MCL B 345 Search Results
MCL B 345 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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anzac mixers
Abstract: MCL TFM-2 "RF Mixers" ANZAC anzac md-108 anzac MD-109 Anzac relay md 5-t Anzac MD-141 Anzac T-1000 pin configuration for FP 1016
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OCR Scan |
D-400* Sb42177 DC-1000 anzac mixers MCL TFM-2 "RF Mixers" ANZAC anzac md-108 anzac MD-109 Anzac relay md 5-t Anzac MD-141 Anzac T-1000 pin configuration for FP 1016 | |
ECHO schematic diagramsContextual Info: Preliminary GS8170LW18/36/72C-333/300/250 18Mb Σ1x1 Late Write SigmaRAM SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Late Write mode • Pipeline read operation • JEDEC-standard SigmaRAM™ pinout and package |
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GS8170LW18/36/72C-333/300/250 209-Bump 209-bump, 8170LW18 ECHO schematic diagrams | |
U8 100E
Abstract: BGA2002 ECHO schematic diagrams GS8170DD36C-300 GS8170DD36C-333
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GS8170DD18/36C-333/300/250 209-Bump 209-bump, 209-Pin GS8170DD18C-333I GS8170DD18C-300I GS8170DD18C-250I U8 100E BGA2002 ECHO schematic diagrams GS8170DD36C-300 GS8170DD36C-333 | |
Contextual Info: Preliminary GS8170EW18/36/72C-333/300/250 18Mb Σ1x1 Early Write SigmaRAM SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Early Write mode • User-configurable pipeline and flow through operation |
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GS8170EW18/36/72C-333/300/250 209-Bump 8170EW18 | |
ECHO schematic diagrams
Abstract: flip chip bga 0,8 mm
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GS8170DW18/36/72C-333/300/250 209-Bump 209-bump, 8170DW18 ECHO schematic diagrams flip chip bga 0,8 mm | |
Contextual Info: GS8170LW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package |
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GS8170LW36/72C-333/300/250/200 209-Bump 209-bump, 144Mb 8170LW18 | |
GS8170DW72C-250
Abstract: GS8170DW72C-300 GS8170DW72C-333 GS8170DW72C-333I
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GS8170DW36/72C-333/300/250/200 209-Bump 209-bump, 8170W18 GS8170DW72C-250 GS8170DW72C-300 GS8170DW72C-333 GS8170DW72C-333I | |
GS8170DW36C-200
Abstract: GS8170DW36C-250 GS8170DW36C-300 GS8170DW36C-333
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GS8170DW36/72C-333/300/250/200 209-Bump 209-bump, 8170LW18 GS8170DW36C-200 GS8170DW36C-250 GS8170DW36C-300 GS8170DW36C-333 | |
Contextual Info: Preliminary GS8170DW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp CMOS I/O Double Late Write SigmaRAM 250 MHz – 350 MHz 1.8 V VDD 1.8 V I/O Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package |
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GS8170DW36/72AC-350/333/300/250 209-Bump 209-bump, 144Mb 8170DWxxA | |
GS8170LW72AC-300I
Abstract: GS8170LW36AC-300I GS8170LW36AC-250I GS8170LW72AC-250I GS8170LW36AC-350 GS8170LW36AC-250 GS8170LW36AC-300 GS8170LW36AC-333
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GS8170LW36/72AC-350/333/300/250 209-Bump 209-bump, 36nology 8170LWxxA GS8170LW72AC-300I GS8170LW36AC-300I GS8170LW36AC-250I GS8170LW72AC-250I GS8170LW36AC-350 GS8170LW36AC-250 GS8170LW36AC-300 GS8170LW36AC-333 | |
GS8170LW36AC-250
Abstract: GS8170LW36AC-300 GS8170LW36AC-333 GS8170LW36AC-350
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GS8170LW36/72AC-350/333/300/250 209-Bump 209-bump, 8170LWxxA GS8170LW36AC-250 GS8170LW36AC-300 GS8170LW36AC-333 GS8170LW36AC-350 | |
Contextual Info: Preliminary GS8170LW36/72AC-350/333/300/250 18Mb Σ1x1Lp CMOS I/O 209-Bump BGA Commercial Temp Industrial Temp 250 MHz – 350 MHz 1.8 V VDD 1.8 V I/O Late Write SigmaRAM Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package |
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GS8170LW36/72AC-350/333/300/250 209-Bump 209-bump, GS817xx72C-300T. 8170LWxxA | |
Contextual Info: GS8170LW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.8 V I/O Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package |
