MDP1646D04 Search Results

Contextual Info: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • TTL/ECL translater and SCSI-BUS signal terminator schematics available • 0.190" 4.83 mm maximum seated height • Rugged, molded case construction • Low temperature coefficient (- 55 °C to + 125 °C),

208E

Abstract: MDP1646D04 MDP 16
Contextual Info: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83 mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55 °C to + 125 °C , MDP 1645: ± 100 ppm/°C, MDP 1646: ± 250 ppm/°C

Contextual Info: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • TTL/ECL translater and SCSI-BUS signal terminator schematics available • 0.190" 4.83 mm maximum seated height • Rugged, molded case construction • Low temperature coefficient (- 55 °C to + 125 °C),

Contextual Info: MDP 45, 46 www.vishay.com Vishay Dale 厚膜电阻网络，双排，模压 DIP Thick Film Resistor Networks, Dual-In-Line, Molded DIP 特性 • • • • • • • • • 可采用 TTL/ECL 传输和 SCSI-BUS 信号终端结构 0.190" 4.83 mm 最大座高

Contextual Info: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • TTL/ECL translater and SCSI-BUS signal terminator schematics available • 0.190" 4.83 mm maximum seated height • Rugged, molded case construction • Low temperature coefficient (- 55 °C to + 125 °C),

Contextual Info: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • TTL/ECL translater and SCSI-BUS signal terminator schematics available • 0.190" 4.83 mm maximum seated height • Rugged, molded case construction • Low temperature coefficient (- 55 °C to + 125 °C),

208E

Abstract: MDP1646D04 MDP 16
Contextual Info: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55°C to + 125°C , MDP 1645: ± 100ppm/°C, MDP 1646: ± 250ppm/°C

Contextual Info: MDP 45, 46 www.vishay.com Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • TTL/ECL translater and SCSI-BUS signal terminator schematics available Available • 0.190" 4.83 mm maximum seated height • Rugged, molded case construction

208E

Abstract: MDP1646D04 MDP 16
Contextual Info: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83 mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55 °C to + 125 °C , MDP 1645: ± 100 ppm/°C, MDP 1646: ± 250 ppm/°C

A016 SMD

Abstract: M8340102K smd marking code A008 smd A018 MDP1603 a015 SMD AC 31061 10k resistor array SIP a014 SMD transistor a015 SMD
Contextual Info: VISHAY I N T E R T E C H N O L O G Y , I N C . INTERACTIVE data book rEsIStor ARRays and Networks vishay DALE vsD-db0011-0410 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents

Contextual Info: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55°C to + 125°C , MDP 1645: ± 100ppm/°C, MDP 1646: ± 250ppm/°C