MATERIALS FOR BGA Search Results

AUS308

Abstract: AUS308 thermal kester 256 AUS303 AUS-308 aus5 kester 245 solder wire Lead Free reflow soldering profile BGA
Contextual Info: Challenges in Manufacturing Reliable Lead-Free and RoHS-Compliant Components WP-CHMFGRELLDFR-2.0 White Paper The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that

Contextual Info: 7 Series FPGAs SelectIO Resources User Guide UG471 v1.3 October 31, 2012 The information disclosed to you hereunder (the "Materials") is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

FBG676

Abstract: FFG1156
Contextual Info: 7 Series FPGAs Packaging and Pinout Product Specification UG475 v1.9 February 14, 2013 The information disclosed to you hereunder (the "Materials") is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

chotherm

Abstract: ASTM d792 ASTM D412 D149 D2240 D257 D374 D412 D624 D792
Contextual Info: INSULATORS • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs

Contextual Info: Chip Quik Solder Spheres for BGAs - Product Sheet Page 1 of 2 Product Description View Cart Product Name: Chip Quik Solder Spheres for BGAs Product Details CHIP QUIK Solder Spheres for BGAs • CHIP QUIK® BGA solder spheres are manufactured from virgin materials to meet or exceed the

T443

Abstract: Chomerics T710 D257 D374 D792 T310 T725 chomerics 77 PARKER HANNIFIN parker
Contextual Info: TECHNICAL BULLETIN • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs

KJR9022E

Abstract: KJR4013E GTO thyristor driver KJR651 KJR9061E silicone low volatile potting G1821 KJR-9010E KJR651E KJR9060E
Contextual Info: Shin-Etsu Liquid Coating Materials for Electronic Devices KJR Series Junction Coating Resins Liquid Type Silicone & Polyimide Silicone for Electronic, Electric and Optical Devices Main Features ●Ultra High Purity ●High Thermal Stability ●High Electrical Stability

TCR500

Abstract: SiCr wire bond 60k4
Contextual Info: PMC Passive Micro Components OVERVIEW PMC thin-film technology offers comprehensive materials and processes combinations allowing electronic designers superior space saving, tolerance and signal integrity for semi custom designs in the MHz to GHz spectrum.

JEDEC J-STD-033A

Abstract: AMD Package moisture LBA399 F-1249 J-STD-033A J-STD-020B J-STD-033 ASTM 1249 MIL-PRF-81705D MIL-I-18835
Contextual Info: u Chapter 12 Dry Packing CHAPTER 12 DRY PACKING Introduction Testing for Moisture Sensitivity Dry Packing Process and Materials Handling Dry Packed Products Storing Dry Packed Products AMD’s Moisture Sensitive Products by Package Type Packages and Packing Publication

intel mch 945gc

Abstract: bga dye pry UL1439 945gc PCM45F atx specification v2.2 BGA heatsink compressive force 437-pin foxconn motherboard 945gc datasheet
Contextual Info: Intel Atom Processor 300Δ Series Thermal and Mechanical Design Guidelines — Supporting Nettop Platform for ‘08 September 2008 Document Number: 320530-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED “AS IS” WITH NO WARRANTIES, EXPRESS OR

antimony trioxide epoxy molding

Abstract: material declaration semiconductor package Material declaration organic materials oxygen material declaration amd 104 c1k
Contextual Info: ‹ Chapter 4 Package Materials Material Declaration Data Sheets. AMD has created material data sheets for some of its more popular package designs. These data sheets are organized as follows: • Suface-Mount Array Packages Š PBGA, page 6-19 • Surface-Mount Leaded Packages