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GS8170LW36/72AC-350/333/300/250 209-Bump 209-bump, packag0LW36/72AC-350/333/300/250 8170LWxxA | |
ECHO schematic diagrams
Abstract: GS8170DD36 GS8170DD36C-250 GS8170DD36C-300 GS8170DD36C-300I GS8170DD36C-333 GS8170DD36C-333I
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GS8170DD36C-333/300/250/200 209-Bump 209-bump, 144Mb 8170DD18 ECHO schematic diagrams GS8170DD36 GS8170DD36C-250 GS8170DD36C-300 GS8170DD36C-300I GS8170DD36C-333 GS8170DD36C-333I | |
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GS8170DW36AC-300
Abstract: GS8170DW36AC-333 GS8170DW36AC-350
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GS8170DW36/72AC-350/333/300/250 209-Bump 209-bump, GS817xx72C-300T. 8170DWxxA GS8170DW36AC-300 GS8170DW36AC-333 GS8170DW36AC-350 | |
Contextual Info: High IP3 Frequency Mixer HJK-481H+ Level 17 LO Power +17 dBm 345 to 480 MHz Maximum Ratings Operating Temperature Features -45°C to 85°C Storage Temperature LO Power +19 dBm RF Power +20 dBm CASE STYLE: TTT881 PRICE: $10.95 ea. QTY. (1-9) • high IP3, 32 dBm typ. |
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HJK-481H+ TTT881 2002/95/EC) 14dBm 14dBm | |
Contextual Info: Preliminary GS8170LW36/72C-333/300/250/200 18Mb Σ1x1Lp CMOS I/O 209-Bump BGA Commercial Temp Industrial Temp 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O Late Write SigmaRAM Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package |
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GS8170LW36/72C-333/300/250/200 209-Bump 209-bump, 72and 8170LW18 | |
Contextual Info: High IP3 Frequency Mixer HJK-481H+ Level 17 LO Power +17 dBm 345 to 480 MHz Maximum Ratings Operating Temperature Features -45°C to 85°C Storage Temperature LO Power +19 dBm RF Power +20 dBm CASE STYLE: TTT881 PRICE: $10.95 ea. QTY. (1-9) • high IP3, 32 dBm typ. |
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HJK-481H+ TTT881 | |
GS8170DD36
Abstract: GS8170DD36AC-200 GS8170DD36AC-250 GS8170DD36AC-300
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GS8170DD36C-333/300/250/200 209-Bump 209-bump, GS8170DD36AC-300I GS8170DD36AC-250I GS8170DD36AC-200I GS817xx72C-300T. GS8170DD36 GS8170DD36AC-200 GS8170DD36AC-250 GS8170DD36AC-300 | |
Contextual Info: GS8170DW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp CMOS I/O Double Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.8 V I/O Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package |
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GS8170DW36/72AC-350/333/300/250 209-Bump 209-bump, pi0DW36/72AC-350/333/300/250 8170DWxxA | |
Contextual Info: GS8171DW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp HSTL I/O Double Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.5 V I/O Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package |
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GS8171DW36/72AC-350/333/300/250 209-Bump 209-bump, 8171DWxxA | |
GS8171DW72AC-300I
Abstract: GS8171DW72AC-250I GS8171DW36AC-300I GS8171DW72AGC-350 GS8171DW36AC-250I GS8171DW72AC-250 GS8171DW72AC-300 GS8171DW72AC-333 GS8171DW72AC-350 GS8171DW72AC-350I
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GS8171DW36/72AC-350/333/300/250 209-Bump 209-bump, 8171DWxxA GS8171DW72AC-300I GS8171DW72AC-250I GS8171DW36AC-300I GS8171DW72AGC-350 GS8171DW36AC-250I GS8171DW72AC-250 GS8171DW72AC-300 GS8171DW72AC-333 GS8171DW72AC-350 GS8171DW72AC-350I | |
HJK-481H
Abstract: ED135 HJK-481 TTT881 M1202 41310 M12-022 44910 HJK-4
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HJK-481H+ TTT881 2002/95/EC) 14dBm HJK-481H ED135 HJK-481 TTT881 M1202 41310 M12-022 44910 HJK-4 | |
U9ANContextual Info: Product Preview GS832418A B/C /GS832436A(B/C)/GS832472A(C) 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs 119- and 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable (x36 and x72) |
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GS832418A /GS832436A /GS832472A 209-Pin x36/x72 832418A U9AN |