MATERIAL DECLARATION MURATA Search Results
MATERIAL DECLARATION MURATA Result Highlights (2)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| UE62B46200S021 | Amphenol Communications Solutions | 1x4 OSFP cage with stainless steel material | |||
| UE62B46230S021 | Amphenol Communications Solutions | 1x4 OSFP cage with stainless steel material |
MATERIAL DECLARATION MURATA Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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panasonic ce certificate
Abstract: Iec384-14 Si3034PCI-EVB AN-1701 NCB fuse AN17 Si3014 Si3021 Si3034
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si3034pci-evbul1950panasonic ce certificateiec384-14+6 | |
TMPN3150
Abstract: TMPN3150B1F TMPN3150B1AFG triac tag 86 845t encoder pinout TRIAC TAG 137 h2 M toshiba tmpn3150 TMPN3120FE5MG robot smoke detector abstract MOTOROLA Neuron Chip
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tmpn3150/3120tmpn3150tmpn3150b1ftmpn3150b1afg+7 | |
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Contextual Info: January 2011 ENW89810K5CF Bluetooth QD ID:B014433 End Product Listing FCC ID: T7VEBMU IC ID: 216QEBMU PAN1311-SPP In f i n e o n’s BlueMoonUniversal Platform Wireless Modules User’s Manual Hardware Description Revision 1.1 November 2011 ENW89811xxxF |
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enw89810k5cfb014433216qebmupan1311-spp+3 | |
PAN1321-SPP
Abstract: Pan1321 PAN1311 ENW89811K4CF T8753-2 B014433 t8753 marking code maxim label PLL Synthesizer Modules, panasonic Infineon Specific HCI Commands bluetooth
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enw89811k4cfb014433216qebmupan1321-spp+8 | |
RF6650
Abstract: LQM2HPN2R2MG0L material declaration taiyo yuden smps dc-dc circuits Material Declaration MURATA
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rf6650650mads110620lqm2hpn2r2mg0l+3 | |
LQW18ANR16Contextual Info: 11.3 Gbps, Active Back-Termination, Differential VCSEL Driver ADN2530 FEATURES GENERAL DESCRIPTION Up to 11.3 Gbps operation −40°C to +100°C operation Very low power: ISUPPLY = 65 mA Typical 26 ps rise/fall times Full back-termination of output transmission lines |
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adn2530back-termination871sfp-sff8472lqw18anr16 | |
Material Declaration MURATAContextual Info: RF6650 POWER MANAGEMENT IC Package: 8-Bump WLCSP, 3x3 Array, 1.58mm x1.57mm Features VPWR C3 A1 RF6650 AGND High Efficiency >95% Transient Response <25s 650mA Load Current Capability Programmable Output Voltage Bypass FET |
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rf6650650mab440-57-5ds110620+1 | |
MSL260G
Abstract: MSL-260-G D0806 R0807 T0803 D0802 D0807 RDD0804 D0808 5 pin reset ic ARB
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pci90600x000000000x000000020x00000004+15 | |
1N4148/2 pin connector sip
Abstract: ACT04 MOTOROLA 1N4148 D0805 pal programming sw dip-3 80960CA 15 pin through hole d sub connector 16v8h DIODE MOTOROLA B33 D0805
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pci90600x000000000x000000020x00000004+14 | |
PBA31308
Abstract: PBA 31308 T8753 Infineon Specific HCI Commands bluetooth LDA312G7313F-237 Infineon_Specific_HCI_Commands LGA voiding T8753-2 BST-2450 2450 MHz low noise amplifier MWO circuit
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pba31308pba 31308t8753infineon specific hci commands bluetooth+6 | |
CC2560 command
Abstract: schematic msp430 cc2560 hy 214 digital meter PAN1315ETU PAN13XX CC2560
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pan1315enw89818c2jfds-1315-2400-102667-enw-89818c2jf+7 | |
panasonic dimension 74 television
