MAXIM PACKAGE MARKING Search Results

maxim CODE TOP MARKING

Abstract: maxim TOP MARKING maxim package marking UCSP maxim assembly of code without underfill Solder paste stencil life INCOMING INSPECTION solder paste MAXIM Assembly Locations
Contextual Info: 1 Maxim Integrated Products Assembly and Packaging Group Application Notes Wafer-Level Ultra-Chip-Scale Package 1.0 Introduction to Ultra-Chip-Scale Package UCSP The packaging technology in the Ultra-Chip-Scale Package (UCSP) enables the integrated circuit

LT1460BCS3-10

Abstract: marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D

sumitomo g770

Abstract: G770* G770 mold compound Sumitomo 1000 JESD47E G770 mold compound G770* sumitomo G770 APP4132 Maxim date code DS2431 SUYIN 4 pin battery contact connector G770 sumitomo
Contextual Info: Maxim > App Notes > 1-Wire devices Keywords: SFN, attachment, IC package, 1-Wire, 1Wire, calibration, authentication, monitoring, accessory, consumable, electromechanical contact Nov 26, 2007 APPLICATION NOTE 4132 Attachment methods for the electro-mechanical SFN package

sumitomo g770

Abstract: SUYIN 4 pin battery contact connector G770 mold compound G600 mold compound G770* G770 mold compound Sumitomo 1000 G770* sumitomo SUYIN battery connector smt DS2431 SUYIN BATTERY CONNECTOR maxim CODE TOP MARKING
Contextual Info: Maxim > App Notes > 1-Wire Devices Keywords: SFN, attachment, IC package, 1-Wire, 1Wire, calibration, authentication, monitoring, accessory, consumable, electro-mechanical contact Nov 26, 2007 APPLICATION NOTE 4132 Attachment Methods for the Electro-Mechanical SFN Package

AN3397

Abstract: marking pbsn usop recommended land pattern for soic 8pin 50K potentiometer maxim package marking APP3397 DS1804 118MIL potentiometer with DIP package
Contextual Info: Maxim/Dallas > App Notes > AMPLIFIER AND COMPARATOR CIRCUITS WIRELESS, RF, AND CABLE DIGITAL POTENTIOMETERS Nov 11, 2004 Keywords: DS1804, digital potentiometer APPLICATION NOTE 3397 Clarification of DS1804 Ordering Information and Package Marking The DS1804 digital potentiometer is available in a wide variety of types, options, and package configurations.

maxim CODE TOP MARKING

Abstract: Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code
Contextual Info: Maxim > App Notes > 1-Wire Devices General Engineering Topics Keywords: flip, chip, scale, wafer, level, package, packages, packaging, wlp, ucsp, fchip, wlcsp, pb free, rohs, topmark, bump, die Apr 18, 2007 APPLICATION NOTE 4002 Understanding Flip-Chip and Chip-Scale Package Technologies and

117450

Abstract: TO253 lt941 ltc947 1624i LT 129i5 sm 2178a LT1510CGN sot23 1303 ltbw 83
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D D ADI/PMI — l — — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic) D D D YB QB XB L — — DD, DE, DN, DP

Contextual Info: SIEMENS BAS 16-02W Silicon Sw itching Diode Prelim inary data • For high-speed switching applications Type Marking Ordering Code Pin Configuration Package BAS 16-02W 3 Q 62702-A1239 1=A SCD-80 2 =C Maxim um Ratings Param eter Sym bol Diode reverse voltage

SMD marking Z12

Abstract: marking CM smd Z12 Z33 SMD z39 smd bidirectional zener diodes zener smd marking 51 CMZ30 zener smd marking smd z13
Contextual Info: • CM Z12 Series SMD Package Appearance Maxim um Ratings Characteristic Symbol Rating Unit Power Dissipation P 2 W Junction Temperature Tj 150 Storage Temperature Tstg -4 0 to 150 •c •c = 3^ I Zener Characteristics ¿ener impedance Measurement rd (O)

Contextual Info: Product specification 1SV247 Features Very small-sized package facilitates high-density mounting and permits 1SV247-applied equipment to be made smaller. Small interterminal capacitance C=0.23pF typ . Small forward series resistance (rs=5 typ). Absolute Maxim um Ratings Ta = 25

maxim package marking

Abstract: MARKING A3 1SS300
Contextual Info: Diodes SMD Type ULTRA HIGH SPEED SWITCHING APPLICATIONS 1SS300 Features Small package Low forward voltage :VF 3 = 0.92 V(Typ) Fast reverse recovery time Small total capacitance :trr = 1.6 ns (Typ) :CT = 2.2 pF(Typ) Absolute Maxim um Ratings Ta = 25 Param eter

