M03 3 PIN Search Results

D20011

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC DIP-20P-M03 EIAJ code :∗DIP020-P-0300-3 20-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-20P-M03 20-pin plastic DIP (DIP-20P-M03) +0.20 24.59 –0.30

Contextual Info: DUAL IN-LINE PACKAGE 20 PIN PLASTIC DIP-20P-M03 EIAJ code : ∗DIP020-P-0300-3 20-pin plastic DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-20P-M03 20-pin plastic DIP (DIP-20P-M03) +0.20 24.59 –0.30 .968 +.008 –.012 INDEX-1

FPT-160P-M03

Abstract: QFP160-P-2828-3 80 m03
Contextual Info: QUAD FLAT L-LEADED PACKAGE 160 PIN PLASTIC FPT-160P-M03 EIAJ code : ∗QFP160-P-2828-3 160-pin plastic QFP Lead pitch 0.65mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.80mm FPT-160P-M03

LCC 18 Pin Package

Abstract: QFJ018-P-R285-3
Contextual Info: PLASTIC LEADED CHIP CARRIER 18 PIN PLASTIC LCC-18P-M03 EIAJ code : ∗QFJ018-P-R285-3 Lead pitch 50mil Package width x package length 285 × 425mil Lead shape J bend Sealing method Plastic mold 18-pin plastic QFJ PLCC (LCC-18P-M03) 18-pin plastic QFJ (PLCC)

968 led

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC To Top / Package Lineup / Package Index DIP-20P-M03 EIAJ code :∗DIP020-P-0300-3 20-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-20P-M03 20-pin plastic DIP

QFP120

Abstract: 120p
Contextual Info: QUAD FLAT L-LEADED PACKAGE 120 PIN PLASTIC FPT-120P-M03 EIAJ code : ∗QFP120-P-2828-3 120-pin plastic QFP Lead pitch 0.80mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.80mm FPT-120P-M03

nec 16312

Abstract: 2SC5800 NE851M03 NE851M03-T3 S21E nec 9701
Contextual Info: NEC's NPN SILICON TRANSISTOR NE851M03 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M03 NEW MINIATURE M03 PACKAGE: – Small transistor outline – Low profile / 0.59 mm package height – Flat lead style for better RF performance IDEAL FOR ≤ 3 GHz OSCILLATORS

nec 16312 transistor

Abstract: cce 7100 BF 6591 sis 968 nec 16312 kf 203 transistor NE851M03 16312 transistor SiS 671 transistor KF 507
Contextual Info: NEC's NPN SILICON TRANSISTOR NE851M03 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M03 NEW MINIATURE M03 PACKAGE: – Small transistor outline – Low profile / 0.59 mm package height – Flat lead style for better RF performance IDEAL FOR ≤ 3 GHz OSCILLATORS

nec 16312 transistor

Abstract: Nec K 872 cce 7100 nec 16312 BJT IC Vce bjt npn m03 AT 1004 S12 hfe 4793 Laser Diode 808 2 pin 1000 mw transistor KF 507
Contextual Info: NEC's NPN SILICON TRANSISTOR NE851M03 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M03 NEW MINIATURE M03 PACKAGE: – Small transistor outline – Low profile / 0.59 mm package height – Flat lead style for better RF performance • IDEAL FOR ≤ 3 GHz OSCILLATORS

FPT-160P-M03

Abstract: QFP160-P-2828-3
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC To Top / Package Lineup / Package Index FPT-160P-M03 EIAJ code :∗QFP160-P-2828-3 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing

transistor c 6073

Abstract: 0809 af kf 982 c 4235 transistor npn BF 6591 2SC5786 BJT BF 331 SiS 671 AN1026 NE894M03
Contextual Info: NEC's NPN SILICON TRANSISTOR NE894M03 FEATURES • OUTLINE DIMENSIONS Units in mm MINIATURE M03 PACKAGE: – Small transistor outline – Low profile / 0.59 mm package height – Flat lead style for better RF performance • IDEAL FOR > 3 GHz OSCILLATORS