Abstract: 3DH5 CC2560 command schematic msp430 cc2560 Example code for touch pad interface using msp430 hy 214
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pan1315enw89818c2jfds-1315-2400-102mays-1315-2400-102+6 | |
PAN1323
Abstract: PAN1325A panasonic dimension 74 television LDA212G3110K CC2560 command Example code for touch pad interface using msp430 lot date code panasonic chip resistor ENW89828A2JF PAN1323ETU PAN1316
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ds-13xx-2400-102pan13xxpan1323pan1325a+8 | |
216Q-1315
Abstract: PAN132X
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pan13xxds-13xx-2400-102b019784th00-102+2 | |
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Contextual Info: MRF24J40MD/ME 2.4 GHz IEEE Std. 802.15.4 RF Transceiver Module with PA/LNA Features: Operational: • IEEE Std. 802.15.4™ Compliant RF Transceiver • Supports ZigBee , MiWi™ Development Environment Proprietary Wireless Networking Protocols • 4-Wire Serial Peripheral Interface SPI with |
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mrf24j40md/memrf24j40mbmrf24j40mcmrf24j40md+1 | |
AC4868
Abstract: Johnson Components 135-3711-822 S467FL-6-RMM-868S AC4868-250
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74lvc244ac4868johnson components 135-3711-822s467fl-6-rmm-868s+1 | |
PAN1325AContextual Info: CLASSIFICATION PRODUCT SPECIFICATION SUBJECT CLASS 1 or 2 BLUETOOTH MODULE CUSTOMER’S CODE PAN13XX Core Specification PANASONIC’S CODE See Chapter 28. Ordering Information No. DS-13xx-2400-102 REV. 3.70 PAGE 1 of 60 DATE 31.05.2013 Specification for Production |
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pan13xxds-13xx-2400-102b019784pan1325a | |
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Contextual Info: RF5198 RF51983 V 1950 MHz WCDMA Linear Power Amplifier Module 3V 1950MHZ W-CDMA LINEAR POWER AMPLIFIER MODULE IM NC 16 15 14 13 RF IN 1 27.5dBm Linear Output Power 42% Peak Linear Efficiency -41dBc ACLR @ ±5MHz Integrated Power Detector HSDPA Capable |
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rf51983rf51981950mhz16-pin+3 | |
CE0536
Abstract: EA1 SMD EA1 transistor smd GRM235Y5V226Z10 B-868-addLINK-NB-A-MC dongle diagram flow design MARKING EA1 PEAK tray drawing radio circuit diagram with pcb layout printed antenna 868
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ce0536ea1 smdea1 transistor smdgrm235y5v226z10+6 | |
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Contextual Info: MRF24J40MC Data Sheet 2.4 GHz IEEE Std. 802.15.4 RF Transceiver Module with PA/LNA and External Antenna Connector 2011 Microchip Technology Inc. Preliminary DS75002A Note the following details of the code protection feature on Microchip devices: • |
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mrf24j40mcds75002ads75002a-page | |
RFA-02-5-F7H1-70B-150
Abstract: DS39776 RFA-02-5-F7H1 C code for 2.4 GHZ rf transmitter using PIC UPG2179TB-E4-A MRF24J40MC material declaration vishay RFA-02 MRF24J40MCT OA3MRF24J40MC
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mrf24j40mcds75002ads75002a-pagerfa-02-5-f7h1-70b-150+8 | |
005-0139-01D
Abstract: FT3150 P20 FT-X1 FT-X1 X2 ftt-10a FT3150 ft3120 FCC-801-M3-16A Echelon FTT-10A ISO 14230
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005-0139-01dft3150 p20ft-x1ft-x1 x2+6 | |
schematic msp430 cc2560
Abstract: Bluetooth Module CC2560 CC2560 PAN1325 ENW89818C2JF MSP430 MSP-EXP430F5438 PAN1315 2450AT43B100 CC256
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pan1315enw89818c2jfds-1315-2400-102schematic msp430 cc2560+7 | |
54MBPS
Abstract: RF5117 RF5117PCK-410
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rf51171800mhz2800mhz17dbm+6 | |