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TC4511BP
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Toshiba Electronic Devices & Storage Corporation
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CMOS Logic IC, BCD-to-7-Segment Decoder, DIP16 |
Datasheet
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G825M10301D59HR
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Amphenol Communications Solutions
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Pin Header 2.0mm Pitch STR Surfacemount, 2x5Pin, 30u\\ GOLD, LCP, 3.2mm*2.0mm_7.04mm, Removed#9POS, T&R, W/CAP |
PDF
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86092645113785ELF
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Amphenol Communications Solutions
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DIN Right Angle Header Solder-to-Board Style C 64 ways, MIL Class |
PDF
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76745-113-22LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 22 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10127819-14511LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 100u\\ Matte Tin plating, Natural Color, 14 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
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