prototyping E CREATE CREAT Through its computational facilities and thermal/fluids laboratories, ATS specializes in providing thermal analysis, mechanical and design services for telecommunications,

Contextual Info: InnovationS in thermal management DESIGN SERVICES and rapid prototyping E CREATE CREAT Through its computational facilities and thermal/fluids laboratories, ATS specializes in providing thermal analysis, mechanical and design services for telecommunications,

Contextual Info: Safety Restraints Interconnection System Ferrite initiator connectors FFM90-1/FFM90-2 Right angle version with mechanical locking latch CPA Features Mating design: • Mechanical CPA Connector position assurance latch type Terminal system: • RCS (Round contact system),

Contextual Info: Cannon Fiber Optics Design Guide Specification Comparison PHD SuperLC Fiber Optic Connector System LC Compliant Fiber Optic Connector System to meet Telecordia GR-326-CORE • Superior mechanical environment stability/durability\ Secondary Lock prevents mechanical release in high

PIN DIAGRAM OF RJ45 IP CAMERA

Abstract: LED IR for Tx, RX pair BT.656 camera module bullet camera Ir sensor 3 pin details AMU-9401 Ir sensor pin details CMOS IR camera module camera module IC model 4 pin wafer connector video
Contextual Info: AMU-9401 / AMU-9411Megapixel IP camera module package Electrical Mechanical Design Guide Version 1.0 Revision History Revision Number 1.0 Change AMU-9401 / AMU-9411 introduction Table of Contents 1. 2. 3. 4. Product definition Module Connector Interface Mechanical Requirements

Contextual Info: TSC80251G1D TSC80251G1D Extended 8–bit Microcontroller with Serial Communication Interfaces Design Guide – 25 Sept 1997 MATRA MHS Rev. A – 25 Sept 1997 TSC80251G1D Introduction to TSC80251G1D 1 Design Information 2 Electrical and Mechanical Information

7400 pin configuration drawing

Abstract: intel xeon 7400 series 7400 series list 7400 flotherm TDP 243 Y G751 T0146 CEK604 mPGA604
Contextual Info: Intel Xeon® Processor 7400 Series Thermal/Mechanical Design Guidelines September 2008 Document Number: 320337, Revision -001 Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information.

C5088

Abstract: flotherm mPGA604 604-pin POTOMAC intel xeon socket 604 G751 prescott
Contextual Info: Dual-Core Intel Xeon® Processor 7100 Series Thermal/Mechanical Design Guidelines August 2006 Reference Number: 314955 Revision: 001 Notice: This document contains information on products in the design phase of development. The information here is subject to

EP80579

Abstract: loop heat pipes heat pipes 32-1055 Sicc intel liquid cooling MULTIPLE EFFECT EVAPORATOR heat exchanger process TRANSFORM fanless motherboard
Contextual Info: White Paper Chris Gonzales and Hwan Ming Wang Thermal/Mechanical Engineers Intel Corporation Thermal Design Considerations for Embedded Applications December 2008 321055 Thermal Design Considerations for Embedded Applications Executive Summary Embedded Applications differ from the typical desktop, server and mobile

gunn diode ghz s-parameter

Abstract: impatt diode impatt C band FET transistor s-parameters fet dro 10 ghz x-band dro california bearing ratio test DRO lnb 25 MHz $ pin Crystal Oscillators THrough hole type Dielectric Resonator Oscillator DRO
Contextual Info: California Eastern Laboratories APPLICATION NOTE AN1035 Design Considerations for a Ku-Band DRO in Digital Communication Systems ABSTRACT the parts for the DRO and mechanical assembly will be presented. While the design proposed might not yield the optimum design solution for all DBS applications, it does introduce a few important DRO design techniques that can be applied to other high frequency communication systems.

BZT52C10T

Contextual Info: BZT52C2V0T - BZT52C24T SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • Ultra-Small Surface Mount Package Flat Lead Package Design for Low Profile and High Power Dissipation. Lead Free By Design/RoHS Compliant Note 1 "Green" Device (Note 2)

hand movement based fan speed control

Abstract: MPGA478 SOCKET intel fan motherboard mPGA478 circuit Sunon fan 4-wire DC copper core heatsink mpga478 FC-mPGA4 pentium4 478 avc fan 12V Pentium4
Contextual Info: R Intel Pentium® 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines Design Guide February 2004 Document Number: 300564-001 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

intel 845

Abstract: MOTHERBOARD INTEL 845 INTEL 845 sdr 82801BA ATA-33 T-710 intel pin grid array package intel 82845 foxconn motherboard
Contextual Info: R Intel 845 Chipset Thermal and Mechanical Design Guidelines for SDR Design Guide January 2002 Document Number: 298586-002 R Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual

845GL

Abstract: 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard
Contextual Info: R 3 Intel 845G/845GL/845GV Chipset Thermal Design Guide Intel® 82845G/82845GL/82845GV GMCH Thermal and Mechanical Design Guidelines October 2002 Document Number: 298655-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

82801DB

Abstract: ICH4 intel 82801DB thermal specifications ICH4 Datasheet 82870P2 ATA-33 P64H2 82870P2 64-bit Hub 2 bga thermal cycling reliability
Contextual Info: R Intel 82801DB I/O Controller Hub 4 ICH4 Design Guide Intel® 82801DB ICH4 Thermal and Mechanical Design Guidelines October 2002 Document Number: 298651-002 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

intel 965 motherboard circuit diagram

Abstract: intel 775 motherboard diagram 775 MOTHERBOARD CIRCUIT diagram D975XBX2 intel lga775 MOTHERBOARD pcb CIRCUIT diagram LGA775 SOCKET PIN LAYOUT hand movement based fan speed control computer motherboard circuit diagram lga775 PC MOTHERBOARD intel 815 circuit diagram LGA775 socket design guidelines
Contextual Info: Intel Core 2 Extreme QuadCore Processor QX6800Δ Thermal and Mechanical Design Guidelines — Adopting Intel® Advanced Liquid Cooling Technology Reference Design April 2007 Document Number: 316854-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES, EXPRESS OR

MARKING code 46 sot 563

Contextual Info: NOT RECOMMENDED FOR NEW DESIGN USE DMP56D0UV DMP57D5UV DUAL P-CHANNEL ENHANCEMENT MODE MOSFET Features • • • • • • • Mechanical Data • • Low On-Resistance ESD Protected Gate to 1kV Low Input Capacitance Fast Switching Speed Lead Free By Design/RoHS Compliant Note 2

sot26 marking

Abstract: Marking Code 34n
Contextual Info: NOT RECOMMENDED FOR NEW DESIGN USE DMG6402LVT DMG6402LDM N-CHANNEL ENHANCEMENT MODE MOSFET Features Mechanical Data • • • • • • • • • • • Low RDS ON Low Input Capacitance Fast Switching Speed Low Input/Output Leakage Lead Free By Design/RoHS Compliant (Note 1)

peci specification

Abstract: E7300 flotherm TMDG X7350 tiger 3180* intel
Contextual Info: Dual-Core Intel Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal/Mechanical Design Guidelines September 2007 Document Number: 318085-001 Notice: This document contains information on products in the design phase of development. The information here is subject to

Contextual Info: ENGINEERING DEFINITIONS AND DESIGN NOTES Theory of Operation Crystal resonators derive their basic frequency selective capability from a mechanical vibration resulting from a piezoelectric effect in the material. Although the theoretical analysis of this piezoelectric effect is a relatively com plex