FPT-120P-M03

Abstract: QFP120
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M03 EIAJ code :∗QFP120-P-2828-3 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing

FPT-160P-M03

Abstract: QFP160-P-2828-3
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC FPT-160P-M03 EIAJ code :∗QFP160-P-2828-3 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Mounting height

QFP-120P

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC FPT-120P-M03 EIAJ code :∗QFP120-P-2828-3 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Length of flat

Contextual Info: Accessories Connectors and cables Motor supply cable, 8-pin mating conntector Part number Z 165.M01 Motor supply cable 1.5 m, 8-pin mating conntector Z 165.M02 Motor supply cable 3 m, 8-pin mating connector Z 165.M03 Motor supply cable 10 m, 8-pin mating connector

Contextual Info: Accessories Connectors and cables Z 165.M Part number Z 165.M01 Motor supply cable 1.5 m, 8-pin mating conntector Z 165.M02 Motor supply cable 3 m, 8-pin mating connector Z 165.M03 Motor supply cable 10 m, 8-pin mating connector Suitable for Dimensions 1 www.baumer.com/motion

mb87017

Abstract: mb4514a mb4514b MB87017A MT8870 MB87084 FPT-48P-M02 DIP-22P-M03 MB4507A MB4514
Contextual Info: F U J I T S U MI C ROE L E C T R ONI C S 0101010100000202020201000001 E3E D • 3 7 4 e17tjS OQ1SÔ41 1 T-ys-ö/ ASSP D TM F Dialer Device Number MB4507A Function Oscillator Frequency MHz Supply Current (mA) Package Alternate Source 3.58 20 to 105 DIP-22P-M03

ST7FAUDIO

Abstract: st7faudioar9 VN1160 VNH5180 L4969URD VNH3SP30-E st VN1160 l5150 VB027SP6 ST7FAUDIO-AR9
Contextual Info: Car body solutions Selection guide May 2008 STMicroelectronics - May 2008 - Printed in Italy - All rights reserved The STMicroelectronics corporate logo is a registered trademark of the STMicroelectronics group of companies. All other names are the property of their respective owners.

ST7FAUDIO

Abstract: st7faudioar9 VN1160 st26025a ST26025 CAR ALTERNATOR REGULATOR testing guide L9777B st VN1160 vnh5180 L9777
Contextual Info: Automotive-grade semiconductor devices Selection guide July 2008 Analog Power MEMS Memories Microcontrollers www.st.com/automotive Moving towards a zero-defect capability STMicroelectronics applies an automotive-grade policy designed to deliver products which meet the

bjt npn m03

Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE681M03 OUTLINE DIMENSIONS um ts in mm FEATURES • PACKAGE OUTLINE M03 NEW M03 PACKAGE: pi • Smallest transistor outline package available • Low profile/0.59 mm package height • Flat lead style for better RF performance

m03 transistor

Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE685M03 FEATURES • OUTLINE DIMENSIONS Units in mm PACKAGE OUTLINE M03 NEW M03 PACKAGE: • Smallest transistor outline package available • Low profile/0.59 mm package height • Flat lead style for better RF performance

4 ghz transistor

Contextual Info: PRELIMINARY DATA SHEET NEC NPN SILICON TRANSISTOR NE688M03 OUTLINE DIMENSIONS Units in mm FEATURES • • PACKAGE OUTLINE M03 NEW M03 PACKAGE: • Smallest transistor outline package available • Low profile/0.59 mm package height • Flat lead style for better RF performance

80 m03

Abstract: m03 transistor
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE856M03 FEATURES OUTLINE DIMENSIONS Units in mm PACKAGE OUTLINE M03 NEW M03 PACKAGE: • Smallest transistor outline package available • Low profile/0.59 mm package height • Flat lead style for better RF performance

CHIP transistor 348

Contextual Info: PRELIMINARY DATA SHEET NEC NPN SILICON TRANSISTOR NE680M03 FEATURES • OUTLINE DIMENSIONS Units in mm PACKAGE OUTLINE M03 NEW M03 PACKAGE: • Smallest transistor outline package available • Low profile/0.59 mm package height • Flat lead style for better RF performance