MAX551BCUB Search Results

x551ma

Abstract: MAX551
Contextual Info: 19-1260; Rev 0; 10/97 +3V/+8V, 12-Bit, Serial, Multiplying DACs in 10-Pin fiMAX Package The SPI /QSPI™ and Microwire™ -compatible 3-wire serial interface saves board space and reduces power dissipation com pared with parallel-interface devices. The MAX551/MAX552 feature double-buffered interface

Contextual Info: 19-1260; Rev 0; 10/97 +3V/+5V, 12-Bit, Serial, Multiplying DACs in 10-Pin µMAX Package The MAX551/MAX552 are available in an 8-pin DIP package or a space-saving 10-pin µMAX package. The µMAX package provides an asynchronous clear CLR input that clears all DAC registers when pulled to GND,

MAX551

Abstract: MAX551ACPA MAX551ACUB MAX551AEPA MAX551AEUB MAX551BCPA MAX551BCUB MAX551BEPA MAX552 MAX4167
Contextual Info: 19-1260; Rev 1; 9/02 +3V/+5V, 12-Bit, Serial, Multiplying DACs in 10-Pin µMAX Package The MAX551/MAX552 are available in an 8-pin DIP package or a space-saving 10-pin µMAX package. The µMAX package provides an asynchronous clear CLR input that clears all DAC registers when pulled to GND,

Contextual Info: 19-1260; Rev 1; 9/02 +3V/+5V, 12-Bit, Serial, Multiplying DACs in 10-Pin µMAX Package The SPI /QSPI™ and MICROWIRE™-compatible 3wire serial interface saves board space and reduces power dissipation compared with parallel-interface devices. The MAX551/MAX552 feature double-buffered

MAX6809

Abstract: ST 9727 st 9635 st 9548 12x12 bga thermal resistance MAX232CWE 9846B MAX232 integrated chips 9836 maxim iso 9717
Contextual Info: November 1999 Surface-Mount Devices Reliability Report This report presents reliability data for Maxim’s surface-mount devices, including the results of extensive reliability stress tests performed solely on epoxy surface-mount packages since 1995. Maxim’s surface-mount packages are subjected to standard

MAX551ACPA

Abstract: MAX551 MAX551ACUB MAX551AEPA MAX551AEUB MAX551BCPA MAX551BCUB MAX551BEPA MAX552 MAX4167
Contextual Info: 19-1260; Rev 0; 10/97 +3V/+5V, 12-Bit, Serial, Multiplying DACs in 10-Pin µMAX Package _Applications Automatic Calibration Gain Adjustment Transducer Drivers Process-Control I/O Boards Digitally Controlled Filters Motion-Controlled Systems

X551M

Contextual Info: 19-1260; Rev O; W /97 J V iA X A J V \ +3VI+SV, 12-B it, S erial, M u ltip lyin g DACs in 10-Pin pNÌAX T The SPI /QSPI™ and M icrow ire™ -com patible 3-wire serial interface saves board space and reduces power dissipation com pared with parallel-interface devices.