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TLP2762B
|
|
Toshiba Electronic Devices & Storage Corporation
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Photocoupler (photo-IC output), 10 Mbps, 5000 Vrms, SO6L |
Datasheet
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91276-236HLF
|
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
77313-827-62LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 62 Positions |
PDF
|
|
|
71276-210HLF
|
|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
77313-127-62LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 62 Positions |
PDF
|
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