BGA PROFILING
Abstract: fine BGA thermal profile M21131 hot air bga M21151 M21161 M21141G reflow hot air BGA M21136 M21151V
Contextual Info: 211xx-APP-002-A April 2006 SMT BGA Ball Grid Array Eutectic Solder Balls Application Note Products Affected: M21131, M21131V, M21136, M21141G4, M21141G5, M21151, M21151V, M21156, M21161G4, M21161G5 Introduction The objective of this application note is to provide the basic SMT design and process requirements necessary to
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211xx-app-002-am21131m21131vm21136+12m21141g4m21141g5m21151m21151vm21156m21161g4bga profilingfine bga thermal profilehot air bgam21161m21141greflow hot air bga
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M21131
Abstract: M21141G
Contextual Info: 72x72 4.25 Gbps Crosspoint Switch with Amplif-Eye Signal Conditioning M21141G4 4.25 Gbps Performance as a Drop-inReplacement for the M21131, 3.2 Gbps 72x72 Crosspoint Switch The M21141G4, designed for today’s demanding SAN, enterprise, datacom, and telecom applications, is a lowpower CMOS, high-speed 72x72 crosspoint switch with
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M21141G
Abstract: M21141
Contextual Info: 72x72 5.0 Gbps Crosspoint Switch with Amplif-Eye Signal Conditioning M21141G5 5.0 Gbps Performance as a Drop-inReplacement for the M21131, 3.2 Gbps and M21141G4, 4.25 Gbps 72x72 Crosspoint Switches The M21141G5, designed for today’s demanding SAN, enterprise, datacom, and telecom applications, is a lowpower CMOS, high-speed 72x72 crosspoint switch with
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72x72m21141g5m21131m21141g4+321161g4-brf-001-am21141gm21141
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