N5P22

Abstract: Hifn Security Platform HIFN 7854-PB4 PAR64 REQ64 mppc 01 "ESP" hifn lzs hifn mppc -lzs
Contextual Info: 7854 Network Security Processor Data Sheet 7854 Network Security Processor Hifn supplies the Internet’s most important raw materials for the creation of intelligent and secure networks: compression, encryption, and flow classification. This is central to the growth of the Internet, helping to make

micro Sim Card connector

Abstract: QUALCOMM FLIP CHIP ASSEMBLY LICC avx 2004 circuit of smart hearing aid varistor diode spice model transient time extract MSM6000 qualcomm 7200 smd w2h 100v varistor K30 diode 25PH 800
Contextual Info: AVX is the technology leader in the Passive electronic component and connector markets. Each year AVX Corporation accepts the challenge of helping Design Engineers create superior products for their customers. Our team of innovators around the world, utilize cutting edge research, design expertise and materials

capacitor 630v

Abstract: make SMPS inverter welding machine Kyocera Kinseki CRYSTAL CX smd 0306 package KT2520 electronic passive components catalog AVX vARICON qpl ic laptop motherboard skycap LCD inverter 94v 0
Contextual Info: AVX is the technology leader in the Passive electronic component and connector markets. Each year AVX Corporation accepts the challenge of helping Design Engineers create superior products for their customers. Our team of innovators around the world, utilize cutting edge research, design expertise and materials

GR-78-CORE

Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
Contextual Info: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with

mt 1389 de

Abstract: srfe 1164 SAB 8048 P 220 SM 590 SRFE 1126 pin DIAGRAM OF IC 7400 SH7785 datasheet tea 1601 t ca2 fn 144 manual R8A77850 mt 1389
Contextual Info: REJ09B0261-0100 32 SH7785 Hardware Manual Renesas 32-Bit RISC Microcomputer SuperH RISC Engine Family SH7780 Series Rev.1.00 Revision Date: Jan. 10, 2008 Notes regarding these materials 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate

TL3301EP100QG

Abstract: SI570BAB0000544DG LVCMOS18 XC7VX690T-2FFG1761C M/SI570BAB0000544DG 0b1010001
Contextual Info: VC709 Evaluation Board for the Virtex-7 FPGA User Guide UG887 v1.3 April 30, 2014 The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

PTD08D021W

Abstract: MT8JTF12864HZ-1G6G1 LVCMOS18 M88E1111 ADV7511KSTZ virtex 5 lcd display controller Marvell alaska 88E1111 ba37 diode
Contextual Info: VC707 Evaluation Board for the Virtex-7 FPGA User Guide UG885 v1.4 May 12, 2014 The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

82915g motherboard

Abstract: Intel 915G 82915GV 915Gv BGA PACKAGE thermal profile lga775 intel 82915gl PENTIUM4 intel 915gv components 915PL ICH6
Contextual Info: R Intel 915G/915GV/915GL/910GL Express Chipset Thermal Design Guide For the Intel® 82915G/82915GV/82915GL, 82910GL Graphics and Memory Controller Hub GMCH February 2005 Document Number: 301469-006 R THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES,

Contextual Info: PHYSICAL LAYER PRODUCT BACKPLANE PRODUCT VSC1129 5 – 6.5 Gb/s Quad Backplane Transceiver & Concentrator BENEFITS: Increase Data Throughput and Extend Life of Existing Backplanes Allows 6.5 Gb/s Transmission Over Backplanes Designed for 1 Gb/s Save Cost by Avoiding Upgrade to Expensive Connectors and Board Materials

4572 IC 8PIN

Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Contextual Info: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines

2Z802-009

Abstract: C46655-001 82801FB 82801FB ICH6 Intel ICH6 ich6 82801FB intel MOTHERBOARD pcb design in ICH6 ich6 sata Intel 82801fr
Contextual Info: R Intel I/O Controller Hub 6 ICH6 Family Thermal Design Guide For the Intel® 82801FB ICH6 and 82801FR ICH6R I/O Controller Hubs January 2005 Document Number: 302362-002 R THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES,

100 PIN "PGA" ALTERA DIMENSION

Contextual Info: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.

TRANSISTOR REPLACEMENT GUIDE d882

Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Contextual Info: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,