EP80579
Abstract: loop heat pipes heat pipes 32-1055 Sicc intel liquid cooling MULTIPLE EFFECT EVAPORATOR heat exchanger process TRANSFORM fanless motherboard
Contextual Info: White Paper Chris Gonzales and Hwan Ming Wang Thermal/Mechanical Engineers Intel Corporation Thermal Design Considerations for Embedded Applications December 2008 321055 Thermal Design Considerations for Embedded Applications Executive Summary Embedded Applications differ from the typical desktop, server and mobile
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ep805799l5408ep80579loop heat pipes+8heat pipes32-1055siccintel liquid coolingmultiple effect evaporatorheat exchanger processtransformfanless motherboard
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