Contextual Info: Product specification 1SS300 Features Small package Low forward voltage :VF 3 = 0.92 V(Typ) Fast reverse recovery time Small total capacitance :trr = 1.6 ns (Typ) :CT = 2.2 pF(Typ) Absolute Maxim um Ratings Ta = 25 Param eter Sym bol Rating Unit V RM 85 V

Contextual Info: Product specification 1SS373 SOD-523 +0.05 0.3-0.05 Unit: mm 1.2 +0.1 -0.1 Features +0.05 0.8-0.05 Small Package + +0.1 0.6-0.1 - Low forward voltage :VF = 0.23V TYP. IF = 5mA +0.1 1.6-0.1 +0.05 0.1-0.02 0.07max 0.77max Absolute Maxim um Ratings Ta = 25 Characteristic

center tap voltage transformer

Abstract: EPC3115S-3
Contextual Info: Push-Pull Low Power Transformer EPC3115S-X ELECTRONICS INC. • Designed for use with Maxim Max253 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • Switching Frequency : 350 KHz • 8 Pin SOIC PCMCIA Package

Contextual Info: Push-Pull Low Power Transformer ELECTRONICS INC. EPC3115S-X • Designed for use with Maxim Max253 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • 8 Pin SOIC PCMCIA Package • Very Low Core Loss

Contextual Info: Push-Pull Low Power Transformer ELECTRONICS INC. EPC3117S-X • Designed for use with Maxim Max845 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • 8 Pin SOIC PCMCIA Package • Very Low Core Loss

center tap voltage transformer

Contextual Info: Push-Pull Low Power Transformer EPC3117S-X ELECTRONICS INC. • Designed for use with Maxim Max845 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • Switching Frequency : 250 KHz-1 Mhz • 8 Pin SOIC PCMCIA Package

Contextual Info: Push-Pull Low Power Transformer EPC3117S-X ELECTRONICS INC. • Designed for use with Maxim Max845 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • Switching Frequency : 250 KHz-1 Mhz • 8 Pin SOIC PCMCIA Package

center tap transformer 11

Abstract: center tap voltage transformer
Contextual Info: Push-Pull Low Power Transformer EPC3117S-X ELECTRONICS INC. • Designed for use with Maxim Max845 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • Switching Frequency : 250 KHz-1 Mhz • 8 Pin SOIC PCMCIA Package

epc3115s-3

Abstract: center tap voltage transformer
Contextual Info: Push-Pull Low Power Transformer EPC3115S-X ELECTRONICS INC. • Designed for use with Maxim Max253/Max3535E • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • Switching Frequency : 350 KHz • 8 Pin SOIC PCMCIA Package

maxim package marking

Abstract: maxim package "marking" 1ss373
Contextual Info: Diodes SMD Type HIGH SPEED SWITCHING APPLICATION 1SS373 SOD-523 +0.05 0.3-0.05 Unit: mm 1.2 +0.1 -0.1 Features +0.05 0.8-0.05 Small Package + +0.1 0.6-0.1 - Low forward voltage :VF = 0.23V TYP. IF = 5mA +0.1 1.6-0.1 +0.05 0.1-0.02 0.07max 0.77max Absolute Maxim um Ratings Ta = 25

center tap voltage transformer

Contextual Info: Push-Pull Low Power Transformer EPC3117S-X ELECTRONICS INC. • Designed for use with Maxim Max845 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • Switching Frequency : 250 KHz-1 Mhz • 8 Pin SOIC PCMCIA Package

2SC1621

Abstract: transistor marking 9D
Contextual Info: SEC SILICON TRANSISTOR 2SC1621 EIJ BKmmvm » HIGH SPEED SW ITCHING NPN SILICON EPITAXIAL TRANSISTOR M IN I MOLD FEATURE PACKAGE DIMENSIONS in millimeters • High Speed : t stg = 2 0 ns M A X . 2.8 ±0.2 -8 do 0.65 ±8:j 1.5 +I o ABSOLUTE MAXIM UM RATINGS

ic ir 2103

Abstract: 2SC4175 MARKING B2 TRANSISTOR MARKING 3D
Contextual Info: DATA SHEET SILICON TRANSISTOR - - 2SC4175 'I „ • »' HIGH SPEED SWITCHING NPN SILICON EPITAXIALTRANSISTOR FEATURE PACKAGE DIMENSIONS • in m illim eters High Speed : t stg = 20 ns M A X . 2.1 + 0.1 1.25 + 0.1 ABSOLUTE MAXIM UM RATINGS M axim um Voltages and Current T a = 25